IT950015B - Support of at least a disk semiconductor element - Google Patents

Support of at least a disk semiconductor element

Info

Publication number
IT950015B
IT950015B IT2160672A IT2160672A IT950015B IT 950015 B IT950015 B IT 950015B IT 2160672 A IT2160672 A IT 2160672A IT 2160672 A IT2160672 A IT 2160672A IT 950015 B IT950015 B IT 950015B
Authority
IT
Italy
Prior art keywords
support
semiconductor element
disk semiconductor
disk
element
Prior art date
Application number
IT2160672A
Other languages
Italian (it)
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to CH369171A priority Critical patent/CH528817A/en
Priority to CH1071371A priority patent/CH558084A/en
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Application granted granted Critical
Publication of IT950015B publication Critical patent/IT950015B/en

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025Base discrete devices, e.g. presspack, disc-type transistors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075Mechanical elements
    • H01L2023/4081Compliant clamping elements not primarily serving heat-conduction
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075Mechanical elements
    • H01L2023/4087Mounting accessories, interposers, clamping or screwing parts
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
IT2160672A 1971-03-11 1972-03-09 Support of at least a disk semiconductor element IT950015B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CH369171A CH528817A (en) 1971-03-11 1971-03-11 Holder for at least a disk-shaped semiconductor element
CH1071371A CH558084A (en) 1971-07-20 1971-07-20 Holder with at least one scheibenfoermigen semiconductor element.

Publications (1)

Publication Number Publication Date
IT950015B true IT950015B (en) 1973-06-20

Family

ID=25693632

Family Applications (1)

Application Number Title Priority Date Filing Date
IT2160672A IT950015B (en) 1971-03-11 1972-03-09 Support of at least a disk semiconductor element

Country Status (7)

Country Link
JP (1) JPS56110654U (en)
BE (1) BE780425A (en)
FR (1) FR2128812B1 (en)
GB (1) GB1384951A (en)
IT (1) IT950015B (en)
NL (1) NL7203094A (en)
SE (1) SE377863B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2135119A (en) * 1983-01-19 1984-08-22 Westinghouse Electric Corp Self-aligning, self-loading semiconductor clamp
AT506778B1 (en) * 2008-04-29 2012-04-15 Siemens Ag Cooling arrangement with two side-elevated semiconductor elements

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE564064A (en) * 1957-03-01 1900-01-01
DE1514483B2 (en) * 1965-06-22 1971-05-06 Pressure contact semiconductor rectifiers
JPS4414338Y1 (en) * 1966-05-14 1969-06-18
DE1299076B (en) * 1966-06-10 1969-07-10 Siemens Ag Semiconductor wafer cell arrangement clamped between at least one pair Druckstuecken cells
JPS4411714Y1 (en) * 1966-06-17 1969-05-15
US3401315A (en) * 1966-10-31 1968-09-10 Int Rectifier Corp Compression assembled semiconductor device using spherical force transmitting member

Also Published As

Publication number Publication date
FR2128812B1 (en) 1977-09-02
BE780425A1 (en)
NL7203094A (en) 1972-09-13
GB1384951A (en) 1975-02-26
FR2128812A1 (en) 1972-10-20
SE377863B (en) 1975-07-28
BE780425A (en) 1972-07-03
JPS56110654U (en) 1981-08-27

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