IT8119345A0 - PROCEDURE FOR THE SELECTIVE, CHEMICAL AND/OR GALVANIC DEPOSITION OF METALLIC COATINGS, PARTICULARLY FOR THE MANUFACTURE OF PRINTED CIRCUITS. - Google Patents

PROCEDURE FOR THE SELECTIVE, CHEMICAL AND/OR GALVANIC DEPOSITION OF METALLIC COATINGS, PARTICULARLY FOR THE MANUFACTURE OF PRINTED CIRCUITS.

Info

Publication number
IT8119345A0
IT8119345A0 IT8119345A IT1934581A IT8119345A0 IT 8119345 A0 IT8119345 A0 IT 8119345A0 IT 8119345 A IT8119345 A IT 8119345A IT 1934581 A IT1934581 A IT 1934581A IT 8119345 A0 IT8119345 A0 IT 8119345A0
Authority
IT
Italy
Prior art keywords
selective
procedure
manufacture
chemical
printed circuits
Prior art date
Application number
IT8119345A
Other languages
Italian (it)
Other versions
IT1135186B (en
Inventor
Kurt Heymann
Joachim Wolff
Original Assignee
Schering Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering Ag filed Critical Schering Ag
Publication of IT8119345A0 publication Critical patent/IT8119345A0/en
Application granted granted Critical
Publication of IT1135186B publication Critical patent/IT1135186B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0344—Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
IT19345/81A 1980-03-03 1981-01-27 PROCEDURE FOR THE SELECTIVE, CHEMICAL AND / OR GALVANIC DEPOSITION OF METALLIC COATINGS, IN PARTICULAR FOR THE MANUFACTURE OF PRINTED CIRCUITS IT1135186B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19803008434 DE3008434A1 (en) 1980-03-03 1980-03-03 METHOD FOR SELECTIVE CHEMICAL AND / OR GALVANIC DEPOSITION OF METAL COATINGS, ESPECIALLY FOR THE PRODUCTION OF PRINTED CIRCUITS

Publications (2)

Publication Number Publication Date
IT8119345A0 true IT8119345A0 (en) 1981-01-27
IT1135186B IT1135186B (en) 1986-08-20

Family

ID=6096345

Family Applications (1)

Application Number Title Priority Date Filing Date
IT19345/81A IT1135186B (en) 1980-03-03 1981-01-27 PROCEDURE FOR THE SELECTIVE, CHEMICAL AND / OR GALVANIC DEPOSITION OF METALLIC COATINGS, IN PARTICULAR FOR THE MANUFACTURE OF PRINTED CIRCUITS

Country Status (6)

Country Link
JP (1) JPS56135996A (en)
DE (1) DE3008434A1 (en)
FR (1) FR2477360B1 (en)
GB (1) GB2070647B (en)
IE (1) IE50821B1 (en)
IT (1) IT1135186B (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59186390A (en) * 1983-04-07 1984-10-23 株式会社サト−セン Method of producing printed circuit board
EP0150733A3 (en) * 1984-01-26 1987-01-14 LeaRonal, Inc. Process for printed circuit board maufacture
JPS60176293A (en) * 1984-02-22 1985-09-10 新神戸電機株式会社 Method of producing printed circuit board
DE3840199C2 (en) * 1988-11-29 1994-12-01 Heraeus Noblelight Gmbh Process for structuring metal layers that are catalytically active in electroless metallization by means of UV radiation
DE4008482A1 (en) * 1990-03-16 1991-09-19 Asea Brown Boveri GALVANIZATION PROCEDURE
JPH0555069U (en) * 1991-12-25 1993-07-23 松下電器産業株式会社 Rotational speed detection device
US5354583A (en) * 1992-11-09 1994-10-11 Martin Marietta Energy Systems, Inc. Apparatus and method for selective area deposition of thin films on electrically biased substrates
TW369672B (en) * 1997-07-28 1999-09-11 Hitachi Ltd Wiring board and its manufacturing process, and electrolysis-free electroplating method
KR101594723B1 (en) * 2011-08-18 2016-02-16 애플 인크. Anodization and plating surface treatments
US9683305B2 (en) 2011-12-20 2017-06-20 Apple Inc. Metal surface and process for treating a metal surface
US10300658B2 (en) * 2012-05-03 2019-05-28 Apple Inc. Crack resistant plastic enclosure structures
DE102019220458A1 (en) * 2019-12-20 2021-06-24 Vitesco Technologies Germany Gmbh Method of manufacturing a printed circuit board and printed circuit board

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB829263A (en) * 1957-02-08 1960-03-02 Sperry Rand Corp Method of making printed circuits
DE1277642B (en) * 1964-01-14 1968-09-12 Bayer Ag Process for the protection of metallic surfaces against metal deposition in chemical metallization baths
US3485665A (en) * 1967-08-22 1969-12-23 Western Electric Co Selective chemical deposition of thin-film interconnections and contacts
DE2920940A1 (en) * 1979-05-21 1980-12-04 Schering Ag METHOD FOR PRODUCING PRINTED CIRCUITS

Also Published As

Publication number Publication date
FR2477360A1 (en) 1981-09-04
IE50821B1 (en) 1986-07-23
DE3008434C2 (en) 1988-02-25
FR2477360B1 (en) 1985-06-28
GB2070647A (en) 1981-09-09
IE810447L (en) 1981-09-03
IT1135186B (en) 1986-08-20
JPS6257120B2 (en) 1987-11-30
JPS56135996A (en) 1981-10-23
GB2070647B (en) 1984-02-22
DE3008434A1 (en) 1981-09-17

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