IT1027981B - Prodedimento per formare una protezione antisaldatura su piastre circuitali con fori passanti - Google Patents

Prodedimento per formare una protezione antisaldatura su piastre circuitali con fori passanti

Info

Publication number
IT1027981B
IT1027981B IT30940/74A IT3094074A IT1027981B IT 1027981 B IT1027981 B IT 1027981B IT 30940/74 A IT30940/74 A IT 30940/74A IT 3094074 A IT3094074 A IT 3094074A IT 1027981 B IT1027981 B IT 1027981B
Authority
IT
Italy
Prior art keywords
circuital
plates
holes
production
welding protection
Prior art date
Application number
IT30940/74A
Other languages
English (en)
Italian (it)
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Application granted granted Critical
Publication of IT1027981B publication Critical patent/IT1027981B/it

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0094Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0137Materials
    • H05K2201/0166Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/095Conductive through-holes or vias
    • H05K2201/0959Plated through-holes or plated blind vias filled with insulating material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05Patterning and lithography; Masks; Details of resist
    • H05K2203/0562Details of resist
    • H05K2203/0582Coating by resist, i.e. resist used as mask for application of insulating coating or of second resist
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0073Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
IT30940/74A 1974-01-08 1974-12-23 Prodedimento per formare una protezione antisaldatura su piastre circuitali con fori passanti IT1027981B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2400665A DE2400665C3 (de) 1974-01-08 1974-01-08 Verfahren zur Herstellung eines lotabweisenden Schutzes auf Leiterplatten mit durchgehenden Lochern

Publications (1)

Publication Number Publication Date
IT1027981B true IT1027981B (it) 1978-12-20

Family

ID=5904309

Family Applications (1)

Application Number Title Priority Date Filing Date
IT30940/74A IT1027981B (it) 1974-01-08 1974-12-23 Prodedimento per formare una protezione antisaldatura su piastre circuitali con fori passanti

Country Status (11)

Country Link
JP (1) JPS5199263A (fr)
AT (1) AT346956B (fr)
BE (1) BE824182A (fr)
CA (1) CA1041848A (fr)
CH (1) CH582980A5 (fr)
DE (1) DE2400665C3 (fr)
FR (1) FR2257188A1 (fr)
GB (1) GB1474247A (fr)
IT (1) IT1027981B (fr)
NL (1) NL7417056A (fr)
SE (1) SE7500019L (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5624180U (fr) * 1979-07-31 1981-03-04
JPS60124894A (ja) * 1983-12-08 1985-07-03 株式会社明電舎 プリント基板の製造方法
AT389793B (de) * 1986-03-25 1990-01-25 Philips Nv Leiterplatte fuer gedruckte schaltungen und verfahren zur herstellung solcher leiterplatten
GB2230990A (en) * 1989-05-05 1990-11-07 Harwin Engineers S A Hole plug and method of plugging holes
DE19909505C2 (de) 1999-03-04 2001-11-15 Daimler Chrysler Ag Verfahren zur Herstellung von Schaltungsanordnungen
DE10101359A1 (de) 2001-01-13 2002-07-25 Conti Temic Microelectronic Verfahren zur Herstellung einer elektronischen Baugruppe
FI130166B (en) * 2019-03-08 2023-03-23 Picosun Oy Solder mask

Also Published As

Publication number Publication date
SE7500019L (fr) 1975-07-09
CA1041848A (fr) 1978-11-07
DE2400665A1 (de) 1975-07-10
NL7417056A (nl) 1975-07-10
DE2400665C3 (de) 1979-04-05
ATA940974A (de) 1978-04-15
JPS5199263A (en) 1976-09-01
AT346956B (de) 1978-12-11
DE2400665B2 (de) 1977-03-17
GB1474247A (en) 1977-05-18
FR2257188A1 (fr) 1975-08-01
BE824182A (fr) 1975-05-02
CH582980A5 (fr) 1976-12-15

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