CN213401156U

CN213401156U - Packaging structure for packaging microelectronic chip in fiber product

Info

Publication number: CN213401156U
Application number: CN202022637313.1U
Authority: CN
Inventors: 李璐; 李梦龙
Original assignee: Wuhan Tiejing Technology Co ltd
Current assignee: Wuhan Tiejing Technology Co ltd
Priority date: 2020-11-16
Filing date: 2020-11-16
Publication date: 2021-06-08
Anticipated expiration: 2030-11-16

Abstract

The utility model relates to an encapsulation technology field specifically is a packaging structure of microelectronic chip encapsulation in fiber product, including weaving yarn and electronic module, weaving yarn is used for carrying out the cladding to electronic module, forms the braided wire with conventional fibre same characteristic, electronic module is used for detecting the human body and forms the communication with external equipment. Compared with the prior art, this technical scheme encapsulates the fibre into with electronic chip, and overall structure not only can promote the stability of product, and electronic module can effectively strengthen the water washing resistance, encapsulates in the fibre, can provide better travelling comfort, and simultaneously, electronic chip hides in electronic module, has good disguise.

Description

Packaging structure for packaging microelectronic chip in fiber product

Technical Field

The utility model relates to a packaging technology field specifically is a microelectronic chip encapsulates the packaging structure in the fiber product.

Background

Wearing electronic textile is a novel product integrating electronic function and textile yarn, and the electronic textile needs to have the characteristics of stability, reliability, softness, comfort and the like, so that the electronic textile is not different from clothes. Electronic textiles belong to portable equipment and are mainly applied to the fields of entertainment, military, aerospace, sports, medical health and the like. Along with the improvement of living standard of people, people demand more and more for portability, intellectualization and function integration of electronic products, and wearable electronic textiles enter an era of high-speed development.

Electronic textiles can provide a very wide range of electronic functions including electronic detection, data processing and user interaction functions. Therefore, the electronic textile technology has great market potential, and the electronic function and the textile are stably and reliably integrated, so that the electronic textile technology plays a crucial role in the development of the wearable electronic industry.

Internationally, some research institutes and intelligent wearable device companies in the united states and europe have developed many electronic fabric products for medical and safety detection by using the combination of electronic detection function and textiles, but these electronic textiles are not packaged or simply packaged, so that most of these products have problems of physical reliability, which mainly shows that the forces (bending force, shearing force, pulling force, etc.) generated by the movement of the wearer can damage the electronic module mechanically and the water washing of the worn clothes can damage the electronic module mechanically.

The traditional packaging method (such as Glob-top) of electronic components and modules in the circuit board is suitable for the circuit board with a hard substrate, is not suitable for fine and high-energy wearable electronic equipment and cannot bear water washing. Therefore, the traditional method for electronically packaging the Glob-top is not suitable for flexible intelligent wearable equipment.

The product is dedicated to the packaging and assembling mode of a fine circuit or a high-precision electronic module such as an ultrathin electronic module (an electronic circuit control module), high-flexibility washable is realized, the circuit can be packaged on fibers of textiles, and the practicability is enhanced and the application range is widened for flexible electronic products with high-precision and high-resolution requirements, particularly high-intelligent wearable electronic equipment products.

SUMMERY OF THE UTILITY MODEL

The utility model discloses a solve the power (bending force, shearing force and pulling force etc.) that prior art's wearer's motion produced and to the mechanical damage problem of electronic module of the washing of dressing clothing to electronic module's mechanical damage problem, provide a packaging structure of microelectronic chip encapsulation in the fiber products.

The utility model discloses a following technical scheme realizes:

a package structure of a microelectronic chip packaged in a fiber product comprises textile yarns and an electronic module, wherein the textile yarns are used for wrapping the electronic module to form textile wires with the same characteristics as conventional fibers, and the electronic module is used for detecting a human body and communicating with external equipment.

Further, the textile yarn comprises wrapping fibers, surrounding fibers and carrier fibers, the electronic module is loaded on the carrier fibers, the surrounding fibers and the carrier fibers are arranged in parallel, the surrounding fibers are arranged on the upper portion and the lower portion of the carrier fibers, and the wrapping fibers wrap the surrounding fibers and the carrier fibers.

The textile yarn acts as a normal fiber and can be used to make clothing.

Furthermore, the electronic module comprises an upper substrate, an electronic chip and a lower substrate, the lower substrate is arranged in the textile yarns, the electronic chip is connected to the surface of the lower substrate, and the surface of the electronic chip is covered by the upper substrate.

The upper substrate and the lower substrate are both made of flexible materials, and particularly can be made of flexible polyimide materials.

The upper substrate, the electronic chip and the lower substrate are arranged in an upper, middle and lower structure.

Further, a filler is filled around the electronic chip between the upper substrate and the lower substrate.

The filler is used for filling gaps among the upper substrate, the electronic chip and the lower substrate, and ensuring the structural stability among the upper substrate, the electronic chip and the lower substrate.

Further, a conductive block is arranged between the electronic chip and the lower substrate.

The conductive blocks have a conductive function, and can be electrically connected by conductive adhesive or welding, so that the electric communication between the electronic chip and the lower substrate is ensured.

Furthermore, the upper substrate is provided with a convex groove covering the electronic chip part.

The convex groove protects the electronic chip.

Furthermore, the surface of the lower substrate is provided with a connecting circuit.

The connecting circuit is used for realizing the connection between the chips or the connection between the chips and the circuit.

Furthermore, the convex groove comprises four convex walls and a flat top, a convex space is formed by the convex groove, and the shape of the convex groove is matched with that of the electronic chip.

Further, the electronic chip is arranged on a neutral axis of the textile yarn.

The neutral axis is generally a line or a plane, and is bent when an object is subjected to an external force, the neutral axis position in the object is free from any bending or stretching force, and the electronic chip is placed at the neutral axis position of the packaging structure, so that the stress on the electronic chip is minimized, and the service life of the package is greatly prolonged.

Furthermore, the thickness of the upper substrate and the thickness of the lower substrate are not higher than 100 micrometers, the width of the upper substrate and the width of the lower substrate are not more than 0.5 millimeter, the length of the upper substrate and the length of the lower substrate are not more than 2 centimeters, and the thickness of the electronic chip is lower than 100 micrometers.

Compared with the prior art, the utility model, following advantage and beneficial effect have:

compared with the prior art, this technical scheme encapsulates the fibre into with electronic chip, and overall structure not only can promote the stability of product, and electronic module can effectively strengthen the water washing resistance, encapsulates in the fibre, can provide better travelling comfort, and simultaneously, electronic chip hides in electronic module, has good disguise.

Drawings

The accompanying drawings, which are included to provide a further understanding of the embodiments of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the principles of the invention. In the drawings:

fig. 1 is a schematic structural view of the present invention;

fig. 2 is a schematic structural diagram of the electronic module of the present invention;

FIG. 3 is a schematic diagram of the electronic module package expansion according to the present invention;

fig. 4 is a schematic view of the layered structure of the electronic module of the present invention;

designations in the drawings and names of corresponding parts:

in the figure: the electronic module comprises textile yarns 1, an electronic module 2, an upper substrate 3, an electronic chip 4, a lower substrate 5, a filler 6, a conductive block 7, wrapping fibers 11, surrounding fibers 12 and carrier fibers 13.

Detailed Description

To make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the following examples and drawings, and the exemplary embodiments and descriptions thereof of the present invention are only used for explaining the present invention, and are not intended as limitations of the present invention.

Examples

As shown in fig. 1 to 4, a package structure for packaging a microelectronic chip in a fiber product includes a textile yarn 1 and an electronic module 2, wherein the textile yarn 1 is used for wrapping the electronic module 2 to form a textile yarn with the same characteristics as a conventional fiber, and the electronic module 2 is used for detecting a human body and communicating with an external device.

Preferably, the textile yarn 1 includes a wrapping fiber 11, a surrounding fiber 12 and a carrier fiber 13, the electronic module 2 is loaded on the carrier fiber 13, the surrounding fiber 12 is disposed in parallel with the carrier fiber 13, the surrounding fiber 12 is disposed on the upper portion and the lower portion of the carrier fiber 13, and the wrapping fiber 11 wraps the surrounding fiber 12 and the carrier fiber 13.

Preferably, the electronic module 2 includes an upper substrate 3, an electronic chip 4 and a lower substrate 5, the lower substrate 5 is disposed in the textile yarn 1, the electronic chip 4 is connected to the surface of the lower substrate 5, and the upper substrate 3 covers the surface of the electronic chip 4.

Preferably, a filler 6 is filled around the electronic chip 4 between the upper substrate 3 and the lower substrate 5.

Preferably, a conductive block 7 is disposed between the electronic chip 4 and the lower substrate 5.

Preferably, the upper substrate 3 is provided with a groove at a portion covering the electronic chip 4.

Preferably, the surface of the lower substrate 5 is provided with a connecting circuit.

Preferably, the convex groove comprises four convex walls and a flat top, the convex groove forms a convex space, and the shape of the convex groove is matched with that of the electronic chip 4.

Preferably, the electronic chip 4 is arranged on the neutral axis of the textile yarn 1.

Preferably, the thicknesses of the upper substrate 3 and the lower substrate 5 are not higher than 100 micrometers, the widths of the upper substrate 3 and the lower substrate 5 are not more than 0.5 millimeter, the lengths of the upper substrate 3 and the lower substrate 5 are not more than 2 centimeters, and the thickness of the electronic chip 4 is lower than 100 micrometers.

Working principle or assembly method:

1. the electronic chip is first electrically bonded or attached with conductive glue to the lower substrate containing the integrated circuit.

2. And filling glue is injected into the gap between the electronic chip and the lower substrate to reinforce the connection between the electronic chip and the lower substrate.

3. And injecting upper-layer filling glue on the electronic chip.

4. And injecting a proper amount of filling glue into the convex groove of the upper substrate and injecting the filling glue into the joint of the rest upper substrate and the rest lower substrate.

5. The upper and lower substrates were combined and the combination was placed in a box vacuum machine to remove air bubbles from the package.

6. The packaged electronic module and the carrier are woven into a yarn by a weaving machine to form the multifunctional electronic fiber, wherein the yarn surrounds the fiber and covers the fiber.

The above-mentioned embodiments, further detailed description of the objects, technical solutions and advantages of the present invention, it should be understood that the above description is only the embodiments of the present invention, and is not intended to limit the scope of the present invention, and any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the scope of the present invention.

Claims

1. A package structure for packaging a microelectronic chip in a fiber product is characterized in that: the textile yarn comprises textile yarn (1) and an electronic module (2), wherein the textile yarn (1) is used for coating the electronic module (2) to form a textile yarn with the same characteristics as conventional fibers, and the electronic module (2) is used for detecting a human body and communicating with external equipment.

2. The package structure of claim 1, wherein: textile yarn (1) is including parcel fibre (11), encircle fibre (12) and carrier fiber (13), electronic module (2) loads on carrier fiber (13), encircle fibre (12) with carrier fiber (13) parallel arrangement, just encircle fibre (12) set up in carrier fiber (13) upper portion and lower part, parcel fibre (11) parcel encircle fibre (12) with carrier fiber (13).

3. The package structure of claim 1, wherein: the electronic module (2) comprises an upper substrate (3), an electronic chip (4) and a lower substrate (5), the lower substrate (5) is arranged in the textile yarns (1), the electronic chip (4) is connected to the surface of the lower substrate (5), and the upper substrate (3) covers the surface of the electronic chip (4).

4. The package structure of claim 3, wherein: and a filler (6) is filled around the electronic chip (4) between the upper substrate (3) and the lower substrate (5).

5. The package structure of claim 3, wherein: and a conductive block (7) is arranged between the electronic chip (4) and the lower substrate (5).

6. The package structure of claim 3, wherein: the upper substrate (3) is provided with a convex groove at the part covering the electronic chip (4).

7. The package structure of claim 3, wherein: and the surface of the lower substrate (5) is provided with a connecting circuit.

8. The package structure of claim 6, wherein: the convex groove comprises four convex walls and a flat top, a convex space is formed by the convex groove, and the shape of the convex groove is matched with that of the electronic chip (4).

9. A package structure of a microelectronic chip packaged in a fibrous product according to any of claims 3 to 8, wherein: the electronic chip (4) is arranged on a neutral axis of the textile yarn (1).

10. A package structure of a microelectronic chip packaged in a fibrous product according to any of claims 3 to 8, wherein: the thickness of the upper substrate (3) and the thickness of the lower substrate (5) are both not higher than 100 micrometers, the width of the upper substrate (3) and the width of the lower substrate (5) are both not more than 0.5 millimeter, the length of the upper substrate (3) and the length of the lower substrate (5) are not more than 2 centimeters, and the thickness of the electronic chip (4) is lower than 100 micrometers.