EP0000630B1 - Microcircuit modules interconnector socket - Google Patents

Microcircuit modules interconnector socket Download PDF

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Publication number
EP0000630B1
EP0000630B1 EP78300137A EP78300137A EP0000630B1 EP 0000630 B1 EP0000630 B1 EP 0000630B1 EP 78300137 A EP78300137 A EP 78300137A EP 78300137 A EP78300137 A EP 78300137A EP 0000630 B1 EP0000630 B1 EP 0000630B1
Authority
EP
European Patent Office
Prior art keywords
modules
conductors
housing
connector
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
EP78300137A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP0000630A1 (en
Inventor
Dimitry G. Grabbe
Joseph Patrick Sweeney
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Corp
Original Assignee
AMP Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMP Inc filed Critical AMP Inc
Publication of EP0000630A1 publication Critical patent/EP0000630A1/en
Application granted granted Critical
Publication of EP0000630B1 publication Critical patent/EP0000630B1/en
Expired legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1015—Plug-in assemblages of components, e.g. IC sockets having exterior leads
    • H05K7/103—Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by sliding, e.g. DIP carriers
    • H05K7/1046—J-shaped leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]

Definitions

  • This invention relates to an electrical connector and microcircuit module assembly.
  • a standard module form is being used for the newest family of microcircuit devices, this module comprising a square, low-profile body having at least six leads extending from each side thereof. It is common practice to mount modules of this type directly on to printed circuit boards or similar substrates, or to removably mount such modules in sockets, each dimensioned to receive a single module.
  • modules such as microprocessor modules are presently being manufactured, which have an information capacity of 4000 information bits.
  • modules having the same dimensions as presently available modules will probably have a capacity of 8000 bits, and it is also foreseen that 16000 bit modules will be available shortly thereafter. It follows that manufacturers who adopt a packaging arrangement capable of accommodating only the presently available modules will probably be faced with a problem in the near future, of changing over to an arrangement having the capability of handling the expected new modules.
  • an assembly of an electrical connector comprising a hollow prismatic housing of electrically insulating plastics material having a plurality of parallel electrical conductors extending along the inner faces of its walls, the conductors having portions extending from a common end of the housing for connection to conductors on a substrate, and a plurality of microcircuit modules received in superposed relationship in the housing, each module comprising a body having a plurality of leads extending therefrom, the leads being in contact with the conductors on the inner faces of the walls of the connector housing.
  • an assembly as set out above is characterised in that the conductors are all uninterrupted throughout their length, at least some of the modules being allotted individually dedicated conductors, each such module not having leads connected to the conductors allotted to other modules but having a lead connected to the individually dedicated conductor, the conductors not individually dedicated to particular modules serving for connections to all the modules in the connector.
  • the connector when once mounted on a substrate need not be removed when different interconnections between the modules are required or when different modules are to be used, since the necessary adaptation of the assembly is effected by adaptation of the leads of the modules.
  • the connector 2 shown in Figures 1 and 2 is for connecting leads 4 of a plurality of microcircuit modules 6 to conductors (not shown) on a printed circuit board 8.
  • the connector 2 comprises a hollow prismatic housing 3 of electrically insulating material, having a square cross-section, and having an open end 12 into which the modules 6 can be inserted.
  • the other end of the housing is closed by a bottom cover member 14 having a central opening 16 therein to permit removal of the modules 6 from the interior of the connector.
  • a plurality of spaced, straight, parallel conductors 18 extend uninterrupted along the inner faces of the walls of the housing 3, and portions 20 of the conductors 18 project beyond the other end of the housing so that they can be received in holes 22 in the board 8, and then soldered to conductors on the underside of the board 8.
  • the conductors 18 are arranged to be contacted by the leads 4 of the modules 6 when received in the housing 3, and thus the connector serves to connect the modules 6 received therein to the conductors on the board 8.
  • the conductor portions 20 can be bent as shown in dashed line in Figure 2 for connection to conductors on the top side of the board 8.
  • the conductors 18 can be of high purity copper since they do not serve as spring members, but the leads 4 of the modules 6 should be of spring metal such as beryllium copper or phosphor bronze.
  • the conductors 18 not individually dedicated to particular modules 6 serve all the modules 6 in the connector 2.
  • the modules 6 are removed from the housing 3 simply by pushing the modules 6 upwardly as seen in Figure 2, access to the lowermost module 6 being provided by the opening 16.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Combinations Of Printed Boards (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Lead Frames For Integrated Circuits (AREA)
EP78300137A 1977-08-02 1978-07-10 Microcircuit modules interconnector socket Expired EP0000630B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US821112 1977-08-02
US05/821,112 US4116519A (en) 1977-08-02 1977-08-02 Electrical connections for chip carriers

Publications (2)

Publication Number Publication Date
EP0000630A1 EP0000630A1 (en) 1979-02-07
EP0000630B1 true EP0000630B1 (en) 1981-07-15

Family

ID=25232548

Family Applications (1)

Application Number Title Priority Date Filing Date
EP78300137A Expired EP0000630B1 (en) 1977-08-02 1978-07-10 Microcircuit modules interconnector socket

Country Status (7)

Country Link
US (1) US4116519A (it)
EP (1) EP0000630B1 (it)
JP (1) JPS5427984A (it)
CA (1) CA1100218A (it)
DE (1) DE2860837D1 (it)
ES (1) ES472055A1 (it)
IT (1) IT1097887B (it)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4356532A (en) * 1980-07-18 1982-10-26 Thomas & Betts Corporation Electronic package and accessory component assembly
US4312555A (en) * 1979-10-17 1982-01-26 Thomas & Betts Corporation Receptacle for stacking electronic packages
USRE31929E (en) * 1980-07-18 1985-06-25 Thomas & Betts Corporation Electronic package and accessory component assembly
US4406508A (en) * 1981-07-02 1983-09-27 Thomas & Betts Corporation Dual-in-line package assembly
US4519658A (en) * 1983-01-24 1985-05-28 Thomas & Betts Corporation Electronic package assembly and accessory component therefor
US4627678A (en) * 1983-01-24 1986-12-09 Thomas & Betts Corporation Electronic package assembly and accessory component therefor
DE3584532D1 (de) * 1984-02-27 1991-12-05 Amp Inc Kontakt fuer schaltungstraeger und verfahren um diesen in ein gehaeuse einzusetzen.
US4541676A (en) * 1984-03-19 1985-09-17 Itt Corporation Chip carrier test adapter
KR890004820B1 (ko) * 1984-03-28 1989-11-27 인터내셔널 비지네스 머신즈 코포레이션 배저장밀도의 메모리 모듈 및 보드와 그 형성방법
US4981441A (en) * 1985-03-06 1991-01-01 Minnesota Mining And Manufacturing Co. Test clip for PLCC
US4768972A (en) * 1985-03-06 1988-09-06 Minnesota Mining And Manufacturing Company Test clip for PLCC
US4671590A (en) * 1985-03-06 1987-06-09 Minnesota Mining And Manufacturing Company Test clip for PLCC
US4671592A (en) * 1985-03-06 1987-06-09 Minnesota Mining And Manufacturing Company Test clip for PLCC
JPS6210887A (ja) * 1985-07-04 1987-01-19 日立電子エンジニアリング株式会社 Ｉｃソケツト
US4873615A (en) * 1986-10-09 1989-10-10 Amp Incorporated Semiconductor chip carrier system
US5261055A (en) * 1992-02-19 1993-11-09 Milsys, Ltd. Externally updatable ROM (EUROM)
US6205654B1 (en) 1992-12-11 2001-03-27 Staktek Group L.P. Method of manufacturing a surface mount package
US5330359A (en) * 1993-03-26 1994-07-19 The Whitaker Corporation Socket for stacking integrated circuit chips
US5643000A (en) * 1994-09-27 1997-07-01 Intel Corporation Method and apparatus for providing processor field upgradability to a motherboard
US5514907A (en) * 1995-03-21 1996-05-07 Simple Technology Incorporated Apparatus for stacking semiconductor chips
US6210175B1 (en) * 1998-02-20 2001-04-03 Hewlett-Packard Company Socket rails for stacking integrated circuit components
US6572387B2 (en) 1999-09-24 2003-06-03 Staktek Group, L.P. Flexible circuit connector for stacked chip module
US6608763B1 (en) 2000-09-15 2003-08-19 Staktek Group L.P. Stacking system and method
US6462408B1 (en) 2001-03-27 2002-10-08 Staktek Group, L.P. Contact member stacking system and method
US6980015B2 (en) * 2003-06-17 2005-12-27 Agilent Technologies, Inc. Back side probing method and assembly
US7023313B2 (en) * 2003-07-16 2006-04-04 Marvell World Trade Ltd. Power inductor with reduced DC current saturation
US7489219B2 (en) * 2003-07-16 2009-02-10 Marvell World Trade Ltd. Power inductor with reduced DC current saturation
US7307502B2 (en) * 2003-07-16 2007-12-11 Marvell World Trade Ltd. Power inductor with reduced DC current saturation
US8324872B2 (en) 2004-03-26 2012-12-04 Marvell World Trade, Ltd. Voltage regulator with coupled inductors having high coefficient of coupling
US7227759B2 (en) * 2004-04-01 2007-06-05 Silicon Pipe, Inc. Signal-segregating connector system
CN101764328B (zh) * 2008-12-24 2013-09-18 鸿富锦精密工业（深圳）有限公司 芯片接座
CN101976659B (zh) * 2010-09-03 2013-12-11 中兴通讯股份有限公司 一种无外封装晶体装置及其制造方法
JP5990333B2 (ja) * 2013-08-30 2016-09-14 矢崎総業株式会社 電子部品と端子金具との接続構造

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2816253A (en) * 1953-12-23 1957-12-10 Sanders Associates Inc Electronic module structure
CA828390A (en) * 1967-02-15 1969-11-25 Powercube Corporation Modular circuit package
US3715629A (en) * 1967-04-05 1973-02-06 Amp Inc Wiring device for interconnecting module circuit units
US3701077A (en) * 1969-12-29 1972-10-24 Tech Inc K Electronic components
US4028722A (en) * 1970-10-13 1977-06-07 Motorola, Inc. Contact bonded packaged integrated circuit
US3784960A (en) * 1972-05-01 1974-01-08 Bunker Ramo Carrier for integrated circuit packages
US3912984A (en) * 1974-01-07 1975-10-14 Burroughs Corp Auxiliary circuit package
US4045105A (en) * 1974-09-23 1977-08-30 Advanced Memory Systems, Inc. Interconnected leadless package receptacle
US4018494A (en) * 1975-06-10 1977-04-19 Amp Incorporated Interconnection for electrically connecting two vertically stacked electronic packages

Also Published As

Publication number Publication date
ES472055A1 (es) 1979-02-01
IT1097887B (it) 1985-08-31
IT7825836A0 (it) 1978-07-18
DE2860837D1 (en) 1981-10-22
JPS5427984A (en) 1979-03-02
CA1100218A (en) 1981-04-28
US4116519A (en) 1978-09-26
EP0000630A1 (en) 1979-02-07

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