EP0000630A1 - Microcircuit modules interconnector socket - Google Patents

Microcircuit modules interconnector socket Download PDF

Info

Publication number
EP0000630A1
EP0000630A1 EP78300137A EP78300137A EP0000630A1 EP 0000630 A1 EP0000630 A1 EP 0000630A1 EP 78300137 A EP78300137 A EP 78300137A EP 78300137 A EP78300137 A EP 78300137A EP 0000630 A1 EP0000630 A1 EP 0000630A1
Authority
EP
European Patent Office
Prior art keywords
modules
conductors
housing
connector
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP78300137A
Other languages
German (de)
French (fr)
Other versions
EP0000630B1 (en
Inventor
Dimitry G. Grabbe
Joseph Patrick Sweeney
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Corp
Original Assignee
AMP Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMP Inc filed Critical AMP Inc
Publication of EP0000630A1 publication Critical patent/EP0000630A1/en
Application granted granted Critical
Publication of EP0000630B1 publication Critical patent/EP0000630B1/en
Expired legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1015—Plug-in assemblages of components, e.g. IC sockets having exterior leads
    • H05K7/103—Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by sliding, e.g. DIP carriers
    • H05K7/1046—J-shaped leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]

Definitions

  • This invention relates to an electrical connector for use in mounting a plurality of microcircuit modules each comprising a body having a plurality of leads extending therefrom, on a substrate.
  • a standard module form is being used for the newest family of microcircuit devices, this module comprising a square, low-profile body having at least six leads extending from each side thereof. It is common practice to mount modules of this type directly on to printed circuit boards or similar substrates, or to removably mount such modules in sockets, each dimensioned to receive a single module.
  • modules such as microprocessor modules are presently being manufactured, which have an information capacity of 4000 information bits.
  • modules having the same dimensions as presently available modules will probably have a capacity of 8000 bits, and it is also foreseen that 16000 bit modules will be available shortly thereafter. It follows that manufacturers who adopt a packaging arrangement capable of accommodating only the presently available modules will probably be faced with a problem in the near future, of changing over to an arrangement having the capability of handling the expected new modules.
  • an electrical connector for use in mounting a plurality of microcircuit modules each comprising a body having a plurality of leads extending therefrom, on a substrate, characterised in that the connector comprises a hollow prismatic housing of electrically insulating material shaped to receive a plurality of said modules in superposed relationship, the housing having a plurality of electrical conductors extending along the inner faces of its walls and arranged to be contacted by leads of modules when received in the housing, the conductors having portions extending from a common end of the housing for connection to conductors on a substrate.
  • modules When presently available modules are connected to a printed circuit board using a connector in accordance with this invention, the present modules can readily be replaced by future generation similar size modules having added information storage capacity without other changes to the overall packaging arrangement.
  • the connector functions as an inter-" connecting means for connecting predetermined leads of several modules in the housing to each other and to connectors of a printed circuit board or other su strate.
  • the connector of this invention By the use of the connector of this invention the area required on a printed circuit board or other substrate from mounting a plurality of modules thereon is significantly reduced by virtue of the stacked arrangement of he modules in the connector.
  • he connector 2 shown in Figures 1 and 2 is for connecting lads 4 of a p urality of microcircuit module 6 to conductors (not shown) on a printed circuir board
  • the connector 2 comprises a hollow prismatic housing : of electrically Asulating material, having a square cross-sec on, and having an open end 12 into which the modus 6 can be inserted.
  • the other end of the housing i closed a bottom cover member 14 having a central opening 16 therein to permit removal of the modules 6 from the interior of the connector.
  • a plurality of spaced, straight, parallel conductors 18 extend along the inner faces of the walls of the housing 3, and portions 20 of the conductors 18 project beyond the other end of the housing so that they can be received in holes 22 in the board 8, and then soldered to conductors on the underside of the board 8.
  • the conductors 18 are arranged to be contacted by the leads 4 of the modules 6 when received in the housing 3, and thus the connector serves to connect the modules 6 received therein to the conductors on the board 8. Instead of passing through holes in the board 8 the conductor portions 20 can be bent as shown in dashed line in Figure 2 for connection to conductors on the top side of the board 8.
  • the conductors 18 can be of high purity copper since they do not serve as spring members, but the leads 4 of the modules 6 should be of spring metal such as beryllium copper or phosphor bronze.
  • the modules 6 can be assumed to be electrically and physically identical, and dimensioned to conform to standard dimensions for standard modules as mentioned above.
  • each module 6 may be energised at any particular instant, and to this end the modules 6 received in the housing 3 can be allotted individually dedicated conductor$-18 y each module 6 not having leads 4 connected to the conductors 18 allotted to the other modules 6 but having an energisation lead 4 connected to the individually' dedicated conductor 18.
  • the remaining conductors 18 not individually dedicated can serve all the modules 6 in the connector 2.
  • the modules 6 are removed from the housing 3 simply by pushing the modules 6 upwardly as seen in Figure 2, access to the lowermost module 6 being provided by the opening 16.
  • Figures 3 to 7 show a connector 68 according to this invention for use with a plurality of modules which are dissimilar in the sense that they carry out different electrical functions. Under such circumstances, some of the physically corresponding leads of the modules can not share common conductors in the connector housing, or at least conductors can be shared only to a limited extent. The conductors are, on the other hand, still required to provide module-to-module connections in the housing.
  • the connector 68 of this embodiment is formed of four wall sections, each of which is in the form of an elongate extrusion 54 having bevelled side edges 56, which sections are assembled to each other with their bevelled edges 56 against each other to produce the housing.
  • Channels 58 and 60 are provided on opposite surfaces of each wall section 54 and conductors 62, similar to the conductors 18 of Figures 1 and 2, are mounted in the inner channels 58 (see Figure 6).
  • certain conductors 62 Prior to assembly of the four wall sections 54 to each other, certain conductors 62 are interrupted at selected locations by punching holes 64 in the conductors 62 with a punching tool 66 (see Figure 7). After these holes 64 have been punched, isolated conductor sections 70 are provided at selected locations so that when the modules are inserted into the connector, the leads of the modules will he connected to each other in accordance with a predetermined wiring plan.

Abstract

An electrical connector, for use in mounting a plurality of microcircuit modules (6) each comprising a body having a plurality of leads (4), extending therefrom, on a substrate, comprises a housing (3) of electrically insulating material shaped to receive a plurality of the modules (6) in superposed relationship, the housing having a plurality of electrical conductors (18) extending along the inner faces of its walls and arranged to be contacted by leads (4) of modules (6) when received in the housing (3).

Description

  • This invention relates to an electrical connector for use in mounting a plurality of microcircuit modules each comprising a body having a plurality of leads extending therefrom, on a substrate.
  • Until fairly recent times, solid state microelectronic devices were packaged in prismatic rectangular insulating bodies having leads extending from two opposite sides of the bodies. More recently, such modules have been produced in square form having leads extending from all four sides thereof, and these new generation modules are somewhat smaller than the previous modules, notwithstanding the fact that the new modules require more leads.
  • A standard module form is being used for the newest family of microcircuit devices, this module comprising a square, low-profile body having at least six leads extending from each side thereof. It is common practice to mount modules of this type directly on to printed circuit boards or similar substrates, or to removably mount such modules in sockets, each dimensioned to receive a single module.
  • In the rapidly developing microelectronics industry, added requirements are continually emerging for microcircuit modules so that a packaging arrangement which may be entirely satisfactory for the modules being produced today may be totally incapable of accommodating, and providing the necessary interconnections for, the modules which will be available only a few years hence. For example, modules such as microprocessor modules are presently being manufactured, which have an information capacity of 4000 information bits. Within the next few years, modules having the same dimensions as presently available modules will probably have a capacity of 8000 bits, and it is also foreseen that 16000 bit modules will be available shortly thereafter. It follows that manufacturers who adopt a packaging arrangement capable of accommodating only the presently available modules will probably be faced with a problem in the near future, of changing over to an arrangement having the capability of handling the expected new modules.
  • According to this invention there is provided an electrical connector, for use in mounting a plurality of microcircuit modules each comprising a body having a plurality of leads extending therefrom, on a substrate, characterised in that the connector comprises a hollow prismatic housing of electrically insulating material shaped to receive a plurality of said modules in superposed relationship, the housing having a plurality of electrical conductors extending along the inner faces of its walls and arranged to be contacted by leads of modules when received in the housing, the conductors having portions extending from a common end of the housing for connection to conductors on a substrate.
  • When presently available modules are connected to a printed circuit board using a connector in accordance with this invention, the present modules can readily be replaced by future generation similar size modules having added information storage capacity without other changes to the overall packaging arrangement.
  • Further, the connector functions as an inter-" connecting means for connecting predetermined leads of several modules in the housing to each other and to connectors of a printed circuit board or other su strate.
  • By the use of the connector of this invention the area required on a printed circuit board or other substrate from mounting a plurality of modules thereon is significantly reduced by virtue of the stacked arrangement of he modules in the connector.
  • This invention will now be described by way of example with reference to the drawings, in which:-
    • Figure 1 is a perspective view of a connector according to this invention together with a substrate on which the connector is to be mounted and modules for receipt in the connector;
    • Figure 2 is a vertical section through the connector of I' jure 1 with part broken away, showing a plurality of modules received therein;
    • Figure 3 is a perspective view of part of another connector according to this invention;
    • Figure 4 is a pespective view of part of the connector of Fig re 3; and
    • Figures 5 to 7 illustrate steps in the manufacture of the connector of Figure 3.
  • he connector 2 shown in Figures 1 and 2 is for connecting lads 4 of a p urality of microcircuit module 6 to conductors (not shown) on a printed circuir board
  • The connector 2 comprises a hollow prismatic housing : of electrically Asulating material, having a square cross-sec on, and having an open end 12 into which the modus 6 can be inserted. The other end of the housing i closed a bottom cover member 14 having a central opening 16 therein to permit removal of the modules 6 from the interior of the connector. A plurality of spaced, straight, parallel conductors 18 extend along the inner faces of the walls of the housing 3, and portions 20 of the conductors 18 project beyond the other end of the housing so that they can be received in holes 22 in the board 8, and then soldered to conductors on the underside of the board 8.
  • The conductors 18 are arranged to be contacted by the leads 4 of the modules 6 when received in the housing 3, and thus the connector serves to connect the modules 6 received therein to the conductors on the board 8. Instead of passing through holes in the board 8 the conductor portions 20 can be bent as shown in dashed line in Figure 2 for connection to conductors on the top side of the board 8. The conductors 18 can be of high purity copper since they do not serve as spring members, but the leads 4 of the modules 6 should be of spring metal such as beryllium copper or phosphor bronze.
  • The modules 6 can be assumed to be electrically and physically identical, and dimensioned to conform to standard dimensions for standard modules as mentioned above.
  • Thus, when a plurality of modules 6 are placed in the connector 2 in the same orientation, corresponding leads 4 of the modules 6 will contact the same conductor 18 in the housing 3. The modules 6 will thus be connected in parallel to the conductors 18 and to the conductors on the printed circuit board 8.
  • In use, it may be necessary for only one of the modules 6 to be energised at any particular instant, and to this end the modules 6 received in the housing 3 can be allotted individually dedicated conductor$-18y each module 6 not having leads 4 connected to the conductors 18 allotted to the other modules 6 but having an energisation lead 4 connected to the individually' dedicated conductor 18.
  • As previously mentioned, the remaining conductors 18 not individually dedicated can serve all the modules 6 in the connector 2.
  • The modules 6 are removed from the housing 3 simply by pushing the modules 6 upwardly as seen in Figure 2, access to the lowermost module 6 being provided by the opening 16.
  • Figures 3 to 7 show a connector 68 according to this invention for use with a plurality of modules which are dissimilar in the sense that they carry out different electrical functions. Under such circumstances, some of the physically corresponding leads of the modules can not share common conductors in the connector housing, or at least conductors can be shared only to a limited extent. The conductors are, on the other hand, still required to provide module-to-module connections in the housing.
  • The connector 68 of this embodiment is formed of four wall sections, each of which is in the form of an elongate extrusion 54 having bevelled side edges 56, which sections are assembled to each other with their bevelled edges 56 against each other to produce the housing. Channels 58 and 60 are provided on opposite surfaces of each wall section 54 and conductors 62, similar to the conductors 18 of Figures 1 and 2, are mounted in the inner channels 58 (see Figure 6). Prior to assembly of the four wall sections 54 to each other, certain conductors 62 are interrupted at selected locations by punching holes 64 in the conductors 62 with a punching tool 66 (see Figure 7). After these holes 64 have been punched, isolated conductor sections 70 are provided at selected locations so that when the modules are inserted into the connector, the leads of the modules will he connected to each other in accordance with a predetermined wiring plan.

Claims (3)

1. An electrical connector, for use in mounting a plurality of microcircuit modules each comprising a body having a plurality of leads extending therefrom, on a substrate, characterised in that the connector (2, 68) comprises a hollow-prismatic housing (3) of. electrically insulating material shaped to receive a plurality of said modules (6) in superposed relationship, the housing (3) having a plurality of electrical conductors (18, 62) extending along the inner faces of its walls (54) and arranged to be contacted by leads (4) of modules (6) when received in the housing f3), the conductors (18, 62) having portions (20) extending from a common end of the housing (3) for connection to conductors on a substrate (8).
2. A connector as claimed in Claim 1, characterised in that the conductors (18, 62) are straight and parallel.
3. A connector as claimed in Claim 1 or Claim 2, characterised in that the housing (3) is formed of a plurality of initially separate wall sections (54) each carrying a plurality of the conductors (62) in individual channels (58) in the wall section (54). 4. A connector as claimed in Claim 2 or Ciaim 3, characterised in that at least one of the conductors (18, 62) is interrupted to provide electrically isolated conductor sections (70).
EP78300137A 1977-08-02 1978-07-10 Microcircuit modules interconnector socket Expired EP0000630B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US05/821,112 US4116519A (en) 1977-08-02 1977-08-02 Electrical connections for chip carriers
US821112 1977-08-02

Publications (2)

Publication Number Publication Date
EP0000630A1 true EP0000630A1 (en) 1979-02-07
EP0000630B1 EP0000630B1 (en) 1981-07-15

Family

ID=25232548

Family Applications (1)

Application Number Title Priority Date Filing Date
EP78300137A Expired EP0000630B1 (en) 1977-08-02 1978-07-10 Microcircuit modules interconnector socket

Country Status (7)

Country Link
US (1) US4116519A (en)
EP (1) EP0000630B1 (en)
JP (1) JPS5427984A (en)
CA (1) CA1100218A (en)
DE (1) DE2860837D1 (en)
ES (1) ES472055A1 (en)
IT (1) IT1097887B (en)

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US4356532A (en) * 1980-07-18 1982-10-26 Thomas & Betts Corporation Electronic package and accessory component assembly
US4312555A (en) * 1979-10-17 1982-01-26 Thomas & Betts Corporation Receptacle for stacking electronic packages
USRE31929E (en) * 1980-07-18 1985-06-25 Thomas & Betts Corporation Electronic package and accessory component assembly
US4406508A (en) * 1981-07-02 1983-09-27 Thomas & Betts Corporation Dual-in-line package assembly
US4627678A (en) * 1983-01-24 1986-12-09 Thomas & Betts Corporation Electronic package assembly and accessory component therefor
US4519658A (en) * 1983-01-24 1985-05-28 Thomas & Betts Corporation Electronic package assembly and accessory component therefor
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US4541676A (en) * 1984-03-19 1985-09-17 Itt Corporation Chip carrier test adapter
KR890004820B1 (en) * 1984-03-28 1989-11-27 인터내셔널 비지네스 머신즈 코포레이션 Stacked double density memory module using industry standard memory chips
US4671590A (en) * 1985-03-06 1987-06-09 Minnesota Mining And Manufacturing Company Test clip for PLCC
US4768972A (en) * 1985-03-06 1988-09-06 Minnesota Mining And Manufacturing Company Test clip for PLCC
US4671592A (en) * 1985-03-06 1987-06-09 Minnesota Mining And Manufacturing Company Test clip for PLCC
US4981441A (en) * 1985-03-06 1991-01-01 Minnesota Mining And Manufacturing Co. Test clip for PLCC
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US4873615A (en) * 1986-10-09 1989-10-10 Amp Incorporated Semiconductor chip carrier system
US5261055A (en) * 1992-02-19 1993-11-09 Milsys, Ltd. Externally updatable ROM (EUROM)
US6205654B1 (en) 1992-12-11 2001-03-27 Staktek Group L.P. Method of manufacturing a surface mount package
US5330359A (en) * 1993-03-26 1994-07-19 The Whitaker Corporation Socket for stacking integrated circuit chips
US5643000A (en) * 1994-09-27 1997-07-01 Intel Corporation Method and apparatus for providing processor field upgradability to a motherboard
US5514907A (en) * 1995-03-21 1996-05-07 Simple Technology Incorporated Apparatus for stacking semiconductor chips
US6210175B1 (en) * 1998-02-20 2001-04-03 Hewlett-Packard Company Socket rails for stacking integrated circuit components
US6572387B2 (en) 1999-09-24 2003-06-03 Staktek Group, L.P. Flexible circuit connector for stacked chip module
US6608763B1 (en) 2000-09-15 2003-08-19 Staktek Group L.P. Stacking system and method
US6462408B1 (en) 2001-03-27 2002-10-08 Staktek Group, L.P. Contact member stacking system and method
US6980015B2 (en) * 2003-06-17 2005-12-27 Agilent Technologies, Inc. Back side probing method and assembly
US7307502B2 (en) * 2003-07-16 2007-12-11 Marvell World Trade Ltd. Power inductor with reduced DC current saturation
US7489219B2 (en) * 2003-07-16 2009-02-10 Marvell World Trade Ltd. Power inductor with reduced DC current saturation
US7023313B2 (en) * 2003-07-16 2006-04-04 Marvell World Trade Ltd. Power inductor with reduced DC current saturation
US8324872B2 (en) 2004-03-26 2012-12-04 Marvell World Trade, Ltd. Voltage regulator with coupled inductors having high coefficient of coupling
US7227759B2 (en) * 2004-04-01 2007-06-05 Silicon Pipe, Inc. Signal-segregating connector system
CN101764328B (en) * 2008-12-24 2013-09-18 鸿富锦精密工业（深圳）有限公司 Chip joint seat
CN101976659B (en) * 2010-09-03 2013-12-11 中兴通讯股份有限公司 Outer package-free crystal device and manufacturing method thereof
WO2015029990A1 (en) * 2013-08-30 2015-03-05 矢崎総業株式会社 Connection structure between electronic component and terminal fitting

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US3359461A (en) * 1967-02-15 1967-12-19 Powercube Corp Modular circuit package
US3784960A (en) * 1972-05-01 1974-01-08 Bunker Ramo Carrier for integrated circuit packages

Also Published As

Publication number Publication date
JPS5427984A (en) 1979-03-02
US4116519A (en) 1978-09-26
IT1097887B (en) 1985-08-31
CA1100218A (en) 1981-04-28
DE2860837D1 (en) 1981-10-22
EP0000630B1 (en) 1981-07-15
ES472055A1 (en) 1979-02-01
IT7825836A0 (en) 1978-07-18

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