IT7820473A0 - Procedimento per deporre uno strato di metallo conduttore su di un supporto isolante. - Google Patents

Procedimento per deporre uno strato di metallo conduttore su di un supporto isolante.

Info

Publication number
IT7820473A0
IT7820473A0 IT7820473A IT2047378A IT7820473A0 IT 7820473 A0 IT7820473 A0 IT 7820473A0 IT 7820473 A IT7820473 A IT 7820473A IT 2047378 A IT2047378 A IT 2047378A IT 7820473 A0 IT7820473 A0 IT 7820473A0
Authority
IT
Italy
Prior art keywords
placing
procedure
layer
conductive metal
insulating support
Prior art date
Application number
IT7820473A
Other languages
English (en)
Other versions
IT1094254B (it
Inventor
Privas Yves Emilie
Original Assignee
Panoduz Anstalt
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panoduz Anstalt filed Critical Panoduz Anstalt
Publication of IT7820473A0 publication Critical patent/IT7820473A0/it
Application granted granted Critical
Publication of IT1094254B publication Critical patent/IT1094254B/it

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern
    • H05K3/245Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23DENAMELLING OF, OR APPLYING A VITREOUS LAYER TO, METALS
    • C23D5/00Coating with enamels or vitreous layers
    • C23D5/06Coating with enamels or vitreous layers producing designs or letters
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/05Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Laminated Bodies (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Insulating Bodies (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Glass Compositions (AREA)
IT20473/78A 1977-02-22 1978-02-21 Procedimento per deporre uno strato di metallo conduttore su di un supporto isolante IT1094254B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7705050A FR2397469A1 (fr) 1977-02-22 1977-02-22 Procede pour deposer une couche de metal conducteur sur un support isolant

Publications (2)

Publication Number Publication Date
IT7820473A0 true IT7820473A0 (it) 1978-02-21
IT1094254B IT1094254B (it) 1985-07-26

Family

ID=9187047

Family Applications (1)

Application Number Title Priority Date Filing Date
IT20473/78A IT1094254B (it) 1977-02-22 1978-02-21 Procedimento per deporre uno strato di metallo conduttore su di un supporto isolante

Country Status (10)

Country Link
US (1) US4196029A (it)
JP (1) JPS53121168A (it)
BE (1) BE869712A (it)
DE (1) DE2806927A1 (it)
ES (1) ES467209A1 (it)
FR (1) FR2397469A1 (it)
GB (1) GB1595618A (it)
IT (1) IT1094254B (it)
LU (1) LU80131A1 (it)
NL (1) NL7801981A (it)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4510179A (en) * 1981-08-18 1985-04-09 Matsushita Electric Industrial Co., Ltd. Electrode on heat-resisting and isolating substrate and the manufacturing process for it
US4559279A (en) * 1983-06-30 1985-12-17 Matsushita Electric Industrial Co., Ltd. Electrode on heat-resisting and isolating substrate
DE3537161C2 (de) * 1985-10-18 1995-08-03 Bosch Gmbh Robert Verfahren zur Herstellung festhaftender, lötfähiger und strukturierbarer Metallschichten auf Aluminiumoxid-haltiger Keramik
US5070605A (en) * 1988-04-22 1991-12-10 Medtronic, Inc. Method for making an in-line pacemaker connector system
US20090285976A1 (en) * 2006-06-14 2009-11-19 Basf Se Method for producing electrically conductive surfaces on a support
CN106553487A (zh) * 2015-09-30 2017-04-05 凸版印刷株式会社 金属装饰制品

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB938365A (en) * 1959-01-08 1963-10-02 Photocircuits Corp Method of making printed circuits
US3226256A (en) * 1963-01-02 1965-12-28 Jr Frederick W Schneble Method of making printed circuits
US3424658A (en) * 1965-10-21 1969-01-28 Clyde A Norton Method of producing a printed circuit board on a metallic substrate
US3399268A (en) * 1966-06-07 1968-08-27 Photocircuits Corp Chemical metallization and products produced thereby
DE1621367A1 (de) * 1967-10-18 1971-05-06 Telefunken Patent Verfahren zum Aktivieren einer Metallisierungsschicht
US3615734A (en) * 1968-11-01 1971-10-26 Du Pont Brazeable compositions
US3772075A (en) * 1969-07-01 1973-11-13 Ppg Industries Inc Applying electroconductive heating circuits to glass
US3671311A (en) * 1969-07-01 1972-06-20 Ppg Industries Inc Applying electroconductive heating circuits to glass
US3763004A (en) * 1972-03-31 1973-10-02 Horizons Inc Method for producing electrical heating elements from metal plated images
GB1412341A (en) * 1973-01-29 1975-11-05 Atomic Energy Authority Uk Metallising pastes
FR2305478A1 (fr) * 1975-03-25 1976-10-22 Labo Electronique Physique Pate serigraphiable pour conducteurs en couches epaisses a deposer sur un substrat ceramique et procede de preparation de couches conductrices utilisant une telle pate

Also Published As

Publication number Publication date
DE2806927A1 (de) 1978-08-24
JPS53121168A (en) 1978-10-23
FR2397469B1 (it) 1980-11-21
LU80131A1 (it) 1979-01-19
BE869712A (fr) 1978-12-01
FR2397469A1 (fr) 1979-02-09
GB1595618A (en) 1981-08-12
ES467209A1 (es) 1978-11-16
DE2806927C2 (it) 1987-08-20
IT1094254B (it) 1985-07-26
NL7801981A (nl) 1978-08-24
US4196029A (en) 1980-04-01

Similar Documents

Publication Publication Date Title
IT1094980B (it) Metodo per la formazione di distanziatori su di un substrato isolante
GB2002336A (en) Method for fabricating an electrode substrate
IT1112638B (it) Metodo per la deposizione di uno strato di siliciuro metallico
IT1116612B (it) Procedimento per la deposizione di un metallo su una superficie isolante o dielettrica
IT1105115B (it) Procedimento per rivestire un oggeto elettricamente conduttivo
IT1083388B (it) Suoneria elettronica per apparecchi telefonici
IT7926809A0 (it) Procedimento di fabbricazione di modelli metallici su un materialedi sopporto isolante.
JPS532357A (en) Preetreating process for nonnelectroplating electroconductive metal onto insulating substrate
GB2003764A (en) Provision of metal bumps on an apertured substrate
IT7822112A0 (it) Metodo per formare un contatto per un circuito integrato.
IT7820473A0 (it) Procedimento per deporre uno strato di metallo conduttore su di un supporto isolante.
MX145764A (es) Metodo mejorado para fabricar un contacto electrico
JPS5482666A (en) Nonnelectrolytic plating method of insulated substrate
JPS5351474A (en) Method of forming electrode on insulating substrate
NL7808183A (nl) Kathode voor elektronenemissie.
JPS5410971A (en) Substrate for multiilayer circuit
AR209642A1 (es) Un contacto electrico
IT1075077B (it) Metodo pr realizzare contatti su semiconduttori
AT358783B (de) Verputzbare daemmschicht
IT7867653A0 (it) Procedimento per formare un contatto ohmico su un semiconduttore composito contenente alluminio
IT1093532B (it) Struttura di revestimento isolante per dispositivi termotecnici
IT1066018B (it) Piastra di base ceramica per orologio da polso elettronico
JPS5256366A (en) Method of conducting bothhside printed substrate
IT7824536A0 (it) Apparecchio per la elettroanalgesia della neurostimolazione.
IT7822471A0 (it) Apparecchio di fabbricazione di uno strato di contatto saldato su supporto metallico.