IT958885B - Componente elettrico particolarmen te dispositivo semiconduttore con contatto fogliforme - Google Patents

Componente elettrico particolarmen te dispositivo semiconduttore con contatto fogliforme

Info

Publication number
IT958885B
IT958885B IT68531/72A IT6853172A IT958885B IT 958885 B IT958885 B IT 958885B IT 68531/72 A IT68531/72 A IT 68531/72A IT 6853172 A IT6853172 A IT 6853172A IT 958885 B IT958885 B IT 958885B
Authority
IT
Italy
Prior art keywords
sheet
semiconductor device
electrical component
shaped contact
special electrical
Prior art date
Application number
IT68531/72A
Other languages
English (en)
Italian (it)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Application granted granted Critical
Publication of IT958885B publication Critical patent/IT958885B/it

Links

Classifications

    • H10W40/778—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/056—Folded around rigid support or component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H10W72/07236—
    • H10W72/073—
    • H10W72/07336—
    • H10W72/354—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • ing And Chemical Polishing (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
IT68531/72A 1971-05-19 1972-05-16 Componente elettrico particolarmen te dispositivo semiconduttore con contatto fogliforme IT958885B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2124887A DE2124887C3 (de) 1971-05-19 1971-05-19 Elektrisches Bauelement, vorzugsweise Halbleiterbauelement, mit Folienkontaktierung

Publications (1)

Publication Number Publication Date
IT958885B true IT958885B (it) 1973-10-30

Family

ID=5808355

Family Applications (1)

Application Number Title Priority Date Filing Date
IT68531/72A IT958885B (it) 1971-05-19 1972-05-16 Componente elettrico particolarmen te dispositivo semiconduttore con contatto fogliforme

Country Status (8)

Country Link
JP (1) JPS5428715B1 (Direct)
AU (1) AU466740B2 (Direct)
CA (1) CA964380A (Direct)
DE (1) DE2124887C3 (Direct)
FR (1) FR2137934B1 (Direct)
GB (1) GB1363805A (Direct)
IT (1) IT958885B (Direct)
NL (1) NL7206491A (Direct)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1403371A (en) * 1972-01-12 1975-08-28 Mullard Ltd Semiconductor device arrangements
GB1574699A (en) 1975-10-10 1980-09-10 Luc Technologies Ltd Conductive connections
ZA783270B (en) * 1977-07-06 1979-06-27 Motorola Inc Molded circuit board
DE2752655A1 (de) * 1977-09-23 1979-06-07 Blaupunkt Werke Gmbh Elektronisches bauelement
NL191959B (nl) * 1981-03-24 1996-07-01 Gao Ges Automation Org Identificatiekaart met IC-bouwsteen en dragerelement voor een IC-bouwsteen.
AT398254B (de) * 1982-08-10 1994-11-25 Dowty Electronic Components Chipträger sowie anordnung von solchen chipträgern
US4528748A (en) * 1982-11-29 1985-07-16 General Electric Company Method for fabricating a printed circuit board of desired shape
DE3627372C3 (de) * 1986-08-12 1994-04-14 Loewe Opta Gmbh Anordnung, bestehend aus einer Leiterplatte, einem Kühlkörper und zu kühlenden elektronischen Bauelementen
JPH0740600B2 (ja) * 1987-04-30 1995-05-01 三菱電機株式会社 半導体装置
US6842325B2 (en) * 2001-09-19 2005-01-11 Square D Company Flexible circuit adhered to metal frame of device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2923860A (en) * 1957-08-22 1960-02-02 Miller John Dawson Printed circuit board

Also Published As

Publication number Publication date
CA964380A (en) 1975-03-11
GB1363805A (en) 1974-08-21
JPS5428715B1 (Direct) 1979-09-18
DE2124887A1 (de) 1972-12-07
AU466740B2 (en) 1975-11-06
NL7206491A (Direct) 1972-11-21
FR2137934B1 (Direct) 1980-04-04
DE2124887B2 (de) 1979-08-02
AU4226672A (en) 1973-11-22
FR2137934A1 (Direct) 1972-12-29
DE2124887C3 (de) 1980-04-17

Similar Documents

Publication Publication Date Title
SE389582B (sv) Elektrisk kontaktanordning
CH557585A (de) Elektrische kontakteinrichtung.
AT311480B (de) Elektrisches Hochspannungsgerät
AR194850A1 (es) Un dispositivo conectador electrico
SE397024B (sv) Elektrisk kontaktanordning
SE389961B (sv) Sett att framstella en elektrisk kontaktanordning
AT298597B (de) Elektrisches Kontaktelement
SE386318B (sv) Elektrisk kontaktanordning
SE381780B (sv) Elektrisk kontaktanordning
SE388749B (sv) Elektrisk kontaktanordning
SE385064B (sv) Elektrisk kontaktanordning
SE384952B (sv) Elektrisk anslutningsanordning
IT947244B (it) Dispositivo semiconduttore
CH491484A (de) Elektrische Kontakteinrichtung
SE398025B (sv) Elektrisk kontaktanordning
NL7504946A (nl) Electrische contactinrichting.
CH532848A (de) Elektrische Verbindungsvorrichtung
IT968737B (it) Dispositivo elettrico di connessione
SE384599B (sv) Omkopplings- och lagrings-halvledaranordning
IT958885B (it) Componente elettrico particolarmen te dispositivo semiconduttore con contatto fogliforme
SE387015B (sv) Kontaktanordning
AT300072B (de) Elektrische Kontaktvorrichtung
SE397904B (sv) Elektrisk kontaktanordning
SE386317B (sv) Elektrisk kontaktanordning
CH544419A (de) Elektrische Anschlussvorrichtung