IT1399906B1 - Metodo per la pulitura di una piazzola di contatto di una microstruttura e relative sonda di contatto a sbalzo e testa di misura a sonde a sbalzo [cantilever]. - Google Patents

Metodo per la pulitura di una piazzola di contatto di una microstruttura e relative sonda di contatto a sbalzo e testa di misura a sonde a sbalzo [cantilever].

Info

Publication number
IT1399906B1
IT1399906B1 ITMI2010A000724A ITMI20100724A IT1399906B1 IT 1399906 B1 IT1399906 B1 IT 1399906B1 IT MI2010A000724 A ITMI2010A000724 A IT MI2010A000724A IT MI20100724 A ITMI20100724 A IT MI20100724A IT 1399906 B1 IT1399906 B1 IT 1399906B1
Authority
IT
Italy
Prior art keywords
microstructure
cantilever
cleaning
head
contact
Prior art date
Application number
ITMI2010A000724A
Other languages
English (en)
Inventor
Riccardo Vettori
Original Assignee
Technoprobe Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Technoprobe Spa filed Critical Technoprobe Spa
Priority to ITMI2010A000724A priority Critical patent/IT1399906B1/it
Priority to PCT/EP2011/002096 priority patent/WO2011134645A1/en
Publication of ITMI20100724A1 publication Critical patent/ITMI20100724A1/it
Priority to US13/661,980 priority patent/US8981803B2/en
Application granted granted Critical
Publication of IT1399906B1 publication Critical patent/IT1399906B1/it

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2898—Sample preparation, e.g. removing encapsulation, etching
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
ITMI2010A000724A 2010-04-28 2010-04-28 Metodo per la pulitura di una piazzola di contatto di una microstruttura e relative sonda di contatto a sbalzo e testa di misura a sonde a sbalzo [cantilever]. IT1399906B1 (it)

Priority Applications (3)

Application Number Priority Date Filing Date Title
ITMI2010A000724A IT1399906B1 (it) 2010-04-28 2010-04-28 Metodo per la pulitura di una piazzola di contatto di una microstruttura e relative sonda di contatto a sbalzo e testa di misura a sonde a sbalzo [cantilever].
PCT/EP2011/002096 WO2011134645A1 (en) 2010-04-28 2011-04-27 Method for cleaning a contact pad of a microstructure and corresponding cantilever contact probe
US13/661,980 US8981803B2 (en) 2010-04-28 2012-10-26 Method for cleaning a contact pad of a microstructure and corresponding cantilever contact probe and probe testing head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITMI2010A000724A IT1399906B1 (it) 2010-04-28 2010-04-28 Metodo per la pulitura di una piazzola di contatto di una microstruttura e relative sonda di contatto a sbalzo e testa di misura a sonde a sbalzo [cantilever].

Publications (2)

Publication Number Publication Date
ITMI20100724A1 ITMI20100724A1 (it) 2011-10-29
IT1399906B1 true IT1399906B1 (it) 2013-05-09

Family

ID=43417084

Family Applications (1)

Application Number Title Priority Date Filing Date
ITMI2010A000724A IT1399906B1 (it) 2010-04-28 2010-04-28 Metodo per la pulitura di una piazzola di contatto di una microstruttura e relative sonda di contatto a sbalzo e testa di misura a sonde a sbalzo [cantilever].

Country Status (3)

Country Link
US (1) US8981803B2 (it)
IT (1) IT1399906B1 (it)
WO (1) WO2011134645A1 (it)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2725363B9 (de) * 2012-10-24 2015-03-25 Multitest elektronische Systeme GmbH Kontaktfeder für einen Prüfsockel für die Hochstrom-Prüfung eines elektronischen Bauteils
JP6407672B2 (ja) * 2014-11-18 2018-10-17 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
CN112797922B (zh) * 2019-11-13 2024-03-19 中国航发南方工业有限公司 用于叶片小微孔角度测量的测量针的使用方法
JP2021117085A (ja) * 2020-01-24 2021-08-10 ミネベアミツミ株式会社 プローブ、測定装置、及び測定方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01219566A (ja) * 1988-02-26 1989-09-01 Nec Corp プローブ・カード
US5763879A (en) * 1996-09-16 1998-06-09 Pacific Western Systems Diamond probe tip
US20030102878A1 (en) * 2001-10-24 2003-06-05 Montoya Thomas T. Bore probe card and method of testing
US7759949B2 (en) * 2004-05-21 2010-07-20 Microprobe, Inc. Probes with self-cleaning blunt skates for contacting conductive pads
JP2007218840A (ja) * 2006-02-20 2007-08-30 Fujitsu Ltd プローブ、プローブカード及び検査装置
WO2007133585A2 (en) * 2006-05-11 2007-11-22 Anasys Instruments Quantitative calorimetry signal for sub-micron scale thermal analysis

Also Published As

Publication number Publication date
US8981803B2 (en) 2015-03-17
US20130049782A1 (en) 2013-02-28
WO2011134645A1 (en) 2011-11-03
ITMI20100724A1 (it) 2011-10-29

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