IT959913B - Sistema e apparecchiatura per il montaggio di componenti su pannelli circuitali - Google Patents

Sistema e apparecchiatura per il montaggio di componenti su pannelli circuitali

Info

Publication number
IT959913B
IT959913B IT26071/72A IT2607172A IT959913B IT 959913 B IT959913 B IT 959913B IT 26071/72 A IT26071/72 A IT 26071/72A IT 2607172 A IT2607172 A IT 2607172A IT 959913 B IT959913 B IT 959913B
Authority
IT
Italy
Prior art keywords
assembly
equipment
components
circuit panels
panels
Prior art date
Application number
IT26071/72A
Other languages
English (en)
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Application granted granted Critical
Publication of IT959913B publication Critical patent/IT959913B/it

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02Feeding of components
    • H05K13/028Simultaneously loading a plurality of loose objects, e.g. by means of vibrations, pressure differences, magnetic fields
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S29/00Metal working
    • Y10S29/044Vacuum
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49826Assembling or joining
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/5313Means to assemble electrical device
    • Y10T29/53174Means to fasten electrical component to wiring board, base, or substrate
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/5313Means to assemble electrical device
    • Y10T29/53191Means to apply vacuum directly to position or hold work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Packages (AREA)
  • Automatic Assembly (AREA)
IT26071/72A 1971-08-31 1972-06-23 Sistema e apparecchiatura per il montaggio di componenti su pannelli circuitali IT959913B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US17657571A 1971-08-31 1971-08-31

Publications (1)

Publication Number Publication Date
IT959913B true IT959913B (it) 1973-11-10

Family

ID=22644915

Family Applications (1)

Application Number Title Priority Date Filing Date
IT26071/72A IT959913B (it) 1971-08-31 1972-06-23 Sistema e apparecchiatura per il montaggio di componenti su pannelli circuitali

Country Status (6)

Country Link
US (1) US3736651A (it)
JP (1) JPS539714B2 (it)
DE (1) DE2241905A1 (it)
FR (1) FR2150925B1 (it)
GB (2) GB1393932A (it)
IT (1) IT959913B (it)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2194143A5 (it) * 1972-07-25 1974-02-11 Peugeot & Renault
US4089105A (en) * 1976-11-22 1978-05-16 Augat Inc. Method for mounting lead sockets to an electrical interconnection board
DE2656019C3 (de) * 1976-12-10 1980-07-17 Brown, Boveri & Cie Ag, 6800 Mannheim Vorrichtung zum Ausrichten und Anlöten von Podesten bzw. Ronden bezüglich der bzw. an den lötfähigen ohmschen Kontakten) von Halbleiterbauelementen
US4142286A (en) * 1978-03-15 1979-03-06 Burroughs Corporation Apparatus and method for inserting solder preforms on selected circuit board back plane pins
US4434134A (en) 1981-04-10 1984-02-28 International Business Machines Corporation Pinned ceramic substrate
JPS57199136A (en) * 1981-06-03 1982-12-07 Hitachi Ltd Device for aligning parts
US4610084A (en) * 1984-05-21 1986-09-09 At&T Technologies, Inc. Method and apparatus for inserting leads into holes in substrates
JPS6146100A (ja) * 1984-08-11 1986-03-06 日本碍子株式会社 ピン自動挿入機
JPH0345472Y2 (it) * 1984-10-25 1991-09-26
US4745681A (en) * 1987-04-22 1988-05-24 International Business Machines Corporation Controlled pin insertion using airflow sensing and active feedback
US4817273A (en) * 1987-04-30 1989-04-04 Reliability Incorporated Burn-in board loader and unloader
JPH02158152A (ja) * 1988-12-09 1990-06-18 Rohm Co Ltd ペレット収納整列用治具
US5386626A (en) * 1993-09-10 1995-02-07 Cen Tronic Co., Ltd. Method for manufacturing a circuit board with a plurality of conductive terminal pins
US6864570B2 (en) * 1993-12-17 2005-03-08 The Regents Of The University Of California Method and apparatus for fabricating self-assembling microstructures
US6161749A (en) * 1998-07-13 2000-12-19 Ericsson, Inc. Method and apparatus for holding a printed circuit board during assembly
US7257887B2 (en) * 2004-06-14 2007-08-21 David Lee Die holding apparatus for bonding systems
US9054162B2 (en) 2010-11-22 2015-06-09 Andreas Fischer Method and an apparatus for forming electrically conductive vias in a substrate, an automated robot-based manufacturing system, a component comprising a substrate with via holes, and an interposer device
JP6135598B2 (ja) * 2013-08-20 2017-05-31 株式会社村田製作所 チップの振込装置
EP3508548B1 (en) 2015-04-28 2020-01-29 Shin-Etsu Chemical Co., Ltd. Silicone adhesive composition and an adhesive tape
WO2017191943A1 (ko) * 2016-05-02 2017-11-09 안상정 3족 질화물 반도체층 성장을 위한 템플릿, 3족 질화물 반도체 발광소자 및 이들을 제조하는 방법
KR102405836B1 (ko) * 2016-05-02 2022-06-08 웨이브로드 주식회사 3족 질화물 반도체층 성장을 위한 템플릿, 3족 질화물 반도체 발광소자 및 이들을 제조하는 방법
CN112399715A (zh) * 2020-09-25 2021-02-23 华东光电集成器件研究所 一种混合电路柱状陶瓷基片的自动摆料装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2355643A (en) * 1942-08-07 1944-08-15 Atwood H Grover Means for positioning objects
US2985948A (en) * 1955-01-14 1961-05-30 Rca Corp Method of assembling a matrix of magnetic cores
US3061919A (en) * 1959-07-13 1962-11-06 Clevite Corp Magnetic loading method and apparatus
US3129494A (en) * 1960-07-06 1964-04-21 Ibm Method and apparatus for winding magnetic cores
US3319316A (en) * 1964-07-06 1967-05-16 Western Electric Co Methods of separating, orienting and assembling a plurality of entangled articles
US3472356A (en) * 1968-02-28 1969-10-14 Western Electric Co Apparatus for selecting articles having a desired orientation
US3561088A (en) * 1968-12-16 1971-02-09 Ind Micronics Inc Matrix core threading apparatus

Also Published As

Publication number Publication date
FR2150925B1 (it) 1975-01-03
DE2241905A1 (de) 1973-03-08
GB1393932A (en) 1975-05-14
US3736651A (en) 1973-06-05
GB1393931A (en) 1975-05-14
FR2150925A1 (it) 1973-04-13
JPS539714B2 (it) 1978-04-07
JPS4834486A (it) 1973-05-18

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