IT1215023B - Dispositivo e semiconduttore incapsulato in resina ed elettronicamente isolato e procedimento per lasua fabbricazione - Google Patents
Dispositivo e semiconduttore incapsulato in resina ed elettronicamente isolato e procedimento per lasua fabbricazioneInfo
- Publication number
- IT1215023B IT1215023B IT8606611A IT661186A IT1215023B IT 1215023 B IT1215023 B IT 1215023B IT 8606611 A IT8606611 A IT 8606611A IT 661186 A IT661186 A IT 661186A IT 1215023 B IT1215023 B IT 1215023B
- Authority
- IT
- Italy
- Prior art keywords
- lasua
- semiconductor
- manufacture
- resin
- encapsulated device
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT8606611A IT1215023B (it) | 1986-08-27 | 1986-08-27 | Dispositivo e semiconduttore incapsulato in resina ed elettronicamente isolato e procedimento per lasua fabbricazione |
| EP87201454A EP0257681A3 (en) | 1986-08-27 | 1987-07-30 | Method for manufacturing plastic encapsulated semiconductor devices and devices obtained thereby |
| PH35722A PH25368A (en) | 1986-08-27 | 1987-08-24 | Method for manufacturing plastic encapsulated semiconducter devices |
| JP62209401A JPS6362239A (ja) | 1986-08-27 | 1987-08-25 | プラスチックカプセル封じ半導体デバイスの製造方法 |
| KR1019870009326A KR880003426A (ko) | 1986-08-27 | 1987-08-26 | 플라스틱 캡슐형 반도체 장치 및 이의 제조 방법 |
| US07/090,142 US4888307A (en) | 1986-08-27 | 1987-08-27 | Method for manufacturing plastic encapsulated semiconductor devices |
| MYPI87001498A MY102351A (en) | 1986-08-27 | 1987-09-01 | Encapsulation for semiconductor devices. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT8606611A IT1215023B (it) | 1986-08-27 | 1986-08-27 | Dispositivo e semiconduttore incapsulato in resina ed elettronicamente isolato e procedimento per lasua fabbricazione |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IT8606611A0 IT8606611A0 (it) | 1986-08-27 |
| IT1215023B true IT1215023B (it) | 1990-01-31 |
Family
ID=11121391
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT8606611A IT1215023B (it) | 1986-08-27 | 1986-08-27 | Dispositivo e semiconduttore incapsulato in resina ed elettronicamente isolato e procedimento per lasua fabbricazione |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPS6362239A (ko) |
| KR (1) | KR880003426A (ko) |
| IT (1) | IT1215023B (ko) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2596995B2 (ja) * | 1988-12-21 | 1997-04-02 | シャープ株式会社 | 半導体装置の製造方法 |
| JP2752677B2 (ja) * | 1989-01-11 | 1998-05-18 | 日本電気株式会社 | 半導体装置の製造方法 |
| JPH02216838A (ja) * | 1989-02-17 | 1990-08-29 | Fuji Electric Co Ltd | 樹脂封止型半導体装置の製造方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60130129A (ja) * | 1983-12-16 | 1985-07-11 | Nec Corp | 絶縁型半導体素子の樹脂封止方法 |
-
1986
- 1986-08-27 IT IT8606611A patent/IT1215023B/it active
-
1987
- 1987-08-25 JP JP62209401A patent/JPS6362239A/ja active Pending
- 1987-08-26 KR KR1019870009326A patent/KR880003426A/ko not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| IT8606611A0 (it) | 1986-08-27 |
| KR880003426A (ko) | 1988-05-17 |
| JPS6362239A (ja) | 1988-03-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19970829 |