IT950015B - Sostegno di almeno un elemento semiconduttore a disco - Google Patents

Sostegno di almeno un elemento semiconduttore a disco

Info

Publication number
IT950015B
IT950015B IT21606/72A IT2160672A IT950015B IT 950015 B IT950015 B IT 950015B IT 21606/72 A IT21606/72 A IT 21606/72A IT 2160672 A IT2160672 A IT 2160672A IT 950015 B IT950015 B IT 950015B
Authority
IT
Italy
Prior art keywords
support
disc element
semiconducting disc
semiconducting
disc
Prior art date
Application number
IT21606/72A
Other languages
English (en)
Italian (it)
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CH369171A external-priority patent/CH528817A/de
Priority claimed from CH1071371A external-priority patent/CH558084A/xx
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Application granted granted Critical
Publication of IT950015B publication Critical patent/IT950015B/it

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025Base discrete devices, e.g. presspack, disc-type transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075Mechanical elements
    • H01L2023/4081Compliant clamping elements not primarily serving heat-conduction
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075Mechanical elements
    • H01L2023/4087Mounting accessories, interposers, clamping or screwing parts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Braking Arrangements (AREA)
IT21606/72A 1971-03-11 1972-03-09 Sostegno di almeno un elemento semiconduttore a disco IT950015B (it)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH369171A CH528817A (de) 1971-03-11 1971-03-11 Halter für mindestens ein scheibenförmiges Halbleiterelement
CH1071371A CH558084A (de) 1971-07-20 1971-07-20 Halter mit mindestens einem scheibenfoermigen halbleiterelement.

Publications (1)

Publication Number Publication Date
IT950015B true IT950015B (it) 1973-06-20

Family

ID=25693632

Family Applications (1)

Application Number Title Priority Date Filing Date
IT21606/72A IT950015B (it) 1971-03-11 1972-03-09 Sostegno di almeno un elemento semiconduttore a disco

Country Status (7)

Country Link
JP (1) JPS56110654U (en:Method)
BE (1) BE780425A (en:Method)
FR (1) FR2128812B1 (en:Method)
GB (1) GB1384951A (en:Method)
IT (1) IT950015B (en:Method)
NL (1) NL7203094A (en:Method)
SE (1) SE377863B (en:Method)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2135119A (en) * 1983-01-19 1984-08-22 Westinghouse Electric Corp Self-aligning, self-loading semiconductor clamp
AT506778B1 (de) * 2008-04-29 2012-04-15 Siemens Ag Kühlanordnung mit zwei nebeneinander angeordneten halbleiterbauelementen

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE564064A (en:Method) * 1957-03-01 1900-01-01
DE1514483B2 (de) * 1965-06-22 1971-05-06 Siemens AG, 1000 Berlin u 8000 München Druckkontakt halbleiter gleichrichter
JPS4414338Y1 (en:Method) * 1966-05-14 1969-06-18
DE1299076B (de) * 1966-06-10 1969-07-10 Siemens Ag Halbleiter-Scheibenzellen-Anordnung mit mindestens einem Paar zwischen Druckstuecken eingespannten Zellen
JPS4411714Y1 (en:Method) * 1966-06-17 1969-05-15
US3401315A (en) * 1966-10-31 1968-09-10 Int Rectifier Corp Compression assembled semiconductor device using spherical force transmitting member

Also Published As

Publication number Publication date
SE377863B (en:Method) 1975-07-28
GB1384951A (en) 1975-02-26
BE780425A (fr) 1972-07-03
JPS56110654U (en:Method) 1981-08-27
FR2128812A1 (en:Method) 1972-10-20
FR2128812B1 (en:Method) 1977-09-02
NL7203094A (en:Method) 1972-09-13

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