CN210042270U

CN210042270U - Electric heating fabric

Info

Publication number: CN210042270U
Application number: CN201920324078.7U
Authority: CN
Inventors: 沈乾龙; 唐建发
Original assignee: Taiwan Textile Research Institute
Current assignee: Taiwan Textile Research Institute
Priority date: 2018-07-09
Filing date: 2019-03-14
Publication date: 2020-02-07
Anticipated expiration: 2029-03-14
Also published as: TWM567272U

Abstract

The electric heating fabric comprises a first cloth material, a second cloth material, an electronic element, a first conductive part, a second conductive part and a packaging layer. The first fabric material comprises a first base fabric and a first conductive layer arranged on the first base fabric. The second cloth is separated from the first cloth and comprises a second base cloth and a second conductive layer arranged on the second base cloth. The electronic component is provided with a first pin and a second pin, wherein the first pin is electrically connected with the first conducting layer through the first conducting part, and the second pin is electrically connected with the second conducting layer through the second conducting part. The packaging layer fixes the first pin and the first conductive part on a first cloth material and also fixes the second pin and the second conductive part on a second cloth material, wherein the first cloth material and the second cloth material are respectively provided with a penetration area, and the penetration area comprises a part of the packaging layer. Through the configuration, the connection strength of the packaging layer to each cloth can be enhanced, so that the packaging layer and the electronic element are prevented from falling off from the first cloth or the second cloth.

Description

Electric heating fabric

Technical Field

The utility model relates to an electric heating fabric.

Background

In recent years, with the development of textile technology, fabrics have design requirements in terms of appearance, and the functionality of the fabrics is also important in design consideration. In this regard, since functional fabrics have various advantages such as flexibility, lightness and thinness and providing a more aesthetic appearance, many electronic devices have also begun to be designed to use these functional fabrics as a main body to be incorporated into a part of the structure. Therefore, in the structure of the electronic device of the present invention, an example of using a functional cloth as a main body is known. Since these electronic devices using functional cloth have a great sound in the consumer market, more products combining functional cloth and electronic devices are brought out in succession, so that the development of products combining functional cloth and electronic devices is well appreciated.

SUMMERY OF THE UTILITY MODEL

An embodiment of the present invention provides an electric heating fabric, which comprises a first fabric, a second fabric, an electronic component, a first conductive portion, a second conductive portion, and an encapsulation layer. The first fabric material comprises a first base fabric and a first conductive layer, wherein the first conductive layer is arranged on the first base fabric. The second cloth is separated from the first cloth and comprises a second base cloth and a second conductive layer, wherein the second conductive layer is configured on the second base cloth. The electronic component has a first pin and a second pin, wherein the first pin is electrically connected to the first conductive layer, and the second pin is electrically connected to the second conductive layer. The first conductive part is arranged on the first cloth material and is connected with the first conductive layer and the first pins. The second conductive part is arranged on the second cloth material and separated from the first conductive part, and the second conductive part is connected with the first conductive layer and the second pins. The packaging layer fixes the first conductive part and the first pin of the electronic element on the first cloth material, and fixes the second conductive part and the second pin of the electronic element on the second cloth material, wherein the first cloth material and the second cloth material are respectively provided with a penetration area, and the penetration area comprises a part of the packaging layer.

In some embodiments, the package layer has a first portion and a second portion separated from each other, the first portion encapsulates the first conductive portion therein, and the second portion encapsulates the second conductive portion therein.

In some embodiments, the permeable region of the first fabric includes a portion of the first conductive portion, and the permeable region of the second fabric includes a portion of the second conductive portion.

In some embodiments, the first conductive portion and the second conductive portion extend from the upper surface of the first fabric and the lower surface of the second fabric to the lower surface of the first fabric and the lower surface of the second fabric.

In some embodiments, the encapsulation layer extends from the first cloth to the second cloth, and encapsulates the electronic element therein.

In some embodiments, the encapsulation layer extends from the upper surface of each of the first and second fabrics to the lower surface of each of the first and second fabrics.

In some embodiments, the first fabric has a first finger structure, the second fabric has a second finger structure, wherein the first finger structure and the second finger structure are alternately disposed, and the extending direction of the first finger structure is parallel to the extending direction of the second finger structure.

In some embodiments, the first conductive layer and the second conductive layer are silver conductive layers, copper conductive layers, or conductive layers formed by combining silver and copper.

In some embodiments, the electronic device can emit far infrared light with a wavelength of, for example, 4 μm to 14 μm.

In some embodiments, the electronic device is an infrared light emitting diode.

Drawings

FIG. 1A is a schematic top view of an electrothermal fabric according to a first embodiment of the present invention;

FIG. 1B is an enlarged schematic view of the region B of FIG. 1A;

FIG. 1C is a schematic side view of FIG. 1B;

FIG. 2 is a schematic side view of an electrothermal fabric according to a second embodiment of the present invention, wherein the view angle of FIG. 2 is the same as that of FIG. 1C;

FIG. 3 is a schematic side view of an electrothermal fabric according to a third embodiment of the present invention, wherein the view angle of FIG. 3 is the same as that of FIG. 1C;

FIG. 4 is a schematic side view of an electrothermal fabric according to a fourth embodiment of the present invention, wherein the view angle of FIG. 4 is the same as that of FIG. 1C;

fig. 5 is a schematic side view of an electric heating fabric according to a fifth embodiment of the present invention, wherein the view angle of fig. 5 is the same as that of fig. 1C.

Detailed Description

The following embodiments are described in detail with reference to the accompanying drawings, but the embodiments are not provided to limit the scope of the invention, and the description of the structure operation is not to limit the execution sequence, any structure of the re-combination of elements, and the device with equal effect all fall within the scope of the invention. In addition, the drawings are for illustrative purposes only and are not drawn to scale. For ease of understanding, like elements in the following description will be described with like reference numerals.

The electric heating fabric of the disclosure can provide far infrared light, thereby providing a thermal therapy effect, and can be directly attached to a clothing carrier (such as a garment or a protective clothing) for convenient use due to the flexibility of the electric heating fabric. In addition, the electric heating fabric uses cloth as a main structure body, so when the electronic element is fixed on the cloth by using the packaging adhesive, the packaging adhesive can penetrate into the cloth, thereby enhancing the fixing strength of the electronic element.

Referring to fig. 1A, 1B and 1C, fig. 1A is a schematic top view illustrating an electric heating fabric 100 according to a first embodiment of the present invention, fig. 1B is an enlarged schematic view of a region B of fig. 1A, and fig. 1C is a schematic side view of fig. 1B. The electrothermal fabric 100 includes a first fabric 110, a second fabric 120, a first conductive portion 130, a second conductive portion 132, an electronic component 140, and a package layer 150.

As shown in fig. 1A, the first cloth 110 and the second cloth 120 are separated from each other. The first cloth 110 and the second cloth 120 are electrically conductive, and the first cloth 110 and the second cloth 120 can be formed by performing subtraction process on the same cloth. For example, the conductive layer may be formed on the base fabric, wherein the method of forming the conductive layer may include disposing a metal material on the base fabric by impregnation, electroplating or coating, and the metal material may be, for example, silver, copper or a combination thereof. By the method, the formed cloth can be used as a conductive cloth or a metal cloth. Then, according to the circuit layout design of the electric heating fabric 100, the excess portion of the cloth material is removed, and the remaining portions of the cloth material are the first cloth material 110 and the second cloth material 120 shown in fig. 1A. In addition, the first cloth 110 and the second cloth 120 may be formed of, for example, polyester, nylon, or cotton. It should be noted that the conductive layer in the drawings of the present invention is formed by electroless plating using an immersion method, for example, so that the conductive layer is distributed on the surface and inside of the cloth material. However, it should be understood that if the conductive layer is formed by sputtering or coating, the conductive layer will only be distributed on the surface of the cloth and form a double-layer structure with the base cloth.

The first cloth 110 and the second cloth 120 can be used as the main body of the electrothermal fabric 100. Through the flexibility of the first cloth material 110 and the second cloth material 120, when the electric heating fabric 100 is attached to a clothing carrier (such as a garment or a protective tool), the electric heating fabric 100 can be deformed correspondingly along with the surface fluctuation of the attached part, thereby facilitating the use of a user. In addition, the electric heating fabric 100 using the first fabric 110 and the second fabric 120 as the main body of the structure is also convenient for the user to carry due to its thinness.

The first cloth 110 and the second cloth 120 are formed to have a first finger structure 112 and a second finger structure 122, respectively, wherein the first finger structure 112 and the second finger structure 122 are alternately disposed, and the extending direction of the first finger structure 112 is parallel to the extending direction of the second finger structure 122. For example, the first finger structures 112 and the second finger structures 122 are alternately arranged along the longitudinal direction of fig. 1A, and the first finger structures 112 and the second finger structures 122 extend along the transverse direction of fig. 1A.

As shown in fig. 1B and 1C, the first fabric 110 includes a first base fabric 114 and a first conductive layer 116 disposed on the first base fabric 114, and the second fabric 120 includes a second base fabric 124 and a second conductive layer 126 disposed on the second base fabric 124, wherein the first conductive layer 116 and the second conductive layer 126 are conductive layers formed by impregnation, electroplating or coating, and the first conductive layer 116 and the second conductive layer 126 are formed by silver, copper or a combination thereof, for example. That is, the first conductive layer 116 and the second conductive layer 126 are, for example, silver conductive layers, copper conductive layers, or conductive layers formed by combining silver and copper.

The first conductive portion 130 and the second conductive portion 132 are separated from each other, the first conductive portion 130 and the second conductive portion 132 are disposed on the first fabric 110 and the second fabric 120, respectively, and the first conductive portion 130 and the second conductive portion 132 are connected to the first conductive layer 116 and the second conductive layer 126, respectively. The first conductive portion 130 and the second conductive portion 132 may be conductive adhesive, anisotropic conductive adhesive, or solder paste, and may be disposed on the first cloth 110 and the second cloth 120 by dispensing or coating.

When the first conductive part 130 and the second conductive part 132 are disposed on the first fabric 110 and the second fabric 120, the first conductive part 130 and the second conductive part 132 may be in a liquid state, and at this time, the first conductive part 130 and the second conductive part 132 may penetrate into the penetration region a1 of the first fabric 110 and the penetration region a2 of the second fabric 120. Then, after the first conductive portion 130 and the second conductive portion 132 are cured, the permeable area a1 of the first fabric 110 includes a portion of the first conductive portion 130, and the permeable area a2 of the second fabric 120 includes a portion of the second conductive portion 132. In fig. 1C, the permeation region a1 is the region of the first fabric 110 defined by the arc-shaped dashed line, and the permeation region a2 is the region of the second fabric 120 defined by the arc-shaped dashed line, which are used for illustration purposes only and are not intended to limit the shapes and sizes of the permeation regions a1 and a 2.

Therefore, the contact area between each conductive portion and each cloth material can be increased, so that the connection strength of each conductive portion to each cloth material is enhanced, and the first conductive portion 130 and the second conductive portion 132 are prevented from falling off from the first cloth material 110 and the second cloth material 120. On the other hand, after the first conductive part 130 and the second conductive part 132 are cured, the cured first conductive part 130 and the cured second conductive part 132 cover the yarn structures of the first base fabric 114 and the second base fabric 124, so that the cured first conductive part 130 and the cured second conductive part 132 are not easily detached from the first fabric material 110 and the second fabric material 120 even if the cured first conductive part 130 and the cured second conductive part 132 are impacted by external force.

The electronic component 140 has a first pin 142 and a second pin 144, wherein the first conductive portion 130 covers and connects the first pin 142, and the second conductive portion 132 covers and connects the second pin 144. With this arrangement, the first pins 142 of the electronic component 140 can be electrically connected to the first conductive layer 116 through the first conductive portion 130, and the second pins 144 of the electronic component 140 can be electrically connected to the second conductive layer 126 through the second conductive portion 132. The electronic component 140 may be a light source emitting infrared light, such as an infrared light emitting diode, and may be a surface-mount infrared light emitting diode, for example. For example, the electronic element 140 can emit far infrared light with a wavelength of 4 μm to 14 μm. When the first conductive layer 116 of the first fabric 110 and the second conductive layer 126 of the second fabric 120 are electrically connected to different voltages (e.g., a positive voltage and a negative voltage), the first pin 142 and the second pin 144 of the electronic device 140 have different potentials, respectively, so that the electronic device 140 generates a bias voltage and emits infrared light, wherein the emitted infrared light is suitable for thermal therapy.

The encapsulation layer 150 has a first portion 152 and a second portion 154 separated from each other. The first portion 152 of the package layer 150 may encapsulate the first conductive portion 130 and the first pins 142 of the electronic element 140 therein, so as to fix the first conductive portion 130 and the first pins 142 of the electronic element 140 on the first fabric 110. The second portion 154 of the package layer 150 can encapsulate the second conductive portion 132 and the second pins 144 of the electronic element 140 therein, so as to fix the second conductive portion 132 and the second pins 144 of the electronic element 140 on the second fabric 120.

The encapsulation layer 150 may be disposed on the first cloth 110 and the second cloth 120 by dispensing, wherein the encapsulation is epoxy resin, for example. When the package layer 150 is disposed on the first fabric 110 and the second fabric 120, the package layer 150 may be in a liquid state, and at this time, the first portion 152 of the package layer 150 covers the first conductive portion 130 and the first pins 142 of the electronic element 140, the second portion 154 of the package layer covers the second conductive portion 132 and the second pins 144 of the electronic element 140, and the first portion 152 and the second portion 154 of the package layer 150 respectively penetrate into the penetration region a1 of the first fabric 110 and the penetration region a2 of the second fabric 120. Then, after the package layer 150 is cured, the permeable area a1 of the first fabric 110 and the permeable area a2 of the second fabric 120 respectively include a portion of the first portion 152 and a portion of the second portion 154 of the package layer 150.

Therefore, the contact area between the encapsulation layer 150 and each cloth can be increased, so as to enhance the connection strength of the encapsulation layer 150 to each cloth, thereby preventing the encapsulation layer 150 from falling off from the first cloth 110 and the second cloth 120. In addition, after the package layer 150 is cured, since the first portion 152 of the package layer 150 encapsulates the first conductive portion 130 and the first pin 142 of the electronic element 140, and the second portion 154 of the package layer 150 encapsulates the second conductive portion 132 and the second pin 144 of the electronic element 140, the package layer 150 can serve as a buffer layer, thereby preventing the first pin 142 or the second pin 144 of the electronic element 140 from being separated from the first conductive portion 130 or the second conductive portion 132 due to external impact.

Referring to fig. 2 again, fig. 2 is a schematic side view of an electric heating fabric 200 according to a second embodiment of the present invention, wherein the viewing angle of fig. 2 is the same as that of fig. 1C. At least one difference between the present embodiment and the first embodiment is that the first portion 252 of the encapsulation layer 250 of the present embodiment extends from the upper surface of the first cloth 210 to the lower surface of the first cloth 210, and the second portion 254 of the encapsulation layer 250 extends from the upper surface of the second cloth 220 to the lower surface of the second cloth 220. Through this configuration, the contact area between the encapsulation layer 250 and the first and

second fabrics

210 and 220 can be further increased, thereby enhancing the connection strength of the encapsulation layer 250 to each fabric.

Referring to fig. 3, fig. 3 is a schematic side view of an electric heating fabric 300 according to a third embodiment of the present invention, wherein the viewing angle of fig. 3 is the same as that of fig. 1C. At least one difference between the present embodiment and the second embodiment is that the first conductive portion 330 of the present embodiment extends from the upper surface of the first fabric 310 to the lower surface of the first fabric 310, and the second conductive portion 332 extends from the upper surface of the second fabric 320 to the lower surface of the second fabric 320, wherein the first portion 352 and the second portion 354 of the package layer 350 can respectively encapsulate the first conductive portion 330 and the second conductive portion 332 therein. Likewise, with this arrangement, the connection strength of the first conductive portion 330 to the first fabric 310 and the connection strength of the second conductive portion 332 to the second fabric 320 can be enhanced.

Referring to fig. 4, fig. 4 is a schematic side view of an electric heating fabric 400 according to a fourth embodiment of the present invention, wherein the viewing angle of fig. 4 is the same as the viewing angle of fig. 1C. At least one difference between the present embodiment and the first embodiment is that the package layer 450 of the present embodiment extends from the first fabric 410 to the second fabric 420, and the first conductive portion 430, the second conductive portion 432, the electronic element 440, and the first pin 442 and the second pin 444 are collectively encapsulated by the package layer 450. In addition, the encapsulation layer 450 may extend from the upper surface of each of the first fabric 410 and the second fabric 420 to the lower surface of each of the first fabric 410 and the second fabric 420.

The packaging layer 450 of the present embodiment can be configured to reduce the number of dispensing operations, thereby simplifying the manufacturing process. On the other hand, since the electronic element 440 is completely covered by the package layer 450, the first conductive portion 430 and the second conductive portion 432, the electronic element 440 can be prevented from breaking at the pins, and on the other hand, when the electric heating fabric 400 is impacted by an external force, the package layer 450 can provide a better external force buffering effect for the electronic element 440.

Referring to fig. 5, fig. 5 is a schematic side view of an electric heating fabric 500 according to a fifth embodiment of the present invention, wherein the viewing angle of fig. 5 is the same as the viewing angle of fig. 1C. At least one difference between the present embodiment and the fourth embodiment is that the first conductive portion 530 of the present embodiment extends from the upper surface of the first fabric 510 to the lower surface of the first fabric 510, and the second conductive portion 532 extends from the upper surface of the second fabric 520 to the lower surface of the second fabric 520, wherein the package layer 550 can jointly encapsulate the first conductive portion 530, the second conductive portion 532, the electronic element 540, and the first pin 542 and the second pin 544 thereof therein. Also, with this arrangement, the connection strength of the first conductive portion 530 to the first fabric 510 and the connection strength of the second conductive portion 532 to the second fabric 520 can be enhanced.

In summary, the electric heating fabric of the present invention comprises a first fabric, a second fabric, an electronic component, a first conductive part, a second conductive part and a package layer, wherein the first fabric and the second fabric have conductivity. The electronic element is provided with a first pin and a second pin, and is respectively and electrically connected to the first cloth material and the second cloth material through the first conductive part and the second conductive part. The electronic element can generate bias voltage by applying voltage to the first cloth and the second cloth, thereby emitting infrared light suitable for thermal therapy. The first pins and the second pins of the electronic element are respectively fixed on the first cloth and the second cloth by the packaging layer, and the penetration areas of the first cloth and the second cloth respectively comprise a part of the packaging layer, so that the contact area between the packaging layer and each cloth is increased. Therefore, through the configuration, the connection strength of the packaging layer to each cloth can be enhanced, so that the packaging layer and the electronic element are prevented from falling off from the first cloth or the second cloth.

Although the present invention has been described with reference to the above embodiments, it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention.

Claims

1. An electrothermal fabric, comprising:

the first fabric material comprises a first base fabric and a first conducting layer, wherein the first conducting layer is arranged on the first base fabric;

a second fabric separated from the first fabric and including a second base fabric and a second conductive layer, wherein the second conductive layer is disposed on the second base fabric;

the electronic component is provided with a first pin and a second pin, wherein the first pin is electrically connected with the first conductive layer, and the second pin is electrically connected with the second conductive layer;

a first conductive part disposed on the first fabric and connecting the first conductive layer and the first pins;

a second conductive part disposed on the second fabric and separated from the first conductive part, the second conductive part connecting the first conductive layer and the second pin; and

and the packaging layer is used for fixing the first conductive part and the first pins of the electronic element on the first cloth material and fixing the second conductive part and the second pins of the electronic element on the second cloth material, wherein the first cloth material and the second cloth material are respectively provided with a penetration area, and the penetration area comprises a part of the packaging layer.

2. The electrically heated fabric of claim 1, wherein the encapsulation layer has a first portion and a second portion separated from each other, the first portion encasing the first conductive portion therein and the second portion encasing the second conductive portion therein.

3. The electrically heated fabric of claim 1, wherein the permeable region of the first fabric comprises a portion of the first electrically conductive portion and the permeable region of the second fabric comprises a portion of the second electrically conductive portion.

4. The electrothermal fabric of claim 3, wherein the first and second conductive portions extend from the respective upper surfaces of the first and second fabrics to the respective lower surfaces of the first and second fabrics.

5. The electrothermal fabric of claim 1, wherein the encapsulation layer extends from the first cloth to the second cloth and encapsulates the electronic component therein.

6. The electrothermal fabric of claim 1, wherein the encapsulation layer extends from the upper surface of each of the first and second fabrics to the lower surface of each of the first and second fabrics.

7. The electrothermal fabric of claim 1, wherein the first fabric has a first finger structure and the second fabric has a second finger structure, wherein the first finger structure and the second finger structure are alternately arranged, and the extending direction of the first finger structure and the extending direction of the second finger structure are parallel to each other.

8. The electrothermal fabric of claim 1, wherein the first and second conductive layers are silver conductive layers, copper conductive layers, or conductive layers that are a combination of silver and copper.

9. The electrothermal fabric according to claim 1, wherein the electronic element emits far infrared light having a wavelength of 4 to 14 μm.

10. The electrothermal fabric of claim 1, wherein the electronic component is an infrared light emitting diode.