TWI643212B - Conductive linear substrate module - Google Patents

Abstract

A conductive wire module comprising a first wire and a second wire. The first wire comprises a yarn, a conductive layer, an insulating layer, and electronic components. The conductive layer is disposed on the yarn, and the conductive layer has a first conductive portion and a second conductive portion. The insulating layer is disposed on the yarn and is located between the first conductive portion and the second conductive portion. The electronic component is disposed on the yarn and electrically connected to the first conductive portion and the second conductive portion. The second wire wraps around the first wire along the path of the first wire.

Description

Conductive wire module

The invention relates to a conductive wire module.

In recent years, with the development of the Internet of Things, the development of wearable devices, many consumer products have also been designed to be combined with electronic components to achieve a network that enables consumer products to be interconnected.

With the Internet of Things, real objects can be connected to the Internet, so that the specific location of these objects can be detected on the Internet of Things. On the other hand, after these objects are connected to the Internet, the central computer can be used to centrally manage and control the objects, thereby searching for locations, preventing theft of objects or similar automatic control functions.

In order to realize the Internet of Things, consumer products are also designed to be combined with electronic tags, where electronic tags can be exchanged without any device contact. In this regard, how to achieve the issue of consumer products and electronic labels has become one of the current important research and development directions.

An embodiment of the invention provides a conductive wire module, which comprises The first wire and the second wire are included, wherein the second wire surrounds the first wire along a path of the first wire, and the first wire comprises a yarn, a conductive layer and an electronic component, wherein the electronic component may be a wireless RF chip and The wireless RF integrated circuit is included, and the electronic component is electrically connected to the conductive layer. The conductive layer covers the yarn and extends over the yarn to a length suitable for the operating conditions of the electronic component. By wrapping and covering the first wire with the second wire, the structural strength of the entire conductive wire module can be strengthened, thereby preventing the yarn of the first wire or the conductive layer from being broken.

An embodiment of the invention provides a conductive wire module comprising a first wire and a second wire. The first wire comprises a yarn, a conductive layer, an insulating layer, and electronic components. The conductive layer is disposed on the yarn, and the conductive layer has a first conductive portion and a second conductive portion. The insulating layer is disposed on the yarn and is located between the first conductive portion and the second conductive portion. The electronic component is disposed on the yarn and electrically connected to the first conductive portion and the second conductive portion. The second wire wraps around the first wire along the path of the first wire.

In some embodiments, the first wire has a first line portion, a second line portion, and a third line portion, and the second line portion is located between the first line portion and the third line portion, and the conductive layer is disposed only in the second line portion. And the second wire surrounds the first wire from the first line portion to the third line portion.

In some embodiments, the second wire has a wrapping density of 1000 TPM (Twist Per Meter) to 3000 TPM.

In some embodiments, the conductive wire module further includes a third wire, and the third wire surrounds the first wire and the second wire.

In some embodiments, the second wire and the third wire have different wrap directions.

In some embodiments, the third wire contacts the first wire.

In some embodiments, the third wire has a wrapping density of from 1000 TPM to 3000 TPM.

An embodiment of the invention provides a conductive wire module comprising a first wire and a second wire. The first wire comprises a yarn, a conductive layer, an insulating layer, and electronic components. The conductive layer is disposed on the yarn, and the conductive layer has a first conductive portion and a second conductive portion. The insulating layer is disposed on the yarn and is located between the first conductive portion and the second conductive portion. The electronic component is disposed on the yarn and electrically connected to the first conductive portion and the second conductive portion. The first wire wraps around the second wire along the path of the second wire.

In some embodiments, the first wire has a wrapping density of from 1000 TPM to 3000 TPM.

100, 500, 600‧‧‧ conductive wire module

102, 202, 302, 402, 502, 602‧‧‧ first wire

104, 504, 604‧‧‧ second wire

108, 208, 308, 408‧‧ yarn

110‧‧‧ Conductive layer

112, 212, 312, 412‧‧‧ first conductive parts

114‧‧‧Second Conductive Department

120‧‧‧Insulation

130‧‧‧Conductive adhesive

140‧‧‧Electronic components

142‧‧‧First pin

144‧‧‧second pin

309‧‧‧Depression

506, 606‧‧‧ third wire

1D-1D'‧‧‧ line segment

A1‧‧‧First line

A2‧‧‧ Second Line

A3‧‧‧ Third Line

T1‧‧‧ first end

T2‧‧‧ second end

FIG. 1A is a schematic diagram showing a conductive wire module according to a first embodiment of the disclosure.

FIG. 1B is a top view showing the first wire.

FIG. 1C is a schematic side view showing the first wire.

FIG. 1D is a schematic cross-sectional view of the line segment 1D-1D' taken along line 1B.

FIG. 1E is a schematic view showing the entirety of the first wire.

FIG. 2 is a cross-sectional view showing a conductive wire module according to a second embodiment of the present disclosure, the cross-sectional position of which is the same as that of FIG. 1D.

FIG. 3 illustrates a conductive wire module according to a third embodiment of the disclosure. A schematic cross-sectional view of the same section as the 1D.

4 is a cross-sectional view showing a conductive wire module according to a fourth embodiment of the present disclosure, the cross-sectional position of which is the same as that of FIG. 1D.

FIG. 5 is a cross-sectional view showing a conductive wire module according to a fifth embodiment of the present disclosure.

FIG. 6 is a cross-sectional view showing a conductive wire module according to a sixth embodiment of the present disclosure.

The embodiments of the present invention are disclosed in the following drawings, and the details of However, it should be understood that these practical details are not intended to limit the invention. That is, in some embodiments of the invention, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.

The conductive wire module of the present disclosure is provided with a wireless RF integrated circuit, so that the conductive wire module is functional, wherein the wireless RF integrated circuit can be wrapped by a wire to prevent radio frequency The integrated circuit is damaged. Please refer to FIG. 1A first. FIG. 1A is a schematic diagram showing the conductive wire module 100 according to the first embodiment of the disclosure. The conductive wire module 100 includes a first wire 102 and a second wire 104, wherein the first wire 102 can be a core wire and the second wire 104 can wrap around the first wire 102 along a path of the first wire 102.

The following description will first explain the structure of the first wire 102, In the conductive wire module 100 of FIG. 1A, if the second wire 104 is removed from the first wire 102, the structure of the first wire 102 can be as shown in FIG. 1B and FIG. 1C, wherein FIG. 1B A top view of the first wire 102 is shown, and a first side view of the first wire 102 is shown in FIG. 1C.

As shown in FIGS. 1B and 1C, the first wire 102 has a first line portion A1, a second line portion A2, and a third line portion A3. The second line portion A2 is located between the first line portion A1 and the third line portion A3, wherein when the second wire 104 (shown in FIG. 1A) wraps around the first wire 102 along the path of the first wire 102, The second wire 104 surrounds the first wire 102 from the first line portion A1 to the third line portion A3. In more detail, the first wire 102 includes the yarn 108, the conductive layer 110, the insulating layer 120, the conductive paste 130, and the electronic component 140, and the conductive layer 110, the insulating layer 120, the conductive paste 130, and the electronic component 140 may be located at the second In line A2.

The yarn 108 is flexible and its material may comprise polyethylene terephthalate (PET), polyurethane (TPU), polyamidamine (PI) or polypropylene (PP). The cross-sectional area of the yarn 108 can be 22 micrometers (μm) x 600 micrometers (μm) to 70 micrometers (μm) x 600 micrometers (μm). Further, the yarn 108 may be a monofilament or a multifilament, and its cross-sectional shape may approach a polygon, a circle, or an ellipse.

The conductive layer 110 is disposed on the yarn 108, wherein the conductive layer 110 is disposed only on the second line portion A2. The conductive layer 110 has a first conductive portion 112 and a second conductive portion 114. The first conductive portion 112 and the second conductive portion 114 cover the yarn 108. The first conductive portion 112 and the second conductive portion 114 may be formed by coating a conductive paste on the yarn 108, wherein the conductive paste may be a silver paste or a solder paste, and the first conductive portion 112 and the first conductive portion are formed. The thickness of the two conductive portions 114 can each be Between 5 micrometers (μm) and 30 micrometers (μm). Further, in the present embodiment, the first conductive portion 112 and the second conductive portion 114 are covered on the yarn 108 in a partially covered manner.

For example, please refer to FIG. 1B and FIG. 1D at the same time, wherein FIG. 1D shows a schematic cross-sectional view along the line segment 1D-1D′ of FIG. 1B. The cross-sectional shape of the yarn 108 may approach a circle and the surface of the yarn 108 may have a curvature. The first conductive portion 112 covers a partial surface of the yarn 108, and the first conductive portion 112 is conformal to the partial surface, that is, the first conductive portion 112 has substantially the same curvature as the yarn 108. The second conductive portion 114 is disposed opposite to the first conductive portion 112, and the arrangement relationship between the second conductive portion 114 and the yarn 108 may be substantially the same as the arrangement relationship between the first conductive portion 112 and the yarn 108.

Please return to Figure 1B and Figure 1C. The insulating layer 120 covers the yarn 108 and is disposed between the first conductive portion 112 and the second conductive portion 114 to serve as an insulating feature between the first conductive portion 112 and the second conductive portion 114. In addition, although the insulating layer 120 depicted in the present embodiment partially covers the yarn 108, the insulating layer 120 may completely coat the yarn 108, that is, the shape of the cross section of the insulating layer 120 may be annular. The insulating layer 120 may be formed by coating an insulating material on the yarn 108, wherein the insulating layer 120 may have a thickness of between 10 micrometers (μm) and 30 micrometers (μm), and the material thereof may be epoxy resin (Epoxy) ) or other suitable non-conductive materials.

The conductive paste 130 is disposed on the first conductive portion 112, the second conductive portion 114, and the insulating layer 120, which may be disposed via coating. The conductive paste 130 may extend from the first conductive portion 112 to the second conductive portion 114, that is, it is a single layer. In addition, the material of the conductive adhesive 130 may be an anisotropic conductive adhesive (Anisotropic) Conductive Paste; ACP), and its thickness can be between 10 micrometers (μm) and 30 micrometers (μm).

The electronic component 140 is disposed on the first conductive portion 112, the second conductive portion 114, the insulating layer 120, and the conductive paste 130. The electronic component 140 can be electrically connected to the first conductive portion 112 and the second conductive portion 114. Specifically, the electronic component 140 has a first pin 142 and a second pin 144. The first pin 142 and the second pin 144 are electrically connected to the first conductive portion 112 and the second conductive portion respectively through the conductive adhesive 130. Part 114. When the material of the conductive paste 130 is made of an anisotropic conductive paste, the conductive path from the first conductive portion 112 to the first pin 142 and the conductive path from the second conductive portion 114 to the second pin 144 are not A short circuit is generated. In the present embodiment, the electronic component 140 includes a wireless radio frequency integrated circuit, such as a radio frequency radio chip.

In other embodiments, the conductive paste 130 may also be a segmented layer, a portion of which may be located between the first conductive portion 112 and the first pin 142, and another portion of which may be located at the second conductive portion 114. Between the second pins 144, the two portions are completely disconnected (not shown). In this configuration, the material of the conductive paste 130 may be a silver paste or a solder paste in addition to the anisotropic conductive paste, and the thickness thereof may be between 10 micrometers (μm) and 30 micrometers (μm). .

Please see FIG. 1E again, and FIG. 1E is a schematic view showing the entire first wire 102. In order to clearly show the relationship between the components and the layers of the conductive wire module 100, the components or layers of the first wire 102 depicted in FIG. 1E are not shown in actual scale. Since the operating condition of the electronic component 140 is related to the load impedance thereof, the load impedance may include the impedance values of the first conductive portion 112 and the second conductive portion 114. Therefore, the first conductive portion 112 and the second conductive portion 114 The yarn 108 is extended to adjust its impedance value to suit the operating conditions of the electronic component 140.

Further, the yarn 108 has opposing first ends T1 and second ends T2. The first conductive portion 112 can extend from the insulating layer 120 toward the first end T1 of the yarn 108, wherein the extending path of the first conductive portion 112 is the same as the extending path of the yarn 108 covered by the first conductive portion 112, and the first conductive portion 112 The boundary may be spaced a distance from the first end T1 of the yarn 108 to facilitate wrapping of the second wire 104. In more detail, since the first conductive portion 112 and the first end T1 of the yarn 108 have a blank yarn, the second wire 104 may have a buffer zone to improve the wrapping processability when wrapping the first wire 102. And wrapping strength. The second conductive portion 114 may extend from the insulating layer 120 toward the second end T2 of the yarn 108, wherein the extending path of the second conductive portion 114 is also the same as the extending path of the yarn 108 covered by the second conductive portion. The boundary of 114 may also be spaced from the second end T2 of the yarn 108 to improve the wrapping processability. In addition, by controlling the extension lengths of the first conductive portion 112 and the second conductive portion 114, the impedance values of the first conductive portion 112 and the second conductive portion 114 can be adjusted, so that the load impedance of the electronic component 140 can conform to operating conditions. Specifically, the sum of the extension lengths of the first conductive portion 112 and the second conductive portion 114 on the yarn 108 may be between 15 cm (cm) and 20 cm (cm), and the total length of the yarn 108 may be greater than Or equal to the sum of the extended lengths of the first conductive portion 112 and the second conductive portion 114. For example, when the electronic component 140 is, for example, a radio frequency integrated circuit, the length of each of the first conductive portion 112 and the second conductive portion 114 is, for example, about 8 cm (cm), so that the wireless RF integrated circuit achieves a good feeling. Measure the effect.

In addition, in the present embodiment, the first conductive portion 112 And the second conductive portion 114 is spaced apart from the boundary between the two ends of the yarn 108, respectively. However, the disclosure is not limited thereto. In other embodiments, the first conductive portion 112 and the second conductive portion 114 may each be It is aligned with the boundary of both ends of the yarn 108.

Please return to FIG. 1A. In the structure of the conductive wire module 100 of FIG. 1A, since the second wire 104 surrounds the first wire 102, the conductive layer 110 and the insulating layer depicted in FIG. 1B and FIG. 120. The conductive paste 130 and the electronic component 140 may be wrapped in the second wire 104. According to the foregoing, since the yarn 108 of the first wire 102 can be sufficient to provide the conductive layer 110 for the purpose of adjusting the impedance value, in the structure of the first wire 102, the single yarn 108 can be used to carry the conductive layer 110, thereby simplifying The structure of the conductive wire module 100 also makes it easier for the second wire 104 to wrap around the first wire 102. Further, the material of the second wire 104 may include chemical fibers (such as polyester fibers or nylon fibers), natural fibers, and rayon fibers.

By wrapping and covering the first wire 102 with the second wire 104, the structural strength of the entire conductive wire module 100 can be strengthened, thereby preventing the yarn 108 of the first wire 102 or the conductive layer 110 from being broken. In addition, the second wire 104 can also isolate the electronic component 140 of the first wire 102 from the external environment, thereby preventing the electronic component 140 from falling off due to pulling. According to the above characteristics, the conductive wire module 100 can be applied as a material of a textile fabric, and the textile fabric is functional. For example, when the wearing of the clothing using the conductive wire module 100 as one of its materials, information about the wearing of the clothing can be recorded in the electronic component 140, thereby providing the wearing garment with a non-contact sensing function.

In addition, the second wire 104 wraps around the first wire 102 The density may be elastically adjusted depending on the use conditions, wherein the second wire 104 may have a wrapping density of 1000 TPM (Twist Per Meter) to 3000 TPM. In the range of the wrapped density, the degree of gain of the structural strength is higher as the first wire 102 approaches the full cladding; conversely, in the range of the wrapped density, when the first wire 102 is When a portion of the second wire 104 is exposed, the exposed portion of the conductive wire module 100 will have better softness. Therefore, the user can select the wrapping density of the second wire 104 according to the degree of protection or softness required. On the other hand, in order to easily wrap the first wire 102 around the first wire 102, the fiber strengths of the first wire 102 and the second wire 104 can be matched to each other, so that the structural strength of the single conductive wire module 100 is greater than 1 kilogram ( That is 9.8 Newtons).

Although the structure of the conductive wire module 100 of the present embodiment is such that the first wire 102 is wrapped by the second wire 104, the disclosure is not taken as an example. In other embodiments, the second wire 104 may be wrapped along the path of the second wire 104 using the first wire 102 without changing the structure of the first wire 102, wherein the conductive layer 110 and the electronic component 140 may be clipped. Between the yarn 108 and the second wire 104, in addition, the first wire 102 may have a wrapping density of from 1000 TPM to 3000 TPM. That is, in addition to the foregoing embodiment in which the second wire 104 is used as the wrapping material of the first wire 102, the first wire 102 can also be used as the wrapping material of the second wire 104, thereby achieving an improved conductive wire mold. The purpose of the strength of the group 100.

Referring to FIG. 2 again, FIG. 2 is a cross-sectional view showing the conductive wire module according to the second embodiment of the present disclosure, and the cross-sectional position thereof is the same as that of FIG. 1D. At least one difference between this embodiment and the first embodiment is that: In the first wire 202 of the present embodiment, the first conductive portion 212 completely covers the yarn 208. Here, the complete cladding means that the first conductive portion 212 is from the insulating layer (not shown, the position of which may be the same as the insulating layer 120 of FIG. 1E) toward the first end of the yarn 208 (not The first conductive portion 212 completely covers the surface of the yarn 208, and its cross-sectional shape will be as shown in FIG. 2, the position of which may be the same as the extended path of the first end T1) of FIG. 1E. Ring. The arrangement relationship between the second conductive portion and the yarn 208 may be substantially the same as the arrangement relationship between the first conductive portion 212 and the yarn 208, and therefore will not be described again. In addition, the first conductive portion 212 and the second conductive portion may be formed by impregnation.

Referring to FIG. 3 again, FIG. 3 is a cross-sectional view showing the conductive wire module according to the third embodiment of the present disclosure, and the cross-sectional position thereof is the same as that of FIG. 1C. At least one difference between this embodiment and the first embodiment is that in the first wire 302 of the present embodiment, the yarn 308 has a recess 309, and the first conductive portion 312 is positioned in the recess 309 of the yarn 308. Inside. The arrangement relationship of the second conductive portion with respect to the recess portion 309 may be substantially the same as the arrangement relationship of the first conductive portion 312 with respect to the recess portion 309, and thus will not be described again. In this embodiment, a portion of the yarn 308 may be removed by laser or etching to form the depressed portion 309, and then the first conductive portion 312 and the second conductive portion are filled into the recess portion 309.

Referring to FIG. 4 again, FIG. 4 is a cross-sectional view showing the conductive wire module according to the fourth embodiment of the present disclosure, and the cross-sectional position thereof is the same as that of FIG. 1D. At least one difference between this embodiment and the first embodiment is that in the first wire 402 of the present embodiment, the cross-sectional shape of the yarn 408 is a rectangle, wherein the first conductive portion 412 covers and partially covers the yarn 408. . The arrangement relationship between the second conductive portion and the yarn 408 may be combined with the first conductive portion 412 and the yarn 408 The configuration relationship between them is roughly the same, so it will not be described again. In addition, in the fourth embodiment, the fourth embodiment is illustrated as a rectangle for convenience of description, but the disclosure is not limited thereto. In other embodiments, it may also be a triangle, a pentagon or other suitable polygon. .

Referring to FIG. 5 again, FIG. 5 is a schematic diagram showing a conductive wire module 500 according to a fifth embodiment of the disclosure. At least one difference between this embodiment and the first embodiment is that the conductive wire module 500 of the present embodiment further includes a third wire 506, wherein the material of the third wire 506 may comprise chemical fibers (such as polyester fiber or nylon). Fiber), natural fibers and man-made fibers.

As shown in FIG. 5, the second wire 504 is wrapped around the first wire 502, and the third wire 506 is wrapped around the first wire 502 and the second wire 504, wherein the second wire 504 and the third wire 506 have different packages. The winding direction of the third wire 506 may be from 1000 TPM to 3000 TPM. For example, the winding direction of one of the second wire 504 and the third wire 506 is clockwise (S捻), and the winding direction of the other one is counterclockwise (Z捻), thereby lifting The structural strength of the conductive wire module 500 as a whole. In addition, the second wire 504 can completely enclose the first wire 502 therein, so when the third wire 506 wraps around the first wire 502 and the second wire 504, the first wire 502 is separated from the third wire 506. The opening is provided to provide greater protection to the first wire 502. On the other hand, the third wire 506 can also have dyeability, so that the appearance color of the conductive wire module 500 can be easily adjusted.

Referring to FIG. 6 again, FIG. 6 is a schematic diagram showing a conductive wire module 600 according to a sixth embodiment of the disclosure. At least one difference between this embodiment and the fifth embodiment is that the third wire 606 of the present embodiment is connected The first wire 602 is touched.

As shown in FIG. 6, the second wire 604 wraps around the first wire 602, and a portion of the first wire 602 is exposed from the second wire 604. Therefore, when the third wire 606 surrounds the first wire 602 and the first wire At the time of the two wires 604, the portion of the first wire 602 that is exposed from the second wire 604 contacts the third wire 606. Through this configuration, the conductive wire module 600 can have better softness and dyeability.

In summary, the conductive wire module of the present disclosure includes a first wire and a second wire, wherein the second wire surrounds the first wire along a path of the first wire, and the first wire includes the yarn, the conductive layer, and the electronic component. The electronic component may be a wireless radio frequency chip and may include a wireless radio frequency integrated circuit, and the electronic component is electrically connected to the conductive layer. The conductive layer covers the yarn and extends over the yarn to a length suitable for the operating conditions of the electronic component. With this configuration, in the structure of the conductive wire module, the effect of adjusting the impedance value of the conductive layer can be achieved by using a single yarn as a carrier. In addition, by wrapping and covering the first wire with the second wire, the structural strength of the entire conductive wire module can be strengthened, thereby preventing the yarn or the conductive layer of the first wire from being broken. According to the above characteristics, the conductive wire module can be adapted to be applied as a material of the fabric, thereby making the fabric functional.

While the invention has been described above in terms of various embodiments, it is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application attached.

Claims (11)

A conductive wire module comprising: a first wire comprising: a yarn; a conductive layer disposed on the yarn, wherein the conductive layer has a first conductive portion and a second conductive portion, and the first conductive portion And the second conductive portion extending along the same path of the yarn; an insulating layer disposed on the yarn and located between the first conductive portion and the second conductive portion; and an electronic component, And disposed on the yarn and electrically connected to the first conductive portion and the second conductive portion; and a second wire surrounding the first wire along a path of the first wire. The conductive wire module of claim 1, wherein the first wire has a first line portion, a second line portion, and a third line portion, and the second line portion is located at the first line portion Between the third line portion, the conductive layer is disposed only on the second line portion, and the second wire surrounds the first wire portion from the first line portion to the third line portion . The conductive wire module of claim 1, wherein the second wire has a wrapping density of 1000 TPM (Twist Per Meter) to 3000 TPM. For example, the conductive wire module described in claim 1 of the patent scope, A third wire is further included to surround the first wire and the second wire. The conductive wire module of claim 4, wherein the second wire and the third wire have different wrap directions. The conductive wire module of claim 4, wherein the third wire contacts the first wire. The conductive wire module of claim 4, wherein the third wire has a wrapping density of 1000 TPM (Twist Per Meter) to 3000 TPM. A conductive wire module comprising: a first wire comprising: a yarn; a conductive layer disposed on the yarn, wherein the conductive layer has a first conductive portion and a second conductive portion, and the first conductive portion And the second conductive portion extending along the same path of the yarn; an insulating layer disposed on the yarn and located between the first conductive portion and the second conductive portion; and an electronic component, Arranging on the yarn and electrically connected to the first conductive portion and the second conductive portion; and a second wire, the first wire wrapping the second along a path of the second wire Wire. The conductive wire module of claim 8, wherein the first wire has a wrapping density of 1000 TPM (Twist Per Meter) to 3000 TPM. The conductive wire module of claim 8, further comprising a third wire wrapped around the first wire and the second wire. The conductive wire module of claim 8, wherein the first wire and the third wire have different wrap directions.