IT201700083957A1 - Metodo e apparato per il trattamento di pannelli - Google Patents
Metodo e apparato per il trattamento di pannelliInfo
- Publication number
- IT201700083957A1 IT201700083957A1 IT102017000083957A IT201700083957A IT201700083957A1 IT 201700083957 A1 IT201700083957 A1 IT 201700083957A1 IT 102017000083957 A IT102017000083957 A IT 102017000083957A IT 201700083957 A IT201700083957 A IT 201700083957A IT 201700083957 A1 IT201700083957 A1 IT 201700083957A1
- Authority
- IT
- Italy
- Prior art keywords
- panel treatment
- panel
- treatment
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/26—Plasma torches
- H05H1/32—Plasma torches using an arc
- H05H1/34—Details, e.g. electrodes, nozzles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Plasma Technology (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT102017000083957A IT201700083957A1 (it) | 2017-07-24 | 2017-07-24 | Metodo e apparato per il trattamento di pannelli |
CN201880049693.XA CN110945975A (zh) | 2017-07-24 | 2018-06-29 | 用于处理板的方法和设备 |
EP18747015.8A EP3659407B1 (en) | 2017-07-24 | 2018-06-29 | Method and equipment for the treatment of panels |
US16/626,859 US11483933B2 (en) | 2017-07-24 | 2018-06-29 | Method and equipment for the treatment of panels |
PCT/IB2018/054847 WO2019021086A1 (en) | 2017-07-24 | 2018-06-29 | METHOD AND EQUIPMENT FOR PROCESSING PANELS |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT102017000083957A IT201700083957A1 (it) | 2017-07-24 | 2017-07-24 | Metodo e apparato per il trattamento di pannelli |
Publications (1)
Publication Number | Publication Date |
---|---|
IT201700083957A1 true IT201700083957A1 (it) | 2019-01-24 |
Family
ID=60570111
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT102017000083957A IT201700083957A1 (it) | 2017-07-24 | 2017-07-24 | Metodo e apparato per il trattamento di pannelli |
Country Status (5)
Country | Link |
---|---|
US (1) | US11483933B2 (it) |
EP (1) | EP3659407B1 (it) |
CN (1) | CN110945975A (it) |
IT (1) | IT201700083957A1 (it) |
WO (1) | WO2019021086A1 (it) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112476595A (zh) * | 2021-01-05 | 2021-03-12 | 成都六志和科技有限公司 | 一种电路板钻孔机用钻孔废料清理装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1244136A2 (en) * | 2001-03-21 | 2002-09-25 | Nordson Corporation | Material handling system and method for a multi-workpiece plasma treatment system |
DE102008028167A1 (de) * | 2008-06-12 | 2009-12-31 | Maschinenfabrik Reinhausen Gmbh | Vorrichtung zur Erzeugung eines Plasma-Jets |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4252595A (en) * | 1976-01-29 | 1981-02-24 | Tokyo Shibaura Electric Co., Ltd. | Etching apparatus using a plasma |
US4840702A (en) * | 1987-12-29 | 1989-06-20 | Action Technologies, Inc. | Apparatus and method for plasma treating of circuit boards |
JPH06155398A (ja) * | 1992-11-25 | 1994-06-03 | Osaki Eng Kk | Pcb加工機およびその運転方法 |
US6245189B1 (en) * | 1994-12-05 | 2001-06-12 | Nordson Corporation | High Throughput plasma treatment system |
US6006763A (en) * | 1995-01-11 | 1999-12-28 | Seiko Epson Corporation | Surface treatment method |
JPH09326385A (ja) * | 1996-06-04 | 1997-12-16 | Tokyo Electron Ltd | 基板冷却方法 |
US6972071B1 (en) * | 1999-07-13 | 2005-12-06 | Nordson Corporation | High-speed symmetrical plasma treatment system |
US6406991B2 (en) * | 1999-12-27 | 2002-06-18 | Hoya Corporation | Method of manufacturing a contact element and a multi-layered wiring substrate, and wafer batch contact board |
WO2002069679A2 (en) * | 2001-02-23 | 2002-09-06 | Techquip International, Inc. | Stacked panel processing apparatus and methods |
JP2003007682A (ja) * | 2001-06-25 | 2003-01-10 | Matsushita Electric Ind Co Ltd | プラズマ処理装置用の電極部材 |
JP4030784B2 (ja) * | 2002-03-27 | 2008-01-09 | 松下電器産業株式会社 | 層間接続方法と装置及び多層基板 |
DE10321889A1 (de) * | 2003-05-07 | 2004-12-02 | Gebr. Schmid Gmbh & Co. | Verfahren und Vorrichtung zur Behandlung der Oberfläche eines flächigen Substrats |
US7767025B2 (en) * | 2007-09-30 | 2010-08-03 | Intel Corporation | Nozzle array configuration to facilitate deflux process improvement in chip attach process |
IT1399202B1 (it) * | 2010-03-30 | 2013-04-11 | Corbelli | Metodo per la produzione di manufatti elastomerici funzionalizzati e manufatti cosi' ottenuti |
CN202738270U (zh) * | 2012-06-20 | 2013-02-13 | 艾威尔电路(深圳)有限公司 | 用于ptfe的等离子处理机 |
US9378969B2 (en) * | 2014-06-19 | 2016-06-28 | Applied Materials, Inc. | Low temperature gas-phase carbon removal |
-
2017
- 2017-07-24 IT IT102017000083957A patent/IT201700083957A1/it unknown
-
2018
- 2018-06-29 WO PCT/IB2018/054847 patent/WO2019021086A1/en unknown
- 2018-06-29 CN CN201880049693.XA patent/CN110945975A/zh active Pending
- 2018-06-29 EP EP18747015.8A patent/EP3659407B1/en active Active
- 2018-06-29 US US16/626,859 patent/US11483933B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1244136A2 (en) * | 2001-03-21 | 2002-09-25 | Nordson Corporation | Material handling system and method for a multi-workpiece plasma treatment system |
DE102008028167A1 (de) * | 2008-06-12 | 2009-12-31 | Maschinenfabrik Reinhausen Gmbh | Vorrichtung zur Erzeugung eines Plasma-Jets |
Also Published As
Publication number | Publication date |
---|---|
US20200245467A1 (en) | 2020-07-30 |
WO2019021086A1 (en) | 2019-01-31 |
CN110945975A (zh) | 2020-03-31 |
EP3659407B1 (en) | 2023-07-12 |
EP3659407A1 (en) | 2020-06-03 |
US11483933B2 (en) | 2022-10-25 |
EP3659407C0 (en) | 2023-07-12 |
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