IT1105425B - Pannello a circuiti di fili tracciati e metodo per la sua manifattura - Google Patents

Pannello a circuiti di fili tracciati e metodo per la sua manifattura

Info

Publication number
IT1105425B
IT1105425B IT49944/78A IT4994478A IT1105425B IT 1105425 B IT1105425 B IT 1105425B IT 49944/78 A IT49944/78 A IT 49944/78A IT 4994478 A IT4994478 A IT 4994478A IT 1105425 B IT1105425 B IT 1105425B
Authority
IT
Italy
Prior art keywords
tracked
wires
manufacture
circuit panel
panel
Prior art date
Application number
IT49944/78A
Other languages
English (en)
Italian (it)
Other versions
IT7849944A0 (it
Original Assignee
Kollmorgen Tech Corp
Burr James B
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Tech Corp, Burr James B filed Critical Kollmorgen Tech Corp
Publication of IT7849944A0 publication Critical patent/IT7849944A0/it
Application granted granted Critical
Publication of IT1105425B publication Critical patent/IT1105425B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/06—Wiring by machine
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09936—Marks, inscriptions, etc. for information
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Enzymes And Modification Thereof (AREA)
  • Combinations Of Printed Boards (AREA)
  • Measuring Or Testing Involving Enzymes Or Micro-Organisms (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
IT49944/78A 1977-06-20 1978-06-20 Pannello a circuiti di fili tracciati e metodo per la sua manifattura IT1105425B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US80836377A 1977-06-20 1977-06-20

Publications (2)

Publication Number Publication Date
IT7849944A0 IT7849944A0 (it) 1978-06-20
IT1105425B true IT1105425B (it) 1985-11-04

Family

ID=25198567

Family Applications (1)

Application Number Title Priority Date Filing Date
IT49944/78A IT1105425B (it) 1977-06-20 1978-06-20 Pannello a circuiti di fili tracciati e metodo per la sua manifattura

Country Status (13)

Country Link
JP (1) JPS548874A (nl)
AT (1) AT374330B (nl)
AU (1) AU523939B2 (nl)
CA (1) CA1111569A (nl)
CH (1) CH635715A5 (nl)
DE (1) DE2827312C2 (nl)
FR (1) FR2395673A1 (nl)
GB (1) GB2004703B (nl)
IL (1) IL54900A (nl)
IT (1) IT1105425B (nl)
NL (1) NL189107C (nl)
SE (1) SE447191B (nl)
ZA (1) ZA781637B (nl)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4500389A (en) * 1981-04-14 1985-02-19 Kollmorgen Technologies Corporation Process for the manufacture of substrates to interconnect electronic components
US4450623A (en) * 1981-12-18 1984-05-29 Kollmorgen Technologies Corporation Process for the manufacture of circuit boards
FR2585210B1 (fr) * 1985-07-19 1994-05-06 Kollmorgen Technologies Corp Procede de fabrication de plaquettes a circuits d'interconnexion
US5008619A (en) * 1988-11-18 1991-04-16 Amp-Akzo Corporation Multilevel circuit board precision positioning
DE19618917C1 (de) * 1996-05-12 1997-10-02 Markus Woelfel Verfahren und Vorrichtung zur Herstellung von drahtgeschriebenen Leiterplatten

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3674914A (en) * 1968-02-09 1972-07-04 Photocircuits Corp Wire scribed circuit boards and method of manufacture
JPS5550399B1 (nl) * 1970-03-05 1980-12-17

Also Published As

Publication number Publication date
AT374330B (de) 1984-04-10
FR2395673A1 (fr) 1979-01-19
JPS548874A (en) 1979-01-23
AU3615478A (en) 1979-11-22
CH635715A5 (de) 1983-04-15
IT7849944A0 (it) 1978-06-20
AU523939B2 (en) 1982-08-26
GB2004703A (en) 1979-04-04
NL189107B (nl) 1992-08-03
CA1111569A (en) 1981-10-27
IL54900A (en) 1980-07-31
DE2827312C2 (de) 1982-05-27
ATA413478A (de) 1983-08-15
FR2395673B1 (nl) 1980-10-24
NL7806608A (nl) 1978-12-22
SE7806960L (sv) 1978-12-21
SE447191B (sv) 1986-10-27
ZA781637B (en) 1979-02-28
IL54900A0 (en) 1978-08-31
GB2004703B (en) 1982-01-13
NL189107C (nl) 1993-01-04
DE2827312A1 (de) 1978-12-21

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Legal Events

Date Code Title Description
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19940831