IT201700083957A1 - Metodo e apparato per il trattamento di pannelli - Google Patents

Metodo e apparato per il trattamento di pannelli

Info

Publication number
IT201700083957A1
IT201700083957A1 IT102017000083957A IT201700083957A IT201700083957A1 IT 201700083957 A1 IT201700083957 A1 IT 201700083957A1 IT 102017000083957 A IT102017000083957 A IT 102017000083957A IT 201700083957 A IT201700083957 A IT 201700083957A IT 201700083957 A1 IT201700083957 A1 IT 201700083957A1
Authority
IT
Italy
Prior art keywords
panel treatment
panel
treatment
Prior art date
Application number
IT102017000083957A
Other languages
English (en)
Inventor
Massimo Fiorani
Original Assignee
Wise S R L
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wise S R L filed Critical Wise S R L
Priority to IT102017000083957A priority Critical patent/IT201700083957A1/it
Priority to EP18747015.8A priority patent/EP3659407B1/en
Priority to US16/626,859 priority patent/US11483933B2/en
Priority to CN201880049693.XA priority patent/CN110945975A/zh
Priority to PCT/IB2018/054847 priority patent/WO2019021086A1/en
Publication of IT201700083957A1 publication Critical patent/IT201700083957A1/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/26—Plasma torches
    • H05H1/32—Plasma torches using an arc
    • H05H1/34—Details, e.g. electrodes, nozzles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Plasma Technology (AREA)
IT102017000083957A 2017-07-24 2017-07-24 Metodo e apparato per il trattamento di pannelli IT201700083957A1 (it)

Priority Applications (5)

Application Number Priority Date Filing Date Title
IT102017000083957A IT201700083957A1 (it) 2017-07-24 2017-07-24 Metodo e apparato per il trattamento di pannelli
EP18747015.8A EP3659407B1 (en) 2017-07-24 2018-06-29 Method and equipment for the treatment of panels
US16/626,859 US11483933B2 (en) 2017-07-24 2018-06-29 Method and equipment for the treatment of panels
CN201880049693.XA CN110945975A (zh) 2017-07-24 2018-06-29 用于处理板的方法和设备
PCT/IB2018/054847 WO2019021086A1 (en) 2017-07-24 2018-06-29 METHOD AND EQUIPMENT FOR PROCESSING PANELS

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT102017000083957A IT201700083957A1 (it) 2017-07-24 2017-07-24 Metodo e apparato per il trattamento di pannelli

Publications (1)

Publication Number Publication Date
IT201700083957A1 true IT201700083957A1 (it) 2019-01-24

Family

ID=60570111

Family Applications (1)

Application Number Title Priority Date Filing Date
IT102017000083957A IT201700083957A1 (it) 2017-07-24 2017-07-24 Metodo e apparato per il trattamento di pannelli

Country Status (5)

Country Link
US (1) US11483933B2 (it)
EP (1) EP3659407B1 (it)
CN (1) CN110945975A (it)
IT (1) IT201700083957A1 (it)
WO (1) WO2019021086A1 (it)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112476595A (zh) * 2021-01-05 2021-03-12 成都六志和科技有限公司 一种电路板钻孔机用钻孔废料清理装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1244136A2 (en) * 2001-03-21 2002-09-25 Nordson Corporation Material handling system and method for a multi-workpiece plasma treatment system
DE102008028167A1 (de) * 2008-06-12 2009-12-31 Maschinenfabrik Reinhausen Gmbh Vorrichtung zur Erzeugung eines Plasma-Jets

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4252595A (en) * 1976-01-29 1981-02-24 Tokyo Shibaura Electric Co., Ltd. Etching apparatus using a plasma
US4840702A (en) * 1987-12-29 1989-06-20 Action Technologies, Inc. Apparatus and method for plasma treating of circuit boards
JPH06155398A (ja) * 1992-11-25 1994-06-03 Osaki Eng Kk Ｐｃｂ加工機およびその運転方法
US6245189B1 (en) * 1994-12-05 2001-06-12 Nordson Corporation High Throughput plasma treatment system
US6006763A (en) * 1995-01-11 1999-12-28 Seiko Epson Corporation Surface treatment method
JPH09326385A (ja) * 1996-06-04 1997-12-16 Tokyo Electron Ltd 基板冷却方法
US6972071B1 (en) * 1999-07-13 2005-12-06 Nordson Corporation High-speed symmetrical plasma treatment system
US6406991B2 (en) * 1999-12-27 2002-06-18 Hoya Corporation Method of manufacturing a contact element and a multi-layered wiring substrate, and wafer batch contact board
US20030000830A1 (en) * 2001-02-23 2003-01-02 Techquip International, Inc. Stacked panel processing apparatus and methods
JP2003007682A (ja) * 2001-06-25 2003-01-10 Matsushita Electric Ind Co Ltd プラズマ処理装置用の電極部材
JP4030784B2 (ja) * 2002-03-27 2008-01-09 松下電器産業株式会社 層間接続方法と装置及び多層基板
DE10321889A1 (de) * 2003-05-07 2004-12-02 Gebr. Schmid Gmbh & Co. Verfahren und Vorrichtung zur Behandlung der Oberfläche eines flächigen Substrats
US7767025B2 (en) * 2007-09-30 2010-08-03 Intel Corporation Nozzle array configuration to facilitate deflux process improvement in chip attach process
IT1399202B1 (it) * 2010-03-30 2013-04-11 Corbelli Metodo per la produzione di manufatti elastomerici funzionalizzati e manufatti cosi' ottenuti
CN202738270U (zh) * 2012-06-20 2013-02-13 艾威尔电路（深圳）有限公司 用于ptfe的等离子处理机
US9378969B2 (en) * 2014-06-19 2016-06-28 Applied Materials, Inc. Low temperature gas-phase carbon removal

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1244136A2 (en) * 2001-03-21 2002-09-25 Nordson Corporation Material handling system and method for a multi-workpiece plasma treatment system
DE102008028167A1 (de) * 2008-06-12 2009-12-31 Maschinenfabrik Reinhausen Gmbh Vorrichtung zur Erzeugung eines Plasma-Jets

Also Published As

Publication number Publication date
US11483933B2 (en) 2022-10-25
EP3659407A1 (en) 2020-06-03
WO2019021086A1 (en) 2019-01-31
EP3659407C0 (en) 2023-07-12
CN110945975A (zh) 2020-03-31
EP3659407B1 (en) 2023-07-12
US20200245467A1 (en) 2020-07-30

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