IT201700087346A1 - Assemblaggio integrato di un microfono e di un sensore di pressione microelettromeccanici e relativo procedimento di fabbricazione - Google Patents
Assemblaggio integrato di un microfono e di un sensore di pressione microelettromeccanici e relativo procedimento di fabbricazioneInfo
- Publication number
- IT201700087346A1 IT201700087346A1 IT102017000087346A IT201700087346A IT201700087346A1 IT 201700087346 A1 IT201700087346 A1 IT 201700087346A1 IT 102017000087346 A IT102017000087346 A IT 102017000087346A IT 201700087346 A IT201700087346 A IT 201700087346A IT 201700087346 A1 IT201700087346 A1 IT 201700087346A1
- Authority
- IT
- Italy
- Prior art keywords
- microelettromechanics
- microphone
- manufacturing
- pressure sensor
- integrated assembly
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
- B81B3/0021—Transducers for transforming electrical into mechanical energy or vice versa
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
- B81C1/00158—Diaphragms, membranes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00309—Processes for packaging MEMS devices suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
- H04R1/028—Casings; Cabinets ; Supports therefor; Mountings therein associated with devices performing functions other than acoustics, e.g. electric candles
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Computer Hardware Design (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT102017000087346A IT201700087346A1 (it) | 2017-07-28 | 2017-07-28 | Assemblaggio integrato di un microfono e di un sensore di pressione microelettromeccanici e relativo procedimento di fabbricazione |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT102017000087346A IT201700087346A1 (it) | 2017-07-28 | 2017-07-28 | Assemblaggio integrato di un microfono e di un sensore di pressione microelettromeccanici e relativo procedimento di fabbricazione |
Publications (1)
Publication Number | Publication Date |
---|---|
IT201700087346A1 true IT201700087346A1 (it) | 2019-01-28 |
Family
ID=60570139
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT102017000087346A IT201700087346A1 (it) | 2017-07-28 | 2017-07-28 | Assemblaggio integrato di un microfono e di un sensore di pressione microelettromeccanici e relativo procedimento di fabbricazione |
Country Status (1)
Country | Link |
---|---|
IT (1) | IT201700087346A1 (it) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140264662A1 (en) * | 2013-03-14 | 2014-09-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | MEMS Integrated Pressure Sensor and Microphone Devices and Methods of Forming Same |
US20150125003A1 (en) * | 2013-11-06 | 2015-05-07 | Infineon Technologies Ag | System and Method for a MEMS Transducer |
US20150197419A1 (en) * | 2014-01-16 | 2015-07-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Mems devices and methods for forming same |
US9661411B1 (en) * | 2015-12-01 | 2017-05-23 | Apple Inc. | Integrated MEMS microphone and vibration sensor |
-
2017
- 2017-07-28 IT IT102017000087346A patent/IT201700087346A1/it unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140264662A1 (en) * | 2013-03-14 | 2014-09-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | MEMS Integrated Pressure Sensor and Microphone Devices and Methods of Forming Same |
US20150125003A1 (en) * | 2013-11-06 | 2015-05-07 | Infineon Technologies Ag | System and Method for a MEMS Transducer |
US20150197419A1 (en) * | 2014-01-16 | 2015-07-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Mems devices and methods for forming same |
US9661411B1 (en) * | 2015-12-01 | 2017-05-23 | Apple Inc. | Integrated MEMS microphone and vibration sensor |
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