BE780425A - MOUNTING FOR AT LEAST ONE SEMICONDUCTOR ELEMENT IN PLATE SHAPE - Google Patents

MOUNTING FOR AT LEAST ONE SEMICONDUCTOR ELEMENT IN PLATE SHAPE

Info

Publication number
BE780425A
BE780425A BE780425A BE780425A BE780425A BE 780425 A BE780425 A BE 780425A BE 780425 A BE780425 A BE 780425A BE 780425 A BE780425 A BE 780425A BE 780425 A BE780425 A BE 780425A
Authority
BE
Belgium
Prior art keywords
mounting
semiconductor element
plate shape
shape
semiconductor
Prior art date
Application number
BE780425A
Other languages
French (fr)
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CH369171A external-priority patent/CH528817A/en
Priority claimed from CH1071371A external-priority patent/CH558084A/en
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Publication of BE780425A publication Critical patent/BE780425A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Braking Arrangements (AREA)
BE780425A 1971-03-11 1972-03-09 MOUNTING FOR AT LEAST ONE SEMICONDUCTOR ELEMENT IN PLATE SHAPE BE780425A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH369171A CH528817A (en) 1971-03-11 1971-03-11 Holder for at least one disk-shaped semiconductor element
CH1071371A CH558084A (en) 1971-07-20 1971-07-20 HOLDER WITH AT LEAST ONE DISC-SHAPED SEMICONDUCTOR ELEMENT.

Publications (1)

Publication Number Publication Date
BE780425A true BE780425A (en) 1972-07-03

Family

ID=25693632

Family Applications (1)

Application Number Title Priority Date Filing Date
BE780425A BE780425A (en) 1971-03-11 1972-03-09 MOUNTING FOR AT LEAST ONE SEMICONDUCTOR ELEMENT IN PLATE SHAPE

Country Status (7)

Country Link
JP (1) JPS56110654U (en)
BE (1) BE780425A (en)
FR (1) FR2128812B1 (en)
GB (1) GB1384951A (en)
IT (1) IT950015B (en)
NL (1) NL7203094A (en)
SE (1) SE377863B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2135119A (en) * 1983-01-19 1984-08-22 Westinghouse Electric Corp Self-aligning, self-loading semiconductor clamp
AT506778B1 (en) * 2008-04-29 2012-04-15 Siemens Ag COOLING ARRANGEMENT WITH TWO SIDE-ELEVATED SEMICONDUCTOR ELEMENTS

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL111799C (en) * 1957-03-01 1900-01-01
DE1514483B2 (en) * 1965-06-22 1971-05-06 Siemens AG, 1000 Berlin u 8000 München PRINT CONTACT SEMICONDUCTOR RECTIFIER
JPS4414338Y1 (en) * 1966-05-14 1969-06-18
DE1299076B (en) * 1966-06-10 1969-07-10 Siemens Ag Semiconductor disk cell arrangement with at least one pair of cells clamped between pressure pieces
JPS4411714Y1 (en) * 1966-06-17 1969-05-15
US3401315A (en) * 1966-10-31 1968-09-10 Int Rectifier Corp Compression assembled semiconductor device using spherical force transmitting member

Also Published As

Publication number Publication date
JPS56110654U (en) 1981-08-27
FR2128812B1 (en) 1977-09-02
IT950015B (en) 1973-06-20
SE377863B (en) 1975-07-28
NL7203094A (en) 1972-09-13
GB1384951A (en) 1975-02-26
FR2128812A1 (en) 1972-10-20

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