IT1106873B - Materiale di riserva induribile mediante irradiazione e procedimento per produrlo - Google Patents

Materiale di riserva induribile mediante irradiazione e procedimento per produrlo

Info

Publication number
IT1106873B
IT1106873B IT50684/78A IT5068478A IT1106873B IT 1106873 B IT1106873 B IT 1106873B IT 50684/78 A IT50684/78 A IT 50684/78A IT 5068478 A IT5068478 A IT 5068478A IT 1106873 B IT1106873 B IT 1106873B
Authority
IT
Italy
Prior art keywords
hardenable
irradiation
procedure
produce
reserve material
Prior art date
Application number
IT50684/78A
Other languages
English (en)
Other versions
IT7850684A0 (it
Original Assignee
Somar Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP9545677A external-priority patent/JPS5429397A/ja
Priority claimed from JP6980878A external-priority patent/JPS54161319A/ja
Application filed by Somar Mfg filed Critical Somar Mfg
Publication of IT7850684A0 publication Critical patent/IT7850684A0/it
Application granted granted Critical
Publication of IT1106873B publication Critical patent/IT1106873B/it

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/005—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for making dustproof, splashproof, drip-proof, waterproof, or flameproof connection, coupling, or casing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/167—X-ray
    • Y10S430/168—X-ray exposure process

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
IT50684/78A 1977-08-09 1978-08-09 Materiale di riserva induribile mediante irradiazione e procedimento per produrlo IT1106873B (it)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP9545677A JPS5429397A (en) 1977-08-09 1977-08-09 Preparation of novel resist materrial
JP6980878A JPS54161319A (en) 1978-06-12 1978-06-12 High energy beam setting resist material and method of using same

Publications (2)

Publication Number Publication Date
IT7850684A0 IT7850684A0 (it) 1978-08-09
IT1106873B true IT1106873B (it) 1985-11-18

Family

ID=26410980

Family Applications (1)

Application Number Title Priority Date Filing Date
IT50684/78A IT1106873B (it) 1977-08-09 1978-08-09 Materiale di riserva induribile mediante irradiazione e procedimento per produrlo

Country Status (7)

Country Link
US (1) US4299911A (it)
AU (1) AU3870478A (it)
DE (1) DE2834791A1 (it)
FR (1) FR2400042A1 (it)
GB (1) GB2004283B (it)
IT (1) IT1106873B (it)
NL (1) NL7808279A (it)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56137347A (en) * 1980-03-29 1981-10-27 Tokyo Ohka Kogyo Co Ltd Photosensitive composition for dry development
JPS58187926A (ja) * 1982-04-28 1983-11-02 Toyo Soda Mfg Co Ltd 放射線ネガ型レジストの現像方法
US4515886A (en) * 1983-02-16 1985-05-07 Toyo Soda Manufacturing Co., Ltd. Photosensitive compositions
US4571375A (en) * 1983-10-24 1986-02-18 Benedikt George M Ring-opened polynorbornene negative photoresist with bisazide
JPS62127735A (ja) * 1985-11-29 1987-06-10 Toshiba Corp 感光性樹脂組成物及びこれを用いたカラ−フイルタ−の製造方法
JPH0654388B2 (ja) * 1986-05-02 1994-07-20 東京応化工業株式会社 ポジ型ホトレジスト組成物
JPH0654390B2 (ja) * 1986-07-18 1994-07-20 東京応化工業株式会社 高耐熱性ポジ型ホトレジスト組成物
DE4027259A1 (de) * 1990-08-29 1992-03-05 Herberts Gmbh Bindemittelzusammensetzung, deren herstellung, diese enthaltende ueberzugsmittel und deren verwendung
US5362597A (en) * 1991-05-30 1994-11-08 Japan Synthetic Rubber Co., Ltd. Radiation-sensitive resin composition comprising an epoxy-containing alkali-soluble resin and a naphthoquinone diazide sulfonic acid ester
DE69324942T2 (de) * 1992-02-14 1999-10-07 Shipley Co Strahlungsempfindliche Zusammensetzungen und Verfahren
US5399604A (en) * 1992-07-24 1995-03-21 Japan Synthetic Rubber Co., Ltd. Epoxy group-containing resin compositions
US5266444A (en) * 1992-09-10 1993-11-30 International Business Machines Corporation Method and composition for obtaining image reversal in epoxy formulations based upon photoinhibition
US6165695A (en) * 1998-12-01 2000-12-26 Advanced Micro Devices, Inc. Thin resist with amorphous silicon hard mask for via etch application
US6162587A (en) 1998-12-01 2000-12-19 Advanced Micro Devices Thin resist with transition metal hard mask for via etch application
US6127070A (en) * 1998-12-01 2000-10-03 Advanced Micro Devices, Inc. Thin resist with nitride hard mask for via etch application
US6309926B1 (en) 1998-12-04 2001-10-30 Advanced Micro Devices Thin resist with nitride hard mask for gate etch application
JP2000347397A (ja) 1999-06-04 2000-12-15 Jsr Corp 感放射線性樹脂組成物およびその層間絶縁膜への使用
US9552833B2 (en) * 2014-11-11 2017-01-24 Seagate Technology Llc Devices including a multilayer gas barrier layer

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1423136A (fr) * 1963-12-16 1966-01-03 Shell Int Research Procédé pour la préparation de résines à partir de polyépoxydes et d'acides non saturés
US3418295A (en) * 1965-04-27 1968-12-24 Du Pont Polymers and their preparation
FR1549956A (it) * 1967-03-02 1968-12-13
GB1360910A (en) * 1971-02-10 1974-07-24 Showa Highpolymer Resinous composition
CH545323A (de) * 1971-09-03 1973-12-15 Ciba Geigy Ag Verfahren zum Härten von Acrylsäureaddukten mit ionisierenden Strahlen
US3770433A (en) * 1972-03-22 1973-11-06 Bell Telephone Labor Inc High sensitivity negative electron resist
US3980483A (en) * 1972-04-24 1976-09-14 Nippon Oil Seal Industry Co., Ltd. Photocurable composition
JPS5239432B2 (it) * 1972-09-29 1977-10-05
US3920732A (en) * 1972-11-13 1975-11-18 Continental Can Co Process for stabilized ethylenically unsaturated beta-hydroxy esters
DE2411753A1 (de) * 1974-03-12 1975-10-16 Hoechst Ag Strahlenhaertende massen
DE2533125C2 (de) * 1975-07-24 1983-12-01 Bayer Ag, 5090 Leverkusen Hochreaktive Lackbindemittel
JP3161332B2 (ja) * 1996-07-04 2001-04-25 日本電気株式会社 チップ型固体電解コンデンサおよびその製造方法

Also Published As

Publication number Publication date
US4299911A (en) 1981-11-10
AU3870478A (en) 1980-02-14
DE2834791A1 (de) 1979-02-22
FR2400042A1 (fr) 1979-03-09
GB2004283A (en) 1979-03-28
NL7808279A (nl) 1979-02-13
IT7850684A0 (it) 1978-08-09
GB2004283B (en) 1982-03-17

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