IT1035743B - Prucedimento per la produzione di circuiti stampati e prodtto ottnuto - Google Patents

Prucedimento per la produzione di circuiti stampati e prodtto ottnuto

Info

Publication number
IT1035743B
IT1035743B IT4961375A IT4961375A IT1035743B IT 1035743 B IT1035743 B IT 1035743B IT 4961375 A IT4961375 A IT 4961375A IT 4961375 A IT4961375 A IT 4961375A IT 1035743 B IT1035743 B IT 1035743B
Authority
IT
Italy
Prior art keywords
precedence
production
obtained product
printed circuits
printed
Prior art date
Application number
IT4961375A
Other languages
English (en)
Italian (it)
Original Assignee
Minnesota Mining & Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining & Mfg filed Critical Minnesota Mining & Mfg
Application granted granted Critical
Publication of IT1035743B publication Critical patent/IT1035743B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4647—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer around previously made via studs

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
IT4961375A 1974-05-16 1975-05-15 Prucedimento per la produzione di circuiti stampati e prodtto ottnuto IT1035743B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US47034974A 1974-05-16 1974-05-16

Publications (1)

Publication Number Publication Date
IT1035743B true IT1035743B (it) 1979-10-20

Family

ID=23867259

Family Applications (1)

Application Number Title Priority Date Filing Date
IT4961375A IT1035743B (it) 1974-05-16 1975-05-15 Prucedimento per la produzione di circuiti stampati e prodtto ottnuto

Country Status (7)

Country Link
JP (1) JPS50160774A (ru)
CA (1) CA1011002A (ru)
DE (1) DE2522006A1 (ru)
FR (1) FR2271739B1 (ru)
GB (1) GB1476888A (ru)
IT (1) IT1035743B (ru)
NL (1) NL7505288A (ru)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4376815A (en) * 1979-10-22 1983-03-15 Oddi Michael J Method of applying photoresist by screening in the formation of printed circuits
DE3362659D1 (en) * 1982-05-21 1986-04-30 Hewlett Packard Co Method of making printed circuits
JP2753746B2 (ja) * 1989-11-06 1998-05-20 日本メクトロン株式会社 Ｉｃ搭載用可撓性回路基板及びその製造法
US5506059A (en) * 1993-05-14 1996-04-09 Minnesota Mining And Manufacturing Company Metallic films and articles using same
TW512467B (en) * 1999-10-12 2002-12-01 North Kk Wiring circuit substrate and manufacturing method therefor
JP3643743B2 (ja) * 2000-01-28 2005-04-27 三洋電機株式会社 実装基板
JP2002337268A (ja) * 2001-05-21 2002-11-27 Nitto Denko Corp 金属箔積層板及びその製造方法
JP2003078244A (ja) * 2001-06-18 2003-03-14 Nitto Denko Corp 多層配線基板及びその製造方法

Also Published As

Publication number Publication date
GB1476888A (en) 1977-06-16
FR2271739B1 (ru) 1980-08-22
NL7505288A (nl) 1975-11-18
CA1011002A (en) 1977-05-24
DE2522006A1 (de) 1975-11-27
JPS50160774A (ru) 1975-12-26
FR2271739A1 (ru) 1975-12-12

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