IT1185731B - Sistema metallico di tenuta marginale,a due livelli,per un dispositivo semicondutore - Google Patents
Sistema metallico di tenuta marginale,a due livelli,per un dispositivo semicondutoreInfo
- Publication number
- IT1185731B IT1185731B IT22911/85A IT2291185A IT1185731B IT 1185731 B IT1185731 B IT 1185731B IT 22911/85 A IT22911/85 A IT 22911/85A IT 2291185 A IT2291185 A IT 2291185A IT 1185731 B IT1185731 B IT 1185731B
- Authority
- IT
- Italy
- Prior art keywords
- levels
- seal
- metal system
- semiconductive device
- semiconductive
- Prior art date
Links
- 239000002184 metal Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Geometry or layout of the interconnection structure
- H01L23/5286—Arrangements of power or ground buses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Geometry (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Semiconductor Integrated Circuits (AREA)
- Local Oxidation Of Silicon (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US67958984A | 1984-12-07 | 1984-12-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
IT8522911A0 IT8522911A0 (it) | 1985-11-20 |
IT1185731B true IT1185731B (it) | 1987-11-12 |
Family
ID=24727510
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT22911/85A IT1185731B (it) | 1984-12-07 | 1985-11-20 | Sistema metallico di tenuta marginale,a due livelli,per un dispositivo semicondutore |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPH0758709B2 (it) |
KR (1) | KR940009351B1 (it) |
DE (1) | DE3542654C2 (it) |
GB (1) | GB2168532B (it) |
IT (1) | IT1185731B (it) |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50114170A (it) * | 1974-02-15 | 1975-09-06 | ||
DE2603747A1 (de) * | 1976-01-31 | 1977-08-04 | Licentia Gmbh | Integrierte schaltungsanordnung |
JPS5513136A (en) * | 1978-07-17 | 1980-01-30 | Tdk Corp | Liquid atomizer |
US4364078A (en) * | 1978-08-15 | 1982-12-14 | Synertek | Edge barrier of polysilicon and metal for integrated circuit chips |
DE3137914A1 (de) * | 1981-09-23 | 1983-04-07 | Siemens AG, 1000 Berlin und 8000 München | Anordnung zur kompensation von korrosionseffekten inintegrierten halbleiterschaltkreisen |
DE3220250A1 (de) * | 1982-05-28 | 1983-12-01 | Siemens AG, 1000 Berlin und 8000 München | Halbleiterbauelement mit planarstruktur |
JPS5955037A (ja) * | 1982-09-24 | 1984-03-29 | Hitachi Ltd | 半導体装置 |
JPS5980936A (ja) * | 1983-08-31 | 1984-05-10 | Hitachi Ltd | 電子部品 |
-
1985
- 1985-11-20 IT IT22911/85A patent/IT1185731B/it active
- 1985-11-30 KR KR1019850008962A patent/KR940009351B1/ko not_active IP Right Cessation
- 1985-12-03 DE DE3542654A patent/DE3542654C2/de not_active Expired - Fee Related
- 1985-12-05 GB GB08530031A patent/GB2168532B/en not_active Expired
- 1985-12-06 JP JP60275860A patent/JPH0758709B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
GB2168532B (en) | 1988-10-05 |
DE3542654C2 (de) | 1995-12-14 |
JPS61137347A (ja) | 1986-06-25 |
KR940009351B1 (ko) | 1994-10-07 |
JPH0758709B2 (ja) | 1995-06-21 |
IT8522911A0 (it) | 1985-11-20 |
GB2168532A (en) | 1986-06-18 |
KR860005439A (ko) | 1986-07-23 |
DE3542654A1 (de) | 1986-06-12 |
GB8530031D0 (en) | 1986-01-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
IT1138764B (it) | Dispositivo per interramento o dissotterramento di condotte subacquee | |
ES510918A0 (es) | Instalacion de reactor. | |
IT8548208A0 (it) | Sistema di riferimento inerziale | |
AR228513A1 (es) | Dispositivo de perforacion | |
BR8202512A (pt) | Dispositivo de vedacao | |
RO89084A (ro) | Combina miniera pentru lucrari miniere de inaintare | |
ATE8881T1 (de) | Enkephalinase enzyme inhibierende verbindungen. | |
IT8224830A0 (it) | Dispositivo per scavalcare giunti di dilatazione. | |
DE3228583A1 (de) | Abdichteinrichtung | |
IT8267145A0 (it) | Valvola di scarico particolarmente per scalpelli da roccia | |
NO821387L (no) | Tetningsanordning for kuleventil. | |
IT8224537A0 (it) | Chiusura ermetica per cuscinetti arotolamento. | |
IT1119367B (it) | Sistema di perforazione per trivellazioni | |
NO861717L (no) | Paavirkningsorgan for en underjordisk anordning. | |
NO822883L (no) | Heisemekanisme for borerigg. | |
BR8203681A (pt) | Dispositivo de perfuracao para sondagem | |
IT8520960A0 (it) | Dispositivo di polverizzazione per detonazione. | |
NO165563C (no) | Tetningsanordning. | |
NO153635C (no) | Sikringsanordning for vannfoerende husholdningsapparater. | |
ES518662A0 (es) | Procedimiento para la formacion de un dispositivo semiconductor. | |
IT8222152A0 (it) | Dispositivo per la trasmissione disegnali. | |
IT8220051A0 (it) | Dispositivo di fissaggio. | |
DK411782A (da) | Tappehane for oel | |
IT1185731B (it) | Sistema metallico di tenuta marginale,a due livelli,per un dispositivo semicondutore | |
IT8221483A0 (it) | Struttura di guarnizione per valvola bidirezionale. |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19971125 |