IT1131323B - Dispositivo per lo smontaggio non distruttivo d'un componente elettronico modulare saldato mediante una pluralita' di terminali di raccordo su un substrato - Google Patents

Dispositivo per lo smontaggio non distruttivo d'un componente elettronico modulare saldato mediante una pluralita' di terminali di raccordo su un substrato

Info

Publication number
IT1131323B
IT1131323B IT22777/80A IT2277780A IT1131323B IT 1131323 B IT1131323 B IT 1131323B IT 22777/80 A IT22777/80 A IT 22777/80A IT 2277780 A IT2277780 A IT 2277780A IT 1131323 B IT1131323 B IT 1131323B
Authority
IT
Italy
Prior art keywords
substrate
electronic component
connection terminals
modular electronic
destructive disassembly
Prior art date
Application number
IT22777/80A
Other languages
English (en)
Other versions
IT8022777A0 (it
Inventor
Bernard Fanene
Original Assignee
Cii
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cii filed Critical Cii
Publication of IT8022777A0 publication Critical patent/IT8022777A0/it
Application granted granted Critical
Publication of IT1131323B publication Critical patent/IT1131323B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0486—Replacement and removal of components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01049—Indium [In]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01052—Tellurium [Te]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01084—Polonium [Po]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/049—Nitrides composed of metals from groups of the periodic table
    • H01L2924/0495—5th Group
    • H01L2924/04953—TaN
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1928—Differential fluid pressure delaminating means
    • Y10T156/1933—Spraying delaminating means [e.g., atomizer, etc.
    • Y10T156/1939—Air blasting delaminating means]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
IT22777/80A 1979-06-13 1980-06-13 Dispositivo per lo smontaggio non distruttivo d'un componente elettronico modulare saldato mediante una pluralita' di terminali di raccordo su un substrato IT1131323B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7915126A FR2458977A1 (fr) 1979-06-13 1979-06-13 Dispositif de demontage non destructif d'un composant electronique modulaire soude par une pluralite de cosses de raccordement sur un substrat

Publications (2)

Publication Number Publication Date
IT8022777A0 IT8022777A0 (it) 1980-06-13
IT1131323B true IT1131323B (it) 1986-06-18

Family

ID=9226545

Family Applications (1)

Application Number Title Priority Date Filing Date
IT22777/80A IT1131323B (it) 1979-06-13 1980-06-13 Dispositivo per lo smontaggio non distruttivo d'un componente elettronico modulare saldato mediante una pluralita' di terminali di raccordo su un substrato

Country Status (6)

Country Link
US (1) US4366925A (it)
JP (1) JPS562698A (it)
DE (1) DE3022310A1 (it)
FR (1) FR2458977A1 (it)
GB (1) GB2050906B (it)
IT (1) IT1131323B (it)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5873188A (ja) * 1981-10-27 1983-05-02 富士通株式会社 プリント板からの電子部品自動取外し装置
US4561586A (en) * 1984-09-04 1985-12-31 Burroughs Corporation Method of removing a soldered integrated circuit package from a printed circuit board
US4632294A (en) * 1984-12-20 1986-12-30 International Business Machines Corporation Process and apparatus for individual pin repair in a dense array of connector pins of an electronic packaging structure
US4626205A (en) * 1985-08-08 1986-12-02 Pace, Incorporated Nozzle structure for air flow soldering/desoldering
EP0214030A3 (en) * 1985-08-12 1987-05-13 Digital Equipment Corporation Surface mount technology automated repair system
US4817851A (en) * 1986-02-13 1989-04-04 Digital Equipment Corporation Surface mount technology repair station and method for repair of surface mount technology circuit boards
US4696096A (en) * 1986-02-21 1987-09-29 Micro Electronic Systems, Inc. Reworking methods and apparatus for surface mounted technology circuit boards
JPS6337352A (ja) * 1986-07-31 1988-02-18 Somar Corp 薄膜剥離装置
US4855572A (en) * 1987-01-23 1989-08-08 Pace Incorporated Heater for use as either primary or auxiliary heat source and improved circuitry for controlling the heater
US4962878A (en) * 1987-02-18 1990-10-16 Plato Products, Inc. Desoldering aid
US4858820A (en) * 1987-02-18 1989-08-22 Plato Products, Inc. Desoldering aid and method
US4787548A (en) * 1987-07-27 1988-11-29 Pace Incorporated Nozzle structure for soldering and desoldering
US4813589A (en) * 1988-04-05 1989-03-21 Palmer Harold D Surface mounted device rework heat guide
JP2577610B2 (ja) * 1988-05-24 1997-02-05 富士写真フイルム株式会社 印刷用ハロゲン化銀写真感光材料
FR2666451A1 (fr) * 1990-08-28 1992-03-06 Thomson Csf Procede et dispositif pour le decollage selectif de plaquettes collees sur un substrat et leur application a la reparation de circuits hybrides.
JP2707189B2 (ja) * 1992-08-26 1998-01-28 株式会社日立製作所 電子部品の基板からの取外し方法及び装置
US5252179A (en) * 1992-09-28 1993-10-12 International Business Machines Corporation Apparatus and method for selectively etching a plastic encapsulating material
DE4320670A1 (de) * 1993-06-22 1995-01-05 Microtronic Microelectronic Co Verfahren und Vorrichtung zur Reparatur von Elektronikplatinen
US5658416A (en) * 1994-06-17 1997-08-19 Polaroid Corporation Method and apparatus for peeling a laminate
ATE167000T1 (de) * 1994-07-15 1998-06-15 Siemens Ag Elektrisches relais
US5601675A (en) * 1994-12-06 1997-02-11 International Business Machines Corporation Reworkable electronic apparatus having a fusible layer for adhesively attached components, and method therefor
US5769989A (en) * 1995-09-19 1998-06-23 International Business Machines Corporation Method and system for reworkable direct chip attach (DCA) structure with thermal enhancement
US5938882A (en) * 1997-09-30 1999-08-17 Harris Corporation Method for removing microelectronic circuits from substrates and tool used in removal
US6029730A (en) * 1997-12-30 2000-02-29 Intel Corporation Hot shear apparatus and method for removing a semiconductor chip from an existing package
US6216938B1 (en) * 1999-09-30 2001-04-17 International Business Machines Corporation Machine and process for reworking circuit boards
EP1683405B1 (de) * 2003-11-10 2007-08-29 Miroslav Tresky Chipentferner
US20080156789A1 (en) * 2004-11-29 2008-07-03 Andrew Devey Platen for use with a thermal attach and detach system which holds components by vacuum suction
FR2925978B1 (fr) * 2007-12-28 2010-01-29 Commissariat Energie Atomique Procede et dispositif de separation d'une structure.
CN103052461B (zh) * 2010-08-09 2016-03-30 英派尔科技开发有限公司 从印刷电路板去除和分离元件
TWI498520B (zh) * 2012-06-29 2015-09-01 Ibm 從一安裝表面分離一元件的裝置及方法
US9591795B2 (en) 2014-09-18 2017-03-07 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Sensor-based removal of a soldered device
US11278977B2 (en) 2019-10-22 2022-03-22 International Business Machines Corporation Liquid metal infiltration rework of electronic assembly
US11310950B2 (en) 2019-10-22 2022-04-19 International Business Machines Corporation Liquid metal infiltration rework of electronic assembly
CN111745255A (zh) * 2020-06-28 2020-10-09 温州医科大学附属眼视光医院 一种医疗器械零部件便捷维修平台

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3412451A (en) * 1966-02-10 1968-11-26 Amp Inc Force limiting tool
US3557430A (en) * 1968-08-21 1971-01-26 Rca Corp De-soldering apparatus
US3661315A (en) * 1969-06-13 1972-05-09 North American Rockwell Material removing device
US3644980A (en) * 1969-06-25 1972-02-29 Pace Inc Component removal device
US3735911A (en) * 1971-04-30 1973-05-29 Ibm Integrated circuit chip repair tool
US3868764A (en) * 1973-11-09 1975-03-04 Gen Motors Corp Multiple magnetic alignment of semiconductor devices for bonding
FR2271899A1 (en) * 1974-05-20 1975-12-19 Bodron Daniel Jig and solder bath - for rapid removal and replacement of electronic components on printed circuit boards
US3969813A (en) * 1975-08-15 1976-07-20 Bell Telephone Laboratories, Incorporated Method and apparatus for removal of semiconductor chips from hybrid circuits
US7735911B2 (en) * 2003-07-21 2010-06-15 Wonderland Nurserygoods Co., Ltd. Collapsible high chair for children

Also Published As

Publication number Publication date
JPS6336159B2 (it) 1988-07-19
GB2050906A (en) 1981-01-14
DE3022310A1 (de) 1981-01-15
JPS562698A (en) 1981-01-12
US4366925A (en) 1983-01-04
FR2458977A1 (fr) 1981-01-02
GB2050906B (en) 1983-05-18
FR2458977B1 (it) 1984-05-25
IT8022777A0 (it) 1980-06-13

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