IT939530B - Metodo per saldare componenti su circuiti e circuiti cosi ottenuti - Google Patents
Metodo per saldare componenti su circuiti e circuiti cosi ottenutiInfo
- Publication number
- IT939530B IT939530B IT5338571A IT5338571A IT939530B IT 939530 B IT939530 B IT 939530B IT 5338571 A IT5338571 A IT 5338571A IT 5338571 A IT5338571 A IT 5338571A IT 939530 B IT939530 B IT 939530B
- Authority
- IT
- Italy
- Prior art keywords
- circuits
- welding components
- welding
- components
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/247—Finish coating of conductors by using conductive pastes, inks or powders
- H05K3/248—Finish coating of conductors by using conductive pastes, inks or powders fired compositions for inorganic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
- H01L21/705—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thick-film circuits or parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB4849870A GB1368960A (en) | 1970-10-13 | 1970-10-13 | Soldering electrical components to thick film circuits |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IT939530B true IT939530B (it) | 1973-02-10 |
Family
ID=10448842
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT5338571A IT939530B (it) | 1970-10-13 | 1971-10-11 | Metodo per saldare componenti su circuiti e circuiti cosi ottenuti |
Country Status (4)
| Country | Link |
|---|---|
| DE (1) | DE2150818A1 (it) |
| FR (1) | FR2111315A5 (it) |
| GB (1) | GB1368960A (it) |
| IT (1) | IT939530B (it) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2933835C2 (de) * | 1979-08-21 | 1987-02-19 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum Befestigen von in Scheiben- oder Plattenform vorliegenden Targetmaterialien auf Kühlteller für Aufstäubanlagen |
| US5110034A (en) * | 1990-08-30 | 1992-05-05 | Quantum Magnetics, Inc. | Superconducting bonds for thin film devices |
| DE10243814B4 (de) * | 2002-09-20 | 2018-05-30 | Robert Bosch Gmbh | Verfahren zur Herstellung einer leitenden Beschichtung auf einem isolierenden Substrat |
-
1970
- 1970-10-13 GB GB4849870A patent/GB1368960A/en not_active Expired
-
1971
- 1971-10-11 IT IT5338571A patent/IT939530B/it active
- 1971-10-12 DE DE19712150818 patent/DE2150818A1/de active Pending
- 1971-10-13 FR FR7136788A patent/FR2111315A5/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE2150818A1 (de) | 1973-07-19 |
| GB1368960A (en) | 1974-10-02 |
| FR2111315A5 (it) | 1972-06-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| BG17952A3 (bg) | Метод за получаване на бета- арил-2- аминоалктлкокси - стироли | |
| BE771485A (nl) | Klinknagel vastzettend apparaat en werkwijze ervoor | |
| BG17508A3 (bg) | Метод за получаване на 1- фенокси 2- хидрокси-3- циклоалкил- аминопропани | |
| BE761952A (fr) | Coupe-circuit perfectionne | |
| SE413636B (sv) | Anordning for att kyla svetsar | |
| IT939530B (it) | Metodo per saldare componenti su circuiti e circuiti cosi ottenuti | |
| AT298848B (de) | Lochstreifen-Reparatureinrichtung | |
| BG20100A3 (bg) | Метод за получаване на 1-фенокси-2-хидрокси-3- хидроалкил-аминопропани | |
| BG19589A3 (bg) | Метод за получаване на фениламиноалкани | |
| CH536677A (de) | Lötwerkzeug | |
| BG19373A3 (bg) | Метод за получаване на тиокарбамиди | |
| BE765825A (nl) | Fotografische werkwijze | |
| BG19138A3 (bg) | Метод за получаване на фенилкарбамиди | |
| AT306831B (de) | Lötgerät | |
| BE761849A (fr) | Circuit microelectronique | |
| AT264594B (de) | Verfahren zum Herstellen von Metallkontakten auf Halbleiterbauelementen | |
| ES194993Y (es) | Dispositivo electronico perfeccionado para la ensenanza. | |
| TR16680A (tr) | Usul | |
| IT940329B (it) | Apparecchio per saldare e dissal dare circuiti stampati | |
| AT313677B (de) | Lötvorrichtung | |
| BG17531A3 (bg) | Метод за получаване на алкиламинопропани | |
| BG17974A3 (bg) | Метод за получаване на тетрахидро- бензиазепинони | |
| BG18873A3 (bg) | Метод за получаване на междумолекулно съединение | |
| BG20555A3 (bg) | Метод за получаване на n-изопропил-анилин | |
| BG17979A3 (bg) | Метод за получаване на дез- фенила- ланин в1- инсулин |