IT955889B - Supporto metallico per sostenere e munire di prese di contatto un corpo di materiale semiconduttore - Google Patents

Supporto metallico per sostenere e munire di prese di contatto un corpo di materiale semiconduttore

Info

Publication number
IT955889B
IT955889B IT24893/72A IT2489372A IT955889B IT 955889 B IT955889 B IT 955889B IT 24893/72 A IT24893/72 A IT 24893/72A IT 2489372 A IT2489372 A IT 2489372A IT 955889 B IT955889 B IT 955889B
Authority
IT
Italy
Prior art keywords
fitting
supporting
semiconductor material
metallic support
contact sockets
Prior art date
Application number
IT24893/72A
Other languages
English (en)
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Application granted granted Critical
Publication of IT955889B publication Critical patent/IT955889B/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/042—Etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials
    • H10W70/457—Materials of metallic layers on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
IT24893/72A 1971-06-03 1972-05-26 Supporto metallico per sostenere e munire di prese di contatto un corpo di materiale semiconduttore IT955889B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2127633A DE2127633B2 (de) 1971-06-03 1971-06-03 Verfahren zum Herstellen eines Systemträgers zur Halterung und Kontaktierung eines Halbleiterkörpers

Publications (1)

Publication Number Publication Date
IT955889B true IT955889B (it) 1973-09-29

Family

ID=5809753

Family Applications (1)

Application Number Title Priority Date Filing Date
IT24893/72A IT955889B (it) 1971-06-03 1972-05-26 Supporto metallico per sostenere e munire di prese di contatto un corpo di materiale semiconduttore

Country Status (5)

Country Link
DE (1) DE2127633B2 (it)
FR (1) FR2140190B3 (it)
GB (2) GB1389346A (it)
IT (1) IT955889B (it)
NL (1) NL7207300A (it)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2658532C2 (de) * 1976-12-23 1984-02-16 Siemens AG, 1000 Berlin und 8000 München Zwischenträger zur Halterung und Kontaktierung eines Halbleiterkörpers und Verfahren zu dessen Herstellung
CN108257938B (zh) * 2018-01-31 2020-01-24 江苏长电科技股份有限公司 用于引线框架的治具及引线框架的蚀刻方法

Also Published As

Publication number Publication date
DE2127633C3 (it) 1975-11-20
GB1390752A (en) 1975-04-16
FR2140190B3 (it) 1975-08-08
DE2127633A1 (de) 1972-12-07
NL7207300A (it) 1972-12-05
GB1389346A (en) 1975-04-03
DE2127633B2 (de) 1975-03-20
FR2140190A1 (it) 1973-01-12

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