FR2128812B1 - - Google Patents

Info

Publication number
FR2128812B1
FR2128812B1 FR7208389A FR7208389A FR2128812B1 FR 2128812 B1 FR2128812 B1 FR 2128812B1 FR 7208389 A FR7208389 A FR 7208389A FR 7208389 A FR7208389 A FR 7208389A FR 2128812 B1 FR2128812 B1 FR 2128812B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7208389A
Other languages
French (fr)
Other versions
FR2128812A1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC Brown Boveri AG Switzerland
Original Assignee
BBC Brown Boveri AG Switzerland
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CH369171A external-priority patent/CH528817A/en
Priority claimed from CH1071371A external-priority patent/CH558084A/en
Application filed by BBC Brown Boveri AG Switzerland filed Critical BBC Brown Boveri AG Switzerland
Publication of FR2128812A1 publication Critical patent/FR2128812A1/fr
Application granted granted Critical
Publication of FR2128812B1 publication Critical patent/FR2128812B1/fr
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025Base discrete devices, e.g. presspack, disc-type transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075Mechanical elements
    • H01L2023/4081Compliant clamping elements not primarily serving heat-conduction
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075Mechanical elements
    • H01L2023/4087Mounting accessories, interposers, clamping or screwing parts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Braking Arrangements (AREA)
FR7208389A 1971-03-11 1972-03-10 Expired FR2128812B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH369171A CH528817A (en) 1971-03-11 1971-03-11 Holder for at least one disk-shaped semiconductor element
CH1071371A CH558084A (en) 1971-07-20 1971-07-20 HOLDER WITH AT LEAST ONE DISC-SHAPED SEMICONDUCTOR ELEMENT.

Publications (2)

Publication Number Publication Date
FR2128812A1 FR2128812A1 (en) 1972-10-20
FR2128812B1 true FR2128812B1 (en) 1977-09-02

Family

ID=25693632

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7208389A Expired FR2128812B1 (en) 1971-03-11 1972-03-10

Country Status (7)

Country Link
JP (1) JPS56110654U (en)
BE (1) BE780425A (en)
FR (1) FR2128812B1 (en)
GB (1) GB1384951A (en)
IT (1) IT950015B (en)
NL (1) NL7203094A (en)
SE (1) SE377863B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2135119A (en) * 1983-01-19 1984-08-22 Westinghouse Electric Corp Self-aligning, self-loading semiconductor clamp
AT506778B1 (en) * 2008-04-29 2012-04-15 Siemens Ag COOLING ARRANGEMENT WITH TWO SIDE-ELEVATED SEMICONDUCTOR ELEMENTS

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL111799C (en) * 1957-03-01 1900-01-01
DE1514483B2 (en) * 1965-06-22 1971-05-06 Siemens AG, 1000 Berlin u 8000 München PRINT CONTACT SEMICONDUCTOR RECTIFIER
JPS4414338Y1 (en) * 1966-05-14 1969-06-18
DE1299076B (en) * 1966-06-10 1969-07-10 Siemens Ag Semiconductor disk cell arrangement with at least one pair of cells clamped between pressure pieces
JPS4411714Y1 (en) * 1966-06-17 1969-05-15
US3401315A (en) * 1966-10-31 1968-09-10 Int Rectifier Corp Compression assembled semiconductor device using spherical force transmitting member

Also Published As

Publication number Publication date
GB1384951A (en) 1975-02-26
SE377863B (en) 1975-07-28
FR2128812A1 (en) 1972-10-20
NL7203094A (en) 1972-09-13
JPS56110654U (en) 1981-08-27
BE780425A (en) 1972-07-03
IT950015B (en) 1973-06-20

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Legal Events

Date Code Title Description
ST Notification of lapse