IT969686B - Dispositivo semiconduttore munito di custodia di materiale varistivo in ossido metallico - Google Patents

Dispositivo semiconduttore munito di custodia di materiale varistivo in ossido metallico

Info

Publication number
IT969686B
IT969686B IT3065672A IT3065672A IT969686B IT 969686 B IT969686 B IT 969686B IT 3065672 A IT3065672 A IT 3065672A IT 3065672 A IT3065672 A IT 3065672A IT 969686 B IT969686 B IT 969686B
Authority
IT
Italy
Prior art keywords
varistive
case
semiconductor device
device equipped
metallic oxide
Prior art date
Application number
IT3065672A
Other languages
English (en)
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Application granted granted Critical
Publication of IT969686B publication Critical patent/IT969686B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/62—Protection against overvoltage, e.g. fuses, shunts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Thermistors And Varistors (AREA)
  • Die Bonding (AREA)
IT3065672A 1971-10-22 1972-10-19 Dispositivo semiconduttore munito di custodia di materiale varistivo in ossido metallico IT969686B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US19187071A 1971-10-22 1971-10-22

Publications (1)

Publication Number Publication Date
IT969686B true IT969686B (it) 1974-04-10

Family

ID=22707233

Family Applications (1)

Application Number Title Priority Date Filing Date
IT3065672A IT969686B (it) 1971-10-22 1972-10-19 Dispositivo semiconduttore munito di custodia di materiale varistivo in ossido metallico

Country Status (7)

Country Link
JP (1) JPS4851587A (it)
CA (1) CA963166A (it)
DE (1) DE2251228A1 (it)
FR (1) FR2156859B1 (it)
GB (1) GB1362499A (it)
IT (1) IT969686B (it)
SE (1) SE383443B (it)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5040234B2 (ja) 2006-09-26 2012-10-03 三菱電機株式会社 圧接型半導体装置
EP2665095A1 (en) * 2012-05-16 2013-11-20 GE Energy Power Conversion UK Limited Power electronic devices

Also Published As

Publication number Publication date
FR2156859B1 (it) 1978-02-03
GB1362499A (en) 1974-08-07
JPS4851587A (it) 1973-07-19
CA963166A (en) 1975-02-18
FR2156859A1 (it) 1973-06-01
DE2251228A1 (de) 1973-05-10
SE383443B (sv) 1976-03-08

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