IT938888B - Apparato a forza elettromagnetica per la fabbricazione dei circuiti integrati - Google Patents

Apparato a forza elettromagnetica per la fabbricazione dei circuiti integrati

Info

Publication number
IT938888B
IT938888B IT29334/71A IT2933471A IT938888B IT 938888 B IT938888 B IT 938888B IT 29334/71 A IT29334/71 A IT 29334/71A IT 2933471 A IT2933471 A IT 2933471A IT 938888 B IT938888 B IT 938888B
Authority
IT
Italy
Prior art keywords
manufacture
integrated circuits
electromagnetic force
force equipment
equipment
Prior art date
Application number
IT29334/71A
Other languages
English (en)
Original Assignee
Honeywell Inf Systems
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell Inf Systems filed Critical Honeywell Inf Systems
Application granted granted Critical
Publication of IT938888B publication Critical patent/IT938888B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67138—Apparatus for wiring semiconductor or solid state device
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B23K20/023—Thermo-compression bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Induction Heating (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Wire Bonding (AREA)
IT29334/71A 1970-10-05 1971-09-30 Apparato a forza elettromagnetica per la fabbricazione dei circuiti integrati IT938888B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US7803970A 1970-10-05 1970-10-05

Publications (1)

Publication Number Publication Date
IT938888B true IT938888B (it) 1973-02-10

Family

ID=22141540

Family Applications (1)

Application Number Title Priority Date Filing Date
IT29334/71A IT938888B (it) 1970-10-05 1971-09-30 Apparato a forza elettromagnetica per la fabbricazione dei circuiti integrati

Country Status (6)

Country Link
US (1) US3697837A (it)
JP (1) JPS5436453B1 (it)
DE (1) DE2149748A1 (it)
FR (1) FR2110218B1 (it)
GB (1) GB1369042A (it)
IT (1) IT938888B (it)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2532515B1 (fr) * 1982-08-27 1985-12-13 Thomson Csf Procede de cablage automatise a panne vibrante et machine de cablage utilisant un tel procede
US4659969A (en) * 1984-08-09 1987-04-21 Synektron Corporation Variable reluctance actuator having position sensing and control
US4665348A (en) * 1984-08-09 1987-05-12 Synektron Corporation Method for sensing and controlling the position of a variable reluctance actuator
DE3667930D1 (de) * 1985-07-12 1990-02-08 Siemens Ag Verfahren zum regeln des prozessverlaufes und zur qualitaetskontrolle beim ultraschallschweissen von werkstuecken.
GB8522819D0 (en) * 1985-09-16 1985-10-23 Mccracken W Control of vibration energisation
US5398537A (en) * 1991-12-06 1995-03-21 Gemcor Engineering Corporation Low amperage electromagnetic apparatus and method for uniform rivet upset
DE4335108C1 (de) * 1993-10-14 1995-01-05 Schunk Ultraschalltechnik Gmbh Verfahren und Vorrichtung zum Kompaktieren und anschließenden Schweißen von elektrischen Leitern
US5572096A (en) * 1994-05-27 1996-11-05 Sgs-Thomson Microelectronics, Inc. Method and circuit for clamping the recirculation current in stator windings
JP3447982B2 (ja) 1999-06-16 2003-09-16 株式会社アルテクス 超音波振動接合装置
AT411855B (de) * 2001-06-26 2004-06-25 Datacon Semiconductor Equip Einrichtung zum positionieren
WO2005042202A1 (de) 2003-10-29 2005-05-12 Schunk Ultraschalltechnik Gmbh Verfahren zum verschweissen von leitern
DE10350809B3 (de) * 2003-10-29 2005-07-07 Schunk Ultraschalltechnik Gmbh Verfahren zum Verschweissen von Leitern
DE10359368A1 (de) * 2003-12-18 2005-07-14 Schunk Ultraschalltechnik Gmbh Verfahren zum Verschweißen von Leitern
DE102004022313B3 (de) * 2004-05-04 2005-10-20 Stapla Ultraschalltechnik Gmbh Vorrichtung und Verfahren zum fluiddichten Dichtschweißen eines Rohrabschnittes

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3470432A (en) * 1967-07-21 1969-09-30 Us Navy Transducer,transducer system and transducer suspension spring

Also Published As

Publication number Publication date
US3697837A (en) 1972-10-10
GB1369042A (en) 1974-10-02
DE2149748A1 (de) 1972-04-06
FR2110218A1 (it) 1972-06-02
FR2110218B1 (it) 1977-04-22
JPS5436453B1 (it) 1979-11-09

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