IT1097887B - Connettore elettrico - Google Patents
Connettore elettricoInfo
- Publication number
- IT1097887B IT1097887B IT25836/78A IT2583678A IT1097887B IT 1097887 B IT1097887 B IT 1097887B IT 25836/78 A IT25836/78 A IT 25836/78A IT 2583678 A IT2583678 A IT 2583678A IT 1097887 B IT1097887 B IT 1097887B
- Authority
- IT
- Italy
- Prior art keywords
- electric connector
- connector
- electric
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1015—Plug-in assemblages of components, e.g. IC sockets having exterior leads
- H05K7/103—Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by sliding, e.g. DIP carriers
- H05K7/1046—J-shaped leads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
- Combinations Of Printed Boards (AREA)
- Connector Housings Or Holding Contact Members (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US05/821,112 US4116519A (en) | 1977-08-02 | 1977-08-02 | Electrical connections for chip carriers |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IT7825836A0 IT7825836A0 (it) | 1978-07-18 |
| IT1097887B true IT1097887B (it) | 1985-08-31 |
Family
ID=25232548
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT25836/78A IT1097887B (it) | 1977-08-02 | 1978-07-18 | Connettore elettrico |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US4116519A (it) |
| EP (1) | EP0000630B1 (it) |
| JP (1) | JPS5427984A (it) |
| CA (1) | CA1100218A (it) |
| DE (1) | DE2860837D1 (it) |
| ES (1) | ES472055A1 (it) |
| IT (1) | IT1097887B (it) |
Families Citing this family (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4356532A (en) * | 1980-07-18 | 1982-10-26 | Thomas & Betts Corporation | Electronic package and accessory component assembly |
| US4312555A (en) * | 1979-10-17 | 1982-01-26 | Thomas & Betts Corporation | Receptacle for stacking electronic packages |
| USRE31929E (en) * | 1980-07-18 | 1985-06-25 | Thomas & Betts Corporation | Electronic package and accessory component assembly |
| US4406508A (en) * | 1981-07-02 | 1983-09-27 | Thomas & Betts Corporation | Dual-in-line package assembly |
| US4519658A (en) * | 1983-01-24 | 1985-05-28 | Thomas & Betts Corporation | Electronic package assembly and accessory component therefor |
| US4627678A (en) * | 1983-01-24 | 1986-12-09 | Thomas & Betts Corporation | Electronic package assembly and accessory component therefor |
| EP0404277B1 (en) * | 1984-02-27 | 1994-09-28 | The Whitaker Corporation | Method of inserting a chip carrier contact into a housing |
| US4541676A (en) * | 1984-03-19 | 1985-09-17 | Itt Corporation | Chip carrier test adapter |
| KR890004820B1 (ko) * | 1984-03-28 | 1989-11-27 | 인터내셔널 비지네스 머신즈 코포레이션 | 배저장밀도의 메모리 모듈 및 보드와 그 형성방법 |
| US4671592A (en) * | 1985-03-06 | 1987-06-09 | Minnesota Mining And Manufacturing Company | Test clip for PLCC |
| US4768972A (en) * | 1985-03-06 | 1988-09-06 | Minnesota Mining And Manufacturing Company | Test clip for PLCC |
| US4671590A (en) * | 1985-03-06 | 1987-06-09 | Minnesota Mining And Manufacturing Company | Test clip for PLCC |
| US4981441A (en) * | 1985-03-06 | 1991-01-01 | Minnesota Mining And Manufacturing Co. | Test clip for PLCC |
| JPS6210887A (ja) * | 1985-07-04 | 1987-01-19 | 日立電子エンジニアリング株式会社 | Icソケツト |
| US4873615A (en) * | 1986-10-09 | 1989-10-10 | Amp Incorporated | Semiconductor chip carrier system |
| US5261055A (en) * | 1992-02-19 | 1993-11-09 | Milsys, Ltd. | Externally updatable ROM (EUROM) |
| US6205654B1 (en) | 1992-12-11 | 2001-03-27 | Staktek Group L.P. | Method of manufacturing a surface mount package |
| US5330359A (en) * | 1993-03-26 | 1994-07-19 | The Whitaker Corporation | Socket for stacking integrated circuit chips |
| US5643000A (en) * | 1994-09-27 | 1997-07-01 | Intel Corporation | Method and apparatus for providing processor field upgradability to a motherboard |
| US5514907A (en) * | 1995-03-21 | 1996-05-07 | Simple Technology Incorporated | Apparatus for stacking semiconductor chips |
| US6210175B1 (en) * | 1998-02-20 | 2001-04-03 | Hewlett-Packard Company | Socket rails for stacking integrated circuit components |
| US6572387B2 (en) | 1999-09-24 | 2003-06-03 | Staktek Group, L.P. | Flexible circuit connector for stacked chip module |
| US6608763B1 (en) | 2000-09-15 | 2003-08-19 | Staktek Group L.P. | Stacking system and method |
| US6462408B1 (en) | 2001-03-27 | 2002-10-08 | Staktek Group, L.P. | Contact member stacking system and method |
| US6980015B2 (en) * | 2003-06-17 | 2005-12-27 | Agilent Technologies, Inc. | Back side probing method and assembly |
| US7307502B2 (en) * | 2003-07-16 | 2007-12-11 | Marvell World Trade Ltd. | Power inductor with reduced DC current saturation |
| US7489219B2 (en) * | 2003-07-16 | 2009-02-10 | Marvell World Trade Ltd. | Power inductor with reduced DC current saturation |
| US7023313B2 (en) * | 2003-07-16 | 2006-04-04 | Marvell World Trade Ltd. | Power inductor with reduced DC current saturation |
| US8324872B2 (en) | 2004-03-26 | 2012-12-04 | Marvell World Trade, Ltd. | Voltage regulator with coupled inductors having high coefficient of coupling |
| US7227759B2 (en) * | 2004-04-01 | 2007-06-05 | Silicon Pipe, Inc. | Signal-segregating connector system |
| CN100468727C (zh) * | 2005-09-20 | 2009-03-11 | 南茂科技股份有限公司 | 半导体封装组件的堆叠构造 |
| CN101764328B (zh) * | 2008-12-24 | 2013-09-18 | 鸿富锦精密工业(深圳)有限公司 | 芯片接座 |
| CN101976659B (zh) * | 2010-09-03 | 2013-12-11 | 中兴通讯股份有限公司 | 一种无外封装晶体装置及其制造方法 |
| DE112014003944B4 (de) * | 2013-08-30 | 2018-08-02 | Yazaki Corporation | Verbindungsstruktur eines elektronischen Bauelements und von Metallanschlussstücken |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2816253A (en) * | 1953-12-23 | 1957-12-10 | Sanders Associates Inc | Electronic module structure |
| CA828390A (en) * | 1967-02-15 | 1969-11-25 | Powercube Corporation | Modular circuit package |
| US3715629A (en) * | 1967-04-05 | 1973-02-06 | Amp Inc | Wiring device for interconnecting module circuit units |
| US3701077A (en) * | 1969-12-29 | 1972-10-24 | Tech Inc K | Electronic components |
| US4028722A (en) * | 1970-10-13 | 1977-06-07 | Motorola, Inc. | Contact bonded packaged integrated circuit |
| US3784960A (en) * | 1972-05-01 | 1974-01-08 | Bunker Ramo | Carrier for integrated circuit packages |
| US3912984A (en) * | 1974-01-07 | 1975-10-14 | Burroughs Corp | Auxiliary circuit package |
| US4045105A (en) * | 1974-09-23 | 1977-08-30 | Advanced Memory Systems, Inc. | Interconnected leadless package receptacle |
| US4018494A (en) * | 1975-06-10 | 1977-04-19 | Amp Incorporated | Interconnection for electrically connecting two vertically stacked electronic packages |
-
1977
- 1977-08-02 US US05/821,112 patent/US4116519A/en not_active Expired - Lifetime
-
1978
- 1978-07-10 DE DE7878300137T patent/DE2860837D1/de not_active Expired
- 1978-07-10 EP EP78300137A patent/EP0000630B1/en not_active Expired
- 1978-07-18 IT IT25836/78A patent/IT1097887B/it active
- 1978-07-19 CA CA307,674A patent/CA1100218A/en not_active Expired
- 1978-07-26 ES ES472055A patent/ES472055A1/es not_active Expired
- 1978-07-31 JP JP9355478A patent/JPS5427984A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| IT7825836A0 (it) | 1978-07-18 |
| EP0000630B1 (en) | 1981-07-15 |
| US4116519A (en) | 1978-09-26 |
| JPS5427984A (en) | 1979-03-02 |
| ES472055A1 (es) | 1979-02-01 |
| CA1100218A (en) | 1981-04-28 |
| EP0000630A1 (en) | 1979-02-07 |
| DE2860837D1 (en) | 1981-10-22 |
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