IT1163136B - METHOD AND APPARATUS FOR THE MANUFACTURE OF MULTI-LAYER CIRCUIT PANELS - Google Patents

METHOD AND APPARATUS FOR THE MANUFACTURE OF MULTI-LAYER CIRCUIT PANELS

Info

Publication number
IT1163136B
IT1163136B IT19877/83A IT1987783A IT1163136B IT 1163136 B IT1163136 B IT 1163136B IT 19877/83 A IT19877/83 A IT 19877/83A IT 1987783 A IT1987783 A IT 1987783A IT 1163136 B IT1163136 B IT 1163136B
Authority
IT
Italy
Prior art keywords
manufacture
layer circuit
circuit panels
panels
layer
Prior art date
Application number
IT19877/83A
Other languages
Italian (it)
Other versions
IT8319877A1 (en
IT8319877A0 (en
Inventor
Peter P Pelligrino
Original Assignee
Economics Lab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Economics Lab filed Critical Economics Lab
Publication of IT8319877A0 publication Critical patent/IT8319877A0/en
Publication of IT8319877A1 publication Critical patent/IT8319877A1/en
Application granted granted Critical
Publication of IT1163136B publication Critical patent/IT1163136B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Burglar Alarm Systems (AREA)
IT19877/83A 1982-03-04 1983-03-03 METHOD AND APPARATUS FOR THE MANUFACTURE OF MULTI-LAYER CIRCUIT PANELS IT1163136B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US35473682A 1982-03-04 1982-03-04

Publications (3)

Publication Number Publication Date
IT8319877A0 IT8319877A0 (en) 1983-03-03
IT8319877A1 IT8319877A1 (en) 1984-09-03
IT1163136B true IT1163136B (en) 1987-04-08

Family

ID=23394704

Family Applications (1)

Application Number Title Priority Date Filing Date
IT19877/83A IT1163136B (en) 1982-03-04 1983-03-03 METHOD AND APPARATUS FOR THE MANUFACTURE OF MULTI-LAYER CIRCUIT PANELS

Country Status (8)

Country Link
EP (1) EP0103627A4 (en)
JP (1) JPS59500341A (en)
CA (1) CA1222574A (en)
DK (1) DK502783A (en)
IN (1) IN158376B (en)
IT (1) IT1163136B (en)
NO (1) NO834009L (en)
WO (1) WO1983003065A1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0154564A3 (en) * 1984-03-09 1986-08-20 Cirtel Inc. Method and apparatus for laminating multilayer printed circuit boards having both rigid and flexible portions
US4734315A (en) * 1985-06-05 1988-03-29 Joyce Florence Space-Bate Low power circuitry components
US4927477A (en) * 1985-08-26 1990-05-22 International Business Machines Corporation Method for making a flush surface laminate for a multilayer circuit board
GB2212333A (en) * 1987-11-11 1989-07-19 Gen Electric Co Plc Method of fabricating multi-layer circuits
US4875966A (en) * 1988-09-12 1989-10-24 General Dynamics Corp., Pomona Div. Pressure transfer plate assembly for a heat bonding apparatus
JPH03196691A (en) * 1989-12-26 1991-08-28 Cmk Corp Formation of insulating layer of printed wiring board
KR102326101B1 (en) 2014-07-18 2021-11-12 미츠비시 가스 가가쿠 가부시키가이샤 Layered body, substrate for semiconductor element mounting, and method for manufacturing said body and substrate
EP3007526A1 (en) * 2014-10-08 2016-04-13 T-Kingdom Co., Ltd. Manufacturing method and structure of circuit board with very fine conductive circuit lines
US10332832B2 (en) 2017-08-07 2019-06-25 General Electric Company Method of manufacturing an electronics package using device-last or device-almost last placement
WO2019098043A1 (en) 2017-11-16 2019-05-23 三菱瓦斯化学株式会社 Method for producing laminate with patterned metal foil, and laminate with patterned metal foil
JP7153242B2 (en) 2017-12-14 2022-10-14 三菱瓦斯化学株式会社 Copper foil with insulating resin layer
EP3845379A4 (en) 2018-08-30 2021-10-13 Mitsubishi Gas Chemical Company, Inc. Multilayer body, metal foil-clad laminate, multilayer body with patterned metal foil, multilayer body having buildup structure, printed wiring board, multilayer coreless substrate and method for producing same
KR20210149683A (en) 2019-03-29 2021-12-09 미츠비시 가스 가가쿠 가부시키가이샤 Copper foil provided with an insulating resin layer, and a laminate using the same, and a method for manufacturing a laminate
TW202110617A (en) 2019-05-31 2021-03-16 日商三菱瓦斯化學股份有限公司 Base material with insulating resin layer, laminate using same, and method for manufacturing laminate

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3219749A (en) * 1961-04-21 1965-11-23 Litton Systems Inc Multilayer printed circuit board with solder access apertures
GB964349A (en) * 1961-08-31 1964-07-22 Rogers Corp Improvements in printed circuit and method of making the same
US3350250A (en) * 1962-03-21 1967-10-31 North American Aviation Inc Method of making printed wire circuitry
US3324014A (en) * 1962-12-03 1967-06-06 United Carr Inc Method for making flush metallic patterns
GB1259837A (en) * 1968-11-18 1972-01-12 Boeing Co Composite structure and method of making the same
US3627902A (en) * 1970-02-02 1971-12-14 Control Data Corp Interconnections for multilayer printed circuit boards
US3972755A (en) * 1972-12-14 1976-08-03 The United States Of America As Represented By The Secretary Of The Navy Dielectric circuit board bonding
US4159222A (en) * 1977-01-11 1979-06-26 Pactel Corporation Method of manufacturing high density fine line printed circuitry
US4354895A (en) * 1981-11-27 1982-10-19 International Business Machines Corporation Method for making laminated multilayer circuit boards

Also Published As

Publication number Publication date
EP0103627A1 (en) 1984-03-28
IT8319877A1 (en) 1984-09-03
WO1983003065A1 (en) 1983-09-15
CA1222574A (en) 1987-06-02
DK502783D0 (en) 1983-11-03
DK502783A (en) 1983-11-03
IN158376B (en) 1986-11-01
EP0103627A4 (en) 1985-09-18
IT8319877A0 (en) 1983-03-03
NO834009L (en) 1983-11-03
JPS59500341A (en) 1984-03-01

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