IT967908B - Contatto metallo semiconduttore di piccola estensione superfi ciale - Google Patents

Contatto metallo semiconduttore di piccola estensione superfi ciale

Info

Publication number
IT967908B
IT967908B IT29727/72A IT2972772A IT967908B IT 967908 B IT967908 B IT 967908B IT 29727/72 A IT29727/72 A IT 29727/72A IT 2972772 A IT2972772 A IT 2972772A IT 967908 B IT967908 B IT 967908B
Authority
IT
Italy
Prior art keywords
metal contact
small surface
surface extension
semiconductor metal
semiconductor
Prior art date
Application number
IT29727/72A
Other languages
English (en)
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19712148658 external-priority patent/DE2148658C3/de
Application filed by Siemens Ag filed Critical Siemens Ag
Application granted granted Critical
Publication of IT967908B publication Critical patent/IT967908B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
    • H01L21/28575—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising AIIIBV compounds
    • H01L21/28587—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising AIIIBV compounds characterised by the sectional shape, e.g. T, inverted T
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
    • H01L21/28575—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising AIIIBV compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
    • H01L21/28575—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising AIIIBV compounds
    • H01L21/28581—Deposition of Schottky electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrodes Of Semiconductors (AREA)
IT29727/72A 1971-09-29 1972-09-27 Contatto metallo semiconduttore di piccola estensione superfi ciale IT967908B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19712148658 DE2148658C3 (de) 1971-09-29 Kleinflächiger Metall-Halbleiterkontakt

Publications (1)

Publication Number Publication Date
IT967908B true IT967908B (it) 1974-03-11

Family

ID=5820950

Family Applications (1)

Application Number Title Priority Date Filing Date
IT29727/72A IT967908B (it) 1971-09-29 1972-09-27 Contatto metallo semiconduttore di piccola estensione superfi ciale

Country Status (8)

Country Link
US (1) US3831068A (it)
JP (1) JPS565068B2 (it)
BE (1) BE789498A (it)
FR (1) FR2154619B1 (it)
GB (1) GB1364604A (it)
IT (1) IT967908B (it)
LU (1) LU66176A1 (it)
NL (1) NL7213086A (it)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4201604A (en) * 1975-08-13 1980-05-06 Raytheon Company Process for making a negative resistance diode utilizing spike doping
US4076575A (en) * 1976-06-30 1978-02-28 International Business Machines Corporation Integrated fabrication method of forming connectors through insulative layers
JPS559428A (en) * 1978-07-07 1980-01-23 Internatl Rectifier Corp Japan Ltd Method of manufacturing schottky barrier contact rectifier elements and schottky barrier contact rectifier element
JPS5910363U (ja) * 1982-07-12 1984-01-23 ヤンマーディーゼル株式会社 建設機械の油圧配管
JPH0510044Y2 (it) * 1986-09-22 1993-03-11
GB8728878D0 (en) * 1987-12-10 1988-01-27 Westinghouse Brake & Signal Semiconductor contact arrangement
JPH11214504A (ja) * 1998-01-26 1999-08-06 Mitsubishi Electric Corp 半導体装置およびその製造方法
US6956274B2 (en) * 2002-01-11 2005-10-18 Analog Devices, Inc. TiW platinum interconnect and method of making the same

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1110609A (en) * 1964-08-17 1968-04-24 Semiconductors Ltd Improvements in or relating to integrated circuit chips
US3368124A (en) * 1965-12-09 1968-02-06 Rca Corp Semiconductor devices
US3451912A (en) * 1966-07-15 1969-06-24 Ibm Schottky-barrier diode formed by sputter-deposition processes
FR1542642A (fr) * 1966-08-30 1968-10-18 Telefunken Patent Montage semi-conducteur
GB1188082A (en) * 1967-04-05 1970-04-15 Hitachi Ltd Method of making Semiconductor Device and Semiconductor Device made thereby
US3518506A (en) * 1967-12-06 1970-06-30 Ibm Semiconductor device with contact metallurgy thereon,and method for making same
NL6903930A (it) * 1969-03-14 1970-09-16
GB1337283A (en) * 1969-12-26 1973-11-14 Hitachi Ltd Method of manufacturing a semiconductor device

Also Published As

Publication number Publication date
FR2154619B1 (it) 1978-01-06
GB1364604A (en) 1974-08-21
US3831068A (en) 1974-08-20
DE2148658B2 (de) 1977-03-17
FR2154619A1 (it) 1973-05-11
LU66176A1 (it) 1973-01-17
BE789498A (fr) 1973-01-15
JPS565068B2 (it) 1981-02-03
NL7213086A (it) 1973-04-02
JPS4843582A (it) 1973-06-23
DE2148658A1 (de) 1973-04-05

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