IT201800004357A1 - Elastic electronic device applicable on fabric - Google Patents
Elastic electronic device applicable on fabric Download PDFInfo
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- IT201800004357A1 IT201800004357A1 IT102018000004357A IT201800004357A IT201800004357A1 IT 201800004357 A1 IT201800004357 A1 IT 201800004357A1 IT 102018000004357 A IT102018000004357 A IT 102018000004357A IT 201800004357 A IT201800004357 A IT 201800004357A IT 201800004357 A1 IT201800004357 A1 IT 201800004357A1
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- electronic device
- ink
- elastic
- fabric
- trace
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- 239000004744 fabric Substances 0.000 title claims description 18
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 230000010354 integration Effects 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 239000000976 ink Substances 0.000 description 43
- 239000010410 layer Substances 0.000 description 15
- 239000012528 membrane Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000008021 deposition Effects 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 239000011265 semifinished product Substances 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 3
- 230000006399 behavior Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 230000008030 elimination Effects 0.000 description 2
- 238000003379 elimination reaction Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000002679 ablation Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0283—Stretchable printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/568—Temporary substrate used as encapsulation process aid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68345—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during the manufacture of self supporting substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68363—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/038—Textiles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0314—Elastomeric connector or conductor, e.g. rubber with metallic filler
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Control Of Vending Devices And Auxiliary Devices For Vending Devices (AREA)
- Undergarments, Swaddling Clothes, Handkerchiefs Or Underwear Materials (AREA)
- Yarns And Mechanical Finishing Of Yarns Or Ropes (AREA)
Description
DISPOSITIVO ELETTRONICO ELASTICO APPLICABILE SU ELASTIC ELECTRONIC DEVICE APPLICABLE ON
TESSUTO TISSUE
Titolare: Eptatech S.r.l. Owner: Eptatech S.r.l.
Inventore: Corrado Fontanesi Inventor: Corrado Fontanesi
5 5
SETTORE TECNICO TECHNICAL FIELD
La presente invenzione ricade nel settore del “Tessile Intelligente”, intendendo con tale denominazione la realizzazione di dispositivi elettrici o elettronici integrati negli indumenti e quindi indossabili. The present invention falls within the "Intelligent Textile" sector, meaning with this denomination the realization of electric or electronic devices integrated in the garments and therefore wearable.
10 Tali dispositivi hanno la caratteristica di assecondare e sopportare i movimenti e gli stress meccanici ai quali gli indumenti sono soggetti durante il nomale uso. 10 These devices have the characteristic of supporting and withstanding the movements and mechanical stresses to which the garments are subjected during normal use.
Si pensi a esempio l’elongazioni, la piegature, le flessioni e le torsioni ai quali sono sottoposti gli indumenti quando sono indossati, riposti o lavati. Consider, for example, the elongations, folds, bends and twists to which garments are subjected when they are worn, stored or washed.
15 Tali dispositivi hanno altresì il vantaggio di non perdere le prestazioni funzionali dei comuni componenti elettronici ed elettrici, consentendo la corretta applicazione pratica del dispositivo senza essere un elemento di costrizione alla libertà di movimento per l’utilizzatore. 15 These devices also have the advantage of not losing the functional performance of common electronic and electrical components, allowing the correct practical application of the device without being an element of constraint on the user's freedom of movement.
20 STATO DELL’ARTE 20 STATE OF THE ART
La Tecnologia dell’Elettronica Stampata, anche denominata “Printed Electronic”, cioè dell’utilizzo di processi additivi di stampa industriale per la realizzazione di circuiti elettrici o elettronici, ha ormai casi di applicazione consolidati, ad esempio in campo fotovoltaico o nella 25 realizzazione delle cosiddette tastiere a membrana. Tale tecnologia è stata adottata per la sua economicità, semplicità e diffusione dei processi di stampa che permettono elevati volumi di produzione. The Technology of Printed Electronics, also called "Printed Electronic", that is the use of additive industrial printing processes for the realization of electrical or electronic circuits, has now consolidated cases of application, for example in the photovoltaic field or in the realization of so-called membrane keyboards. This technology was adopted for its cost-effectiveness, simplicity and diffusion of printing processes that allow high production volumes.
Queste caratteristiche hanno permesso lo sviluppo di diverse tipologie dell’elettronica stampata. These features have allowed the development of different types of printed electronics.
5 Negli ultimi anni sta emergendo la cosiddetta “Stretchable Electronic”, cioè l’Elettronica Elastica, in grado di conformarsi a strutture elastiche ed a seguirne le deformazioni senza che il dispositivo elettronico sia danneggiato o perda in prestazione. 5 In recent years, the so-called "Stretchable Electronic" has emerged, ie Elastic Electronics, capable of conforming to elastic structures and following their deformations without the electronic device being damaged or losing performance.
Fra queste strutture, i tessuti sono di particolare interesse. L’integrazione 10 di dispositivi elettronici negli indumenti permette varie applicazioni. A titolo esemplificativo si ricorda la possibilità di un monitoraggio continuo e non invasivo dei parametri fisiologici dell’utente, rendendo possibili l’applicazione di questo monitoraggio in campo medico, in particolare nella medicina a distanza e sportivo. Among these structures, fabrics are of particular interest. The integration 10 of electronic devices into clothing allows for various applications. By way of example, please note the possibility of continuous and non-invasive monitoring of the user's physiological parameters, making it possible to apply this monitoring in the medical field, in particular in remote and sports medicine.
15 Tra i prodotti che meglio si adattano alla realizzazione di dispositivi elettronici integrati negli indumenti sono certi inchiostri speciali. 15 Among the products that are best suited to the creation of electronic devices integrated into clothing are certain special inks.
Tra questi inchiostri rivestono particolare importanza i conosciuti inchiostri conduttivi e inchiostri dielettrici e protettivi “stretchable” che assicurano prestazioni elettriche sotto stress meccanico adeguate alla 20 stampa di circuiti elettrici elastici. Among these inks, the well-known conductive inks and dielectric and protective “stretchable” inks are of particular importance, which ensure electrical performance under mechanical stress suitable for printing elastic electrical circuits.
Sono anche rilevanti i conosciuti inchiostri che esibiscono comportamenti funzionalmente rilevanti quando sono stimolati da correnti elettriche. A puro titolo di esempio si possono citare gli inchiostri che attraversati da correnti elettriche emettono onde luminose (elettroluminescenti, OLED) o cambiano la frequenza dell’onda luminosa riflessa (elettrocromici) o subiscono variazioni dimensionali (elettrosensibili). Also relevant are known inks that exhibit functionally relevant behaviors when stimulated by electric currents. By way of example, we can mention inks that, when crossed by electric currents, emit light waves (electroluminescent, OLED) or change the frequency of the reflected light wave (electrochromic) or undergo dimensional variations (electro-sensitive).
In questa sede è altresì opportuno ricordare i conosciuti inchiostri che trasformano energia a loro somministrata in correnti elettriche misurabili e 5 possono essere usati per la stampa dei sensori. A questa categoria appartengono ad esempio gli inchiostri fotosensibili, i piezoelettrici o i biosensori che trasformano energia chimica in segnali elettrici. Gli inchiostri funzionali sono quindi sia quelli che attraversati da corrente mostrano comportamenti rilevanti funzionalmente sia quelli utilizzabili per 10 stampare sensori. Queste due tipologie d’inchiostro saranno nel proseguimento denominata in breve“inchiostro funzionale”. Here it is also worth mentioning the known inks which transform the energy administered to them into measurable electric currents and 5 which can be used for printing the sensors. This category includes, for example, photosensitive inks, piezoelectrics or biosensors that transform chemical energy into electrical signals. Functional inks are therefore both those which, when crossed by current, show functionally relevant behaviors and those that can be used for printing sensors. These two types of ink will be referred to in short as "functional ink".
Non sono invece ancora disponibili inchiostri funzionali con i quali stampare semiconduttori aventi prestazioni sufficienti a supportare le necessità computazionali della gran parte delle applicazioni. Allo stesso 15 modo non sono sempre in pratica realizzabili attraverso processi di stampa componenti cosiddetti passivi (condensatori, resistenze, induttanze). However, functional inks with which to print semiconductors with sufficient performance to support the computational needs of most applications are not yet available. In the same way 15 so-called passive components (capacitors, resistors, inductances) are not always achievable in practice through printing processes.
Tale mancanza ha portato alla realizzazione di elettroniche cosiddette “ibride”, cioè realizzate solo parzialmente con processi di stampa di 20 inchiostri elettricamente conduttivi e/o inchiostri funzionali, integrati da processi di montaggio di componenti non stampabili come microchip, taluni condensatori, talune resistenze, talune induttanze. This lack has led to the creation of so-called "hybrid" electronics, that is, made only partially with printing processes of 20 electrically conductive inks and / or functional inks, integrated by assembly processes of non-printable components such as microchips, some capacitors, some resistors, some inductances.
Nonostante gli inchiostri conduttivi e funzionali citati siano disponibili per diverse tecnologie di stampa, la stampa su tessuto con inchiostro 25 conduttivo e/o funzionale presenta criticità rilevanti. Although the conductive and functional inks mentioned are available for different printing technologies, printing on fabric with conductive and / or functional ink 25 presents significant criticalities.
Il tessuto presenta delle irregolarità, porosità e instabilità della superficie. Tali caratteristiche del tessuto rendono non possibile la stampa diretta sul tessuto di tracce che formano un circuito elettrico con un inchiostro conduttivo e/o funzionale non essendo possibile realizzare dette tracce 5 con una risoluzione e omogeneità di spessori idonee. The fabric has irregularities, porosity and surface instability. These characteristics of the fabric make it impossible to print directly on the fabric of traces that form an electric circuit with a conductive and / or functional ink, since it is not possible to produce said traces 5 with a resolution and homogeneity of suitable thicknesses.
Per risolvere questo problema, i circuiti elettrici elastici sono realizzati su membrane elastiche con superficie regolare, successivamente laminate a caldo sul tessuto finale. To solve this problem, the elastic electrical circuits are made on elastic membranes with a regular surface, which are then hot-rolled on the final fabric.
Le membrane elastiche conosciute hanno però una serie di limiti. However, known elastic membranes have a number of limitations.
10 La membrana elastica laminata diventa parte integrante dell’indumento a contatto con la pelle dell’utente, limitando la confortevolezza dell’indumento e quindi la sua indossabilità prolungata nel tempo. 10 The laminated elastic membrane becomes an integral part of the garment in contact with the user's skin, limiting the comfort of the garment and therefore its prolonged wear over time.
Le membrane elastiche sono, altresì, instabili dimensionalmente quando sono sollecitate meccanicamente dalle operazioni di stampa e soggette a 15 deformazioni quando sono esposte al calore durante la fase di polimerizzazione degli inchiostri. Elastic membranes are also dimensionally unstable when they are mechanically stressed by the printing operations and subject to 15 deformations when exposed to heat during the polymerization phase of the inks.
L’instabilità dimensionale delle membrane è una criticità, in particolare, per la cosiddetta “messa a registro”, cioè il posizionamento in macchina del semilavorato per l’esecuzione di operazioni successive. Un esempio di 20 “messa a registro” sono i posizionamenti in macchina necessari per la deposizione di strati successivi d’inchiostro dovendo, fra l’altro, ogni strato d’inchiostro essere sottoposto a calore per essere asciugato, ad esempio in forno, prima della deposizione dello strato successivo. The dimensional instability of the membranes is a critical issue, in particular, for the so-called "registration", ie the positioning of the semi-finished product in the machine for the execution of subsequent operations. An example of 20 "registration" are the positioning in the machine necessary for the deposition of successive layers of ink, having, among other things, each layer of ink to be subjected to heat to be dried, for example in the oven, before of the deposition of the next layer.
L’instabilità dimensionale delle membrane è inoltre un problema nella 25 “messa a registro” necessaria alle operazioni di montaggio di componenti elettronici non stampabili. Tali operazioni sono infatti eseguite da macchine automatiche, denominate “pick and place”, che presuppongono il rispetto di tolleranze sub-millimetriche. The dimensional instability of the membranes is also a problem in the 25 "registration" necessary for the assembly operations of non-printable electronic components. These operations are in fact performed by automatic machines, called "pick and place", which require compliance with sub-millimeter tolerances.
Un altro svantaggio delle membrane elastiche risiede nella loro 5 caratteristica meccanica di elasticità che è uniforme su tutta la loro estensione, essendo invece preferibile avere aree a grande elasticità contigue ad aree rigide o di minore deformabilità coincidenti con i punti di ancoraggio e collegamento elettrico con i componenti elettronici o elettrici non stampati che sono montati successivamente per garantire la 10 robustezza ed affidabilità del manufatto finale. Another disadvantage of elastic membranes lies in their mechanical characteristic of elasticity which is uniform over their entire extension, being instead preferable to have areas of great elasticity contiguous to rigid areas or areas of lesser deformability coinciding with the anchor points and electrical connection with the unprinted electronic or electrical components which are subsequently mounted to ensure the strength and reliability of the final product.
Va inoltre evidenziato come l’utilizzo di una membrana non risolve il problema della protezione dell’elettronica dall’ambiente esterno durante l’utilizzo degli indumenti o, in particolare, durante il loro lavaggio o del suo isolamento elettrico. A tale scopo è infatti necessaria l’applicazione 15 sul lato esterno dell’elettronica di uno strato protettivo realizzato attraverso la deposizione di inchiostri o un’ulteriore laminazione. It should also be noted that the use of a membrane does not solve the problem of protecting electronics from the external environment during the use of clothing or, in particular, during their washing or its electrical insulation. For this purpose it is in fact necessary to apply 15 on the external side of the electronics of a protective layer made through the deposition of inks or further lamination.
DESCRIZIONE DELL’INVENZIONE DESCRIPTION OF THE INVENTION
I problemi dei dispositivi elettronici deformabili conosciuti, in particolare 20 quelli realizzati utilizzando la membrana, descritta nel paragrafo che precede, sono superati dal dispositivo elettronico oggetto della presente invenzione. The problems of known deformable electronic devices, in particular 20 those made using the membrane, described in the preceding paragraph, are overcome by the electronic device object of the present invention.
Il dispositivo elettronico oggetto della presente invenzione si riferisce sia a un dispositivo elettronico realizzato con processi di stampa sia nelle sue componenti elettriche e funzionali sia nelle sue componenti strutturali e protettive. The electronic device object of the present invention refers both to an electronic device made with printing processes both in its electrical and functional components and in its structural and protective components.
In altre parole, la presente invenzione si riferisce, nella forma di realizzazione elementare, a un dispositivo elettronico che utilizza 5 fondamentalmente varie tipologie d’inchiostro con le quali è realizzata almeno una traccia che forma un circuito elettricamente conduttivo e un inchiostro elastico che funge da protezione e da contenitore. In other words, the present invention refers, in the elementary embodiment, to an electronic device which basically uses various types of ink with which at least one trace is made which forms an electrically conductive circuit and an elastic ink which acts as a protection and container.
In una forma di realizzazione, sempre oggetto della presente invenzione, è previsto un dispositivo elettronico analogo a quello sopra illustrato che 10 prevede l’aggiunta di almeno un componente elettrico o elettronico, non realizzabili con i vari tipi d’inchiostro sopra citati, si pensi ad esempio ai microchip, montato su almeno una traccia d’inchiostro elettricamente conduttivo e collegato elettricamente ad esse per mezzo di adesivi conduttivi. In an embodiment, again the subject of the present invention, an electronic device similar to the one illustrated above is provided which 10 provides for the addition of at least one electrical or electronic component, which cannot be produced with the various types of ink mentioned above. for example to microchips, mounted on at least one electrically conductive ink track and electrically connected to them by means of conductive adhesives.
15 In un’ulteriore forma di realizzazione, il dispositivo elettronico prevede la presenza di almeno una traccia d’inchiostro funzionale per svolgere, ad esempio, la funzione di sensore. Tale traccia può essere combinata ad almeno una traccia di circuito elettricamente conduttivo ed eventualmente a componenti elettrici ed elettronici sopra citati. 15 In a further embodiment, the electronic device provides for the presence of at least one functional ink trace to perform, for example, the sensor function. This trace can be combined with at least one electrically conductive circuit trace and possibly with the above-mentioned electrical and electronic components.
20 Il dispositivo elettronico oggetto della presente invenzione prevede un supporto sacrificale piano dimensionalmente e termicamente stabile che funge da supporto per la deposizione degli inchiostri e montaggio dei componenti per realizzare il dispositivo elettronico oggetto della presente invenzione. Tale supporto sacrificale è successivamente rimosso dopo 25 l’applicazione del dispositivo elettronico sul tessuto o indumento sul quale esso deve essere applicato. Sul supporto sacrificale è realizzata, preferibilmente stampato, almeno una traccia elastica di circuito elettrico alternativamente chiuso o aperto realizzato con inchiostro elettricamente conduttivo. Tale dispositivo prevede almeno uno strato d’inchiostro 5 elastico idoneo a incapsulare e proteggere la traccia che forma il circuito elettrico in modo totale o parziale e uno strato superiore di materiale adesivo per l’applicazione e integrazione del dispositivo elettronico ad un tessuto rimuovendo il supporto sacrificale. 20 The electronic device object of the present invention provides a sacrificial support that is dimensionally and thermally stable plane which acts as a support for the deposition of the inks and assembly of the components to realize the electronic device object of the present invention. This sacrificial support is subsequently removed after 25 application of the electronic device on the fabric or garment on which it is to be applied. On the sacrificial support, preferably printed, at least one elastic trace of an alternatively closed or open electric circuit made with electrically conductive ink is made. This device provides at least a layer of elastic ink 5 suitable for encapsulating and protecting the trace that forms the electrical circuit in a total or partial way and an upper layer of adhesive material for applying and integrating the electronic device to a fabric by removing the support. sacrificial.
In una forma di realizzazione, nel caso il dispositivo elettronico debba 10 essere del tipo ibrido, di cui si è trattato nel paragrafo che precede, è previsto almeno un componente elettrico o elettronico, quale ad esempio un microchip, montato sulla traccia elastica del circuito elettrico e collegato elettricamente ad esso per mezzo di adesivi conduttivi. In one embodiment, if the electronic device 10 is to be of the hybrid type, as discussed in the preceding paragraph, at least one electrical or electronic component is provided, such as for example a microchip, mounted on the elastic trace of the electrical circuit and electrically connected to it by means of conductive adhesives.
In una altra forma di realizzazione il dispositivo elettronico comprende 15 altresì almeno una traccia realizzata con inchiostro elettricamente funzionale. In another embodiment, the electronic device 15 also comprises at least one trace made with electrically functional ink.
Con tali forme di realizzazione è possibile ottenere un ampio spettro di applicazioni del dispositivo oggetto della presente invenzione. With these embodiments it is possible to obtain a wide spectrum of applications of the device object of the present invention.
In una forma di realizzazione, il dispositivo elettronico prevede 20 almeno uno strato d’inchiostro rigido per incapsulare alternativamente o congiuntamente il componente elettrico o elettronico e la traccia realizzata con inchiostro elettricamente funzionale in modo totale o parziale per sostenerli e contenerli. L’inchiostro incapsulante e protettivo elastico, oltre a proteggere da agenti 25 esterni il circuito elettrico conduttivo, è presente su tutta la superficie del dispositivo elettrico livellando parzialmente o totalmente le differenze di spessore generate dal montaggio del componente elettrico o elettronico, lasciando scoperte parti del circuito elettrico o delle tracce funzionali affinché svolgano la funzione di sensore o per necessità di collegamento 5 elettrico con ulteriori dispositivi esterni. In one embodiment, the electronic device provides 20 at least one rigid ink layer to alternatively or jointly encapsulate the electrical or electronic component and the trace made with electrically functional ink in a total or partial way to support and contain them. The encapsulating and elastic protective ink, in addition to protecting the conductive electrical circuit from external agents 25, is present on the entire surface of the electrical device, partially or totally leveling the thickness differences generated by the assembly of the electrical or electronic component, leaving parts of the electrical circuit or functional traces so that they perform the function of sensor or due to the need for electrical connection 5 with further external devices.
Per meglio illustrare la portata innovativa del dispositivo elettronico oggetto della presente invenzione, si noti che il supporto sacrificale è eliminato al termine dopo l’applicazione del dispositivo sul tessuto, non avendo alcuna funzione strutturale finale per il dispositivo elettronico. La 10 scelta di tale supporto è finalizzata solo all’esecuzione ottimale dei processi produttivi del dispositivo elettronico e non all’ottenimento delle caratteristiche finali di detto dispositivo. To better illustrate the innovative scope of the electronic device object of the present invention, it should be noted that the sacrificial support is eliminated at the end after the application of the device on the fabric, having no final structural function for the electronic device. The 10 choice of this support is aimed only at the optimal execution of the production processes of the electronic device and not at obtaining the final characteristics of said device.
L’utilizzo di un supporto sacrificale dimensionalmente e termicamente stabile (al più flessibile ma non elastico) permette: (i) la stampa su di esso 15 di successivi strati di inchiostro, ciascuno con caratteristiche specifiche; The use of a sacrificial support dimensionally and thermally stable (at the most flexible but not elastic) allows: (i) the printing on it of 15 successive layers of ink, each with specific characteristics;
(ii), eventuali operazioni di montaggio di componenti non stampati, essendo possibile il preciso posizionamento “a registro” del semilavorato del dispositivo elettronico nelle macchine per l’esecuzione di ciascuna fase del processo di produzione del dispositivo in parola , sia essa di stampa o 20 di montaggio di un componente elettrico o elettronico. (ii) any assembly operations of non-printed components, being possible the precise "register" positioning of the semi-finished product of the electronic device in the machines for the execution of each phase of the production process of the device in question, whether printing or 20 for the assembly of an electrical or electronic component.
La struttura finale del dispositivo elettronico è quindi costituita da: The final structure of the electronic device therefore consists of:
Strati esterni di inchiostri incapsulanti che costituiscono un guscio all’interno del quale sono contenuti gli strati che realizzano la circuitazione elettronica propriamente detta. Va notato come l’utilizzo di 25 inchiostri protettivi di diverse caratteristiche consentono la realizzazione di porzioni del guscio incapsulante con gradi di elasticità differenziati. Possono ad esempio essere realizzate porzioni rigide del guscio in concomitanza con posizioni in cui si prevede il montaggio e connessione elettrica di parti non stampate mantenendo una maggiore elasticità nelle 5 porzioni rimanenti. External layers of encapsulating inks that form a shell inside which the layers that create the proper electronic circuitry are contained. It should be noted that the use of 25 protective inks with different characteristics allow the creation of portions of the encapsulating shell with different degrees of elasticity. For example, rigid portions of the shell can be made concurrently with positions in which the assembly and electrical connection of non-molded parts is envisaged, maintaining greater elasticity in the remaining 5 portions.
L’integrazione del dispositivo elettronico sul tessuto finale è ottenibile deponendo uno strato di adesivo attivato per pressione, anche a caldo, a contatto col tessuto stesso. In questo modo il componente elettronico realizzato viene trasferito sul tessuto a partire dal supporto sacrificale. The integration of the electronic device on the final fabric can be obtained by placing a layer of adhesive activated by pressure, even when hot, in contact with the fabric itself. In this way the electronic component produced is transferred onto the fabric starting from the sacrificial support.
10 Quest’ultimo viene rimosso al termine dell’operazione, come sopra già illustrato. 10 The latter is removed at the end of the operation, as already illustrated above.
VANTAGGI DELL’INVENZIONE ADVANTAGES OF THE INVENTION
L’eliminazione di membrane elastiche frapposte permanentemente fra il 15 tessuto e il componente elettronico conferisce all’indumento una maggiore piacevolezza al tatto ed un maggior comfort, aspetto questo essenziale in molti degli utilizzi previsti di questo tipo di manufatti come esempio monitoraggio anche di lungo periodo dei parametri fisiologici anche di anziani o bambini e/o durante attività sportive o attività di riabilitazione. The elimination of elastic membranes permanently interposed between the fabric and the electronic component gives the garment a greater pleasantness to the touch and greater comfort, an essential aspect in many of the intended uses of this type of products as an example of long-term monitoring. physiological parameters also of the elderly or children and / or during sports or rehabilitation activities.
20 Il processo produttivo del componente elettronico risulta più affidabile e flessibile aumentandone i casi di applicazione. L’eliminazione del substrato permanente costituito dalla membrana elastica e l’adozione di un supporto di stampa stabile dimensionalmente, scelto per le sole esigenze di processo, garantisce infatti una messa a registro del 25 semilavorato più precisa fra una fase di processo e l’altro permettendo la realizzazione di componenti elettroniche di maggior complessità in termini di numero di strati di inchiostri stampati e di parti non stampate montate. 20 The production process of the electronic component is more reliable and flexible, increasing the number of applications. The elimination of the permanent substrate constituted by the elastic membrane and the adoption of a dimensionally stable printing support, chosen only for the process needs, in fact guarantees a more precise registration of the 25 semi-finished product between one process phase and the next. allowing the production of electronic components of greater complexity in terms of the number of layers of printed inks and of mounted non-printed parts.
È utilizzato un processo produttivo completamente additivo. Il processo 5 di stampa, per natura additivo e selettivo in quanto depone materiale secondo un preciso disegno, permette la realizzazione del componente nella sua forma finale senza alcun ricorso ad attività di ablazione di parti non necessarie, o non desiderate, dai semilavorati. A completely additive manufacturing process is used. The printing process 5, by nature additive and selective as it lays material according to a precise design, allows the component to be produced in its final form without any recourse to ablation of unnecessary or unwanted parts from the semi-finished products.
10 DESCRIZIONE DEI DISEGNI 10 DESCRIPTION OF THE DRAWINGS
La figura 1 mostra una vista in sezione ortogonale del dispositivo oggetto della presente invenzione. La figura 1 mostra un supporto sacrificale piano (2) dimensionalmente e termicamente stabile e rimuovibile sul quale è applicato un dispositivo elettronico (1) idoneo ad 15 essere applicato su tessuto(10). Il dispositivo elettronico (1) prevede una traccia elastica che forma un circuito elettrico (3) alternativamente chiuso o aperto realizzata con inchiostro elettricamente conduttivo ed almeno uno strato d’inchiostro elastico (7) idoneo a incapsulare e proteggere la traccia che forma il circuito elettrico (3) in modo totale o parziale. La figura 1 20 mostra altresì uno strato superiore di materiale adesivo (9) idoneo all’applicazione e integrazione del dispositivo elettronico (1) ad un tessuto (10), non mostrato graficamente, rimuovendo il supporto sacrificale (2). La figura 1 mostra dispositivo elettronico (1) nella forma del dispositivo elettronico ibrido, di cui si è trattato nel paragrafo precedente, che 25 comprende almeno un componente elettrico o elettronico (5) montato sulla traccia che forma il circuito elettrico (3) ad essa collegato elettricamente per mezzo di adesivi conduttivi (6). Nella forma di realizzazione del dispositivo oggetto della presente invenzione, è inoltre prevista almeno una traccia d’ inchiostro elettricamente funzionale (4) e uno strato 5 d’inchiostro rigido (8) idoneo a incapsulare alternativamente o congiuntamente il componente elettrico o elettronico (5) e la traccia d’inchiostro elettricamente funzionale (4) in modo totale o parziale per sostenerli e contenerli. Figure 1 shows an orthogonal sectional view of the device object of the present invention. Figure 1 shows a flat sacrificial support (2) dimensionally and thermally stable and removable on which an electronic device (1) suitable for 15 being applied on fabric (10) is applied. The electronic device (1) provides an elastic trace that forms an electric circuit (3) alternatively closed or open made with electrically conductive ink and at least one layer of elastic ink (7) suitable for encapsulating and protecting the trace that forms the electric circuit (3) in whole or in part. Figure 1 20 also shows an upper layer of adhesive material (9) suitable for the application and integration of the electronic device (1) to a fabric (10), not shown graphically, by removing the sacrificial support (2). Figure 1 shows an electronic device (1) in the form of the hybrid electronic device, discussed in the previous paragraph, which 25 comprises at least one electrical or electronic component (5) mounted on the track that forms the electrical circuit (3) to it electrically connected by means of conductive adhesives (6). In the embodiment of the device object of the present invention, at least one electrically functional ink trace (4) and a rigid ink layer 5 (8) suitable to alternatively or jointly encapsulate the electrical or electronic component (5) are also provided. and the electrically functional ink trace (4) in whole or in part to support and contain them.
Il dispositivo elettronico (1) prevede infine almeno un ulteriore strato 10 d’inchiostro elastico (7) incapsulante e protettivo di tutti gli altri componenti del dispositivo elettronico (1). Finally, the electronic device (1) provides at least a further layer 10 of elastic ink (7) encapsulating and protecting all the other components of the electronic device (1).
Claims (5)
Priority Applications (2)
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IT102018000004357A IT201800004357A1 (en) | 2018-04-10 | 2018-04-10 | Elastic electronic device applicable on fabric |
PCT/IB2019/000262 WO2019197892A1 (en) | 2018-04-10 | 2019-04-09 | Elastic electronic device applicable on a fabric |
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IT102018000004357A IT201800004357A1 (en) | 2018-04-10 | 2018-04-10 | Elastic electronic device applicable on fabric |
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IT102018000004357A IT201800004357A1 (en) | 2018-04-10 | 2018-04-10 | Elastic electronic device applicable on fabric |
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WO (1) | WO2019197892A1 (en) |
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GB2589567A (en) * | 2019-11-28 | 2021-06-09 | Prevayl Ltd | Semiconductor package, article and method |
GB2589568A (en) | 2019-11-28 | 2021-06-09 | Prevayl Ltd | Sensor device, system and wearable article |
US20220384315A1 (en) * | 2019-11-28 | 2022-12-01 | Prevayl Innovations Limited | Sensor semiconductor package, article comprising the same and manufacturing method thereof |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040145089A1 (en) * | 2001-06-19 | 2004-07-29 | Kenneth Burrows | Uv-curable inks for ptf laminates (including flexible circuitry) |
US20080083721A1 (en) * | 2006-10-04 | 2008-04-10 | T-Ink, Inc. | Heated textiles and methods of making the same |
US20140318699A1 (en) * | 2012-09-11 | 2014-10-30 | Gianluigi LONGINOTTI-BUITONI | Methods of making garments having stretchable and conductive ink |
US20170079144A1 (en) * | 2014-05-16 | 2017-03-16 | The Regents Of The University Of California | Fabrication of flexible electronic devices |
-
2018
- 2018-04-10 IT IT102018000004357A patent/IT201800004357A1/en unknown
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2019
- 2019-04-09 WO PCT/IB2019/000262 patent/WO2019197892A1/en active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040145089A1 (en) * | 2001-06-19 | 2004-07-29 | Kenneth Burrows | Uv-curable inks for ptf laminates (including flexible circuitry) |
US20080083721A1 (en) * | 2006-10-04 | 2008-04-10 | T-Ink, Inc. | Heated textiles and methods of making the same |
US20140318699A1 (en) * | 2012-09-11 | 2014-10-30 | Gianluigi LONGINOTTI-BUITONI | Methods of making garments having stretchable and conductive ink |
US20170079144A1 (en) * | 2014-05-16 | 2017-03-16 | The Regents Of The University Of California | Fabrication of flexible electronic devices |
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