GB8530031D0 - Metal edge seal - Google Patents
Metal edge sealInfo
- Publication number
- GB8530031D0 GB8530031D0 GB858530031A GB8530031A GB8530031D0 GB 8530031 D0 GB8530031 D0 GB 8530031D0 GB 858530031 A GB858530031 A GB 858530031A GB 8530031 A GB8530031 A GB 8530031A GB 8530031 D0 GB8530031 D0 GB 8530031D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- edge seal
- metal edge
- metal
- seal
- edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Geometry or layout of the interconnection structure
- H01L23/5286—Arrangements of power or ground buses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US67958984A | 1984-12-07 | 1984-12-07 |
Publications (3)
Publication Number | Publication Date |
---|---|
GB8530031D0 true GB8530031D0 (en) | 1986-01-15 |
GB2168532A GB2168532A (en) | 1986-06-18 |
GB2168532B GB2168532B (en) | 1988-10-05 |
Family
ID=24727510
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB08530031A Expired GB2168532B (en) | 1984-12-07 | 1985-12-05 | Metal edge seal for a semiconductor device |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPH0758709B2 (en) |
KR (1) | KR940009351B1 (en) |
DE (1) | DE3542654C2 (en) |
GB (1) | GB2168532B (en) |
IT (1) | IT1185731B (en) |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50114170A (en) * | 1974-02-15 | 1975-09-06 | ||
DE2603747A1 (en) * | 1976-01-31 | 1977-08-04 | Licentia Gmbh | INTEGRATED CIRCUIT ARRANGEMENT |
JPS5513136A (en) * | 1978-07-17 | 1980-01-30 | Tdk Corp | Liquid atomizer |
US4364078A (en) | 1978-08-15 | 1982-12-14 | Synertek | Edge barrier of polysilicon and metal for integrated circuit chips |
DE3137914A1 (en) * | 1981-09-23 | 1983-04-07 | Siemens AG, 1000 Berlin und 8000 München | ARRANGEMENT FOR COMPENSATING CORROSION EFFECTS IN INTEGRATED SEMICONDUCTOR CIRCUITS |
DE3220250A1 (en) * | 1982-05-28 | 1983-12-01 | Siemens AG, 1000 Berlin und 8000 München | SEMICONDUCTOR COMPONENT WITH PLANAR STRUCTURE |
JPS5955037A (en) * | 1982-09-24 | 1984-03-29 | Hitachi Ltd | Semiconductor device |
JPS5980936A (en) * | 1983-08-31 | 1984-05-10 | Hitachi Ltd | Electronic parts |
-
1985
- 1985-11-20 IT IT22911/85A patent/IT1185731B/en active
- 1985-11-30 KR KR1019850008962A patent/KR940009351B1/en not_active IP Right Cessation
- 1985-12-03 DE DE3542654A patent/DE3542654C2/en not_active Expired - Fee Related
- 1985-12-05 GB GB08530031A patent/GB2168532B/en not_active Expired
- 1985-12-06 JP JP60275860A patent/JPH0758709B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH0758709B2 (en) | 1995-06-21 |
GB2168532B (en) | 1988-10-05 |
GB2168532A (en) | 1986-06-18 |
DE3542654A1 (en) | 1986-06-12 |
KR860005439A (en) | 1986-07-23 |
IT1185731B (en) | 1987-11-12 |
KR940009351B1 (en) | 1994-10-07 |
DE3542654C2 (en) | 1995-12-14 |
IT8522911A0 (en) | 1985-11-20 |
JPS61137347A (en) | 1986-06-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20031205 |