IN2015DN03284A - - Google Patents

Info

Publication number
IN2015DN03284A
IN2015DN03284A IN3284DEN2015A IN2015DN03284A IN 2015DN03284 A IN2015DN03284 A IN 2015DN03284A IN 3284DEN2015 A IN3284DEN2015 A IN 3284DEN2015A IN 2015DN03284 A IN2015DN03284 A IN 2015DN03284A
Authority
IN
India
Prior art keywords
substrate
pattern
layer
providing
forming
Prior art date
Application number
Other languages
English (en)
Inventor
Dror Kella
Eyal Negreanu
Gidi Amir
Mark Sandler
Yaron Grinwald
Original Assignee
Hewlett Packard Indigo Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Indigo Bv filed Critical Hewlett Packard Indigo Bv
Publication of IN2015DN03284A publication Critical patent/IN2015DN03284A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1266—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by electrographic or magnetographic printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00—Apparatus for electrographic processes using a charge pattern
    • G03G15/22—Apparatus for electrographic processes using a charge pattern involving the combination of more than one step according to groups G03G13/02 - G03G13/20
    • G03G15/24—Apparatus for electrographic processes using a charge pattern involving the combination of more than one step according to groups G03G13/02 - G03G13/20 whereby at least two steps are performed simultaneously
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00—Apparatus for electrographic processes using a charge pattern
    • G03G15/65—Apparatus which relate to the handling of copy material
    • G03G15/6582—Special processing for irreversibly adding or changing the sheet copy material characteristics or its appearance, e.g. stamping, annotation printing, punching
    • G03G15/6585—Special processing for irreversibly adding or changing the sheet copy material characteristics or its appearance, e.g. stamping, annotation printing, punching by using non-standard toners, e.g. transparent toner, gloss adding devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00—Apparatus for electrographic processes using a charge pattern
    • G03G15/65—Apparatus which relate to the handling of copy material
    • G03G15/6588—Apparatus which relate to the handling of copy material characterised by the copy material, e.g. postcards, large copies, multi-layered materials, coloured sheet material
    • G03G15/6591—Apparatus which relate to the handling of copy material characterised by the copy material, e.g. postcards, large copies, multi-layered materials, coloured sheet material characterised by the recording material, e.g. plastic material, OHP, ceramics, tiles, textiles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0517—Electrographic patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0522—Using an adhesive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Textile Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Printing Methods (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Ink Jet (AREA)
  • Decoration By Transfer Pictures (AREA)
  • Ink Jet Recording Methods And Recording Media Thereof (AREA)
  • Laminated Bodies (AREA)
IN3284DEN2015 2012-10-31 2012-10-31 IN2015DN03284A (ar)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2012/071638 WO2014067578A1 (en) 2012-10-31 2012-10-31 Method and apparatus for forming on a substrate a pattern of a material

Publications (1)

Publication Number Publication Date
IN2015DN03284A true IN2015DN03284A (ar) 2015-10-09

Family

ID=47115974

Family Applications (1)

Application Number Title Priority Date Filing Date
IN3284DEN2015 IN2015DN03284A (ar) 2012-10-31 2012-10-31

Country Status (6)

Country Link
US (2) US10588221B2 (ar)
EP (1) EP2915414B1 (ar)
CN (1) CN104854967B (ar)
BR (1) BR112015009655B1 (ar)
IN (1) IN2015DN03284A (ar)
WO (1) WO2014067578A1 (ar)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106576427A (zh) * 2014-08-13 2017-04-19 R.R.当纳利父子公司 生产电子器件的方法和设备
US9514432B2 (en) 2014-08-19 2016-12-06 R.R. Donnelley & Sons Company Apparatus and method for monitoring a package during transit
CN108136795B (zh) * 2015-08-20 2019-12-20 惠普深蓝有限责任公司 打印小平面
US9691303B2 (en) 2015-09-14 2017-06-27 R.R. Donnelley & Sons Company Electronic label having a timer function
JP6546694B2 (ja) 2015-10-23 2019-07-17 エイチピー・インディゴ・ビー・ブイＨＰ Ｉｎｄｉｇｏ Ｂ．Ｖ． 熱転写印刷
CN107921746B (zh) 2015-10-23 2020-10-02 惠普印迪戈股份公司 层压件
CN107921733B (zh) 2015-10-23 2020-09-29 惠普印迪戈股份公司 层压件
WO2017071751A1 (en) * 2015-10-28 2017-05-04 Hewlett-Packard Indigo B.V. Electrophotographic printing
WO2017120226A1 (en) 2016-01-04 2017-07-13 R.R. Donnelley & Sons Company Multiple detector apparatus and method for monitoring an environment
US9785881B2 (en) 2016-02-15 2017-10-10 R.R. Donnelley & Sons Company System and method for producing an electronic device
GB201613051D0 (en) 2016-07-28 2016-09-14 Landa Labs (2012) Ltd Applying an electrical conductor to a substrate
AU2019200607B2 (en) * 2016-07-28 2019-10-10 Lumet Technologies Ltd. Apparatus for application of a conductive pattern to a substrate
US10342136B2 (en) 2016-09-23 2019-07-02 R.R. Donnelley & Sons Company Monitoring device
US10445692B2 (en) 2017-03-06 2019-10-15 Cryovac, Llc Monitoring device and method of operating a monitoring device to transmit data
US11240916B2 (en) 2017-05-31 2022-02-01 Cryovac, Llc Electronic device, method and apparatus for producing an electronic device, and composition therefor
US10682837B2 (en) 2017-06-09 2020-06-16 The Proctor & Gamble Company Method and compositions for applying a material onto articles
US20220302339A1 (en) * 2021-03-16 2022-09-22 Applied Materials, Inc. Led transfer materials and processes

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4775439A (en) * 1983-07-25 1988-10-04 Amoco Corporation Method of making high metal content circuit patterns on plastic boards
IL73386A0 (en) * 1984-01-09 1985-01-31 Stauffer Chemical Co Transfer laminate and method of forming an electrical circuit pattern therewith
US5045141A (en) * 1988-07-01 1991-09-03 Amoco Corporation Method of making solderable printed circuits formed without plating
US5591290A (en) 1995-01-23 1997-01-07 Wallace Computer Services, Inc. Method of making a laminate having variable adhesive properties
US5676787A (en) 1995-06-07 1997-10-14 Borden Decorative Products, Inc. Method for making repositionable wall covering and intermediate for same
US6207268B1 (en) * 1996-11-12 2001-03-27 Dai Nippon Printing Co., Ltd. Transfer sheet, and pattern-forming method
CN1296728A (zh) * 1998-02-06 2001-05-23 弗莱康股份有限公司 可转移的薄膜电气元件
US7364769B2 (en) * 2003-05-13 2008-04-29 Ricoh Company, Ltd. Apparatus and method for formation of a wiring pattern on a substrate, and electronic devices and producing methods thereof
US7560215B2 (en) 2004-10-04 2009-07-14 Hewlett-Packard Development Company, L.P. Printed circuit board printing system and method using liquid electrophotographic printing
WO2006076610A2 (en) * 2005-01-14 2006-07-20 Cabot Corporation Controlling ink migration during the formation of printable electronic features
JP4580830B2 (ja) 2005-07-08 2010-11-17 株式会社日立製作所 画像形成方法及びそれを用いた画像形成装置
JP4730232B2 (ja) 2006-07-05 2011-07-20 株式会社日立製作所 基板への導電パターン形成装置および導電パターン形成方法
JP2009028943A (ja) 2007-07-25 2009-02-12 Hideo Hamada 転写印刷シート
US8417171B2 (en) * 2008-10-24 2013-04-09 Eastman Kodak Company Method and apparatus for printing embossed reflective images
CN101420064A (zh) 2008-12-08 2009-04-29 宗小林 一种射频识别标签天线的制备方法
JP5546943B2 (ja) 2010-05-12 2014-07-09 株式会社アフィット 回路基板の製造方法
CN102452239A (zh) 2010-10-22 2012-05-16 韩国科学技术院 图案转印方法和图案转印装置以及利用该方法制造的产品

Also Published As

Publication number Publication date
CN104854967A (zh) 2015-08-19
EP2915414B1 (en) 2020-10-07
EP2915414A1 (en) 2015-09-09
BR112015009655A2 (pt) 2017-07-04
US10588221B2 (en) 2020-03-10
US20200163222A1 (en) 2020-05-21
US11206738B2 (en) 2021-12-21
US20150351250A1 (en) 2015-12-03
BR112015009655B1 (pt) 2020-12-29
CN104854967B (zh) 2018-05-22
WO2014067578A1 (en) 2014-05-08

Similar Documents

Publication Publication Date Title
IN2015DN03284A (ar)
WO2011063089A3 (en) Surface-modified adhesives
GB2459372B (en) An article and a method of making an article
EP4293706A3 (en) Direct and sequential formation of monolayers of boron nitride and graphene on substrates
WO2011014606A3 (en) Glass substrate comprising an edge web portion
IN2015DN03215A (ar)
GB201317886D0 (en) Method for forming bonded structures and bonded structures formed thereby
WO2011063082A3 (en) Surface-modified adhesives
WO2011099831A3 (ko) 그래핀을 이용한 유연성 투명 발열체 및 이의 제조 방법
MX2016002395A (es) Composiciones de revestimiento y aglutinantes para placas de yeso.
WO2012021197A3 (en) Method of manufacturing electronic devices on both sides of a carrier substrate and electronic devices thereof
TWI365812B (en) Transfer film, method of manufacturing the same, transfer method and object surface structure
WO2008139742A1 (ja) 粘着シート
WO2011032135A3 (en) Light-extraction graphics film
MX2011007280A (es) Sensor de radiacion electromagnetica y metodo de fabricacion.
MX2015005447A (es) Metodo para la manufactura de micro caracteristicas de producto impreso y disposicion para la produccion continua de tal producto.
WO2014150465A3 (en) Composite coatings and methods therefor
PH12015502250A1 (en) Release film for green sheet production
WO2013002609A3 (en) Touch panel and method for manufacturing the same
WO2011025149A3 (ko) 반도체 기판 제조 방법 및 발광 소자 제조 방법
GB201215891D0 (en) Composite material comprising a layer of polymeric piezoelectic material matched with a textile substrate and method for making such a composite material
WO2010139777A3 (fr) Article pour enduit en feuille pour application sur une paroi a decorer, procede de fabrication et procede d'application associes
MY168172A (en) Adhesive sheet manufacturing semiconductor device and manufacturing method of semiconductor device
WO2012047069A3 (ko) 발광소자 및 그 제조방법
WO2010143895A3 (en) Semiconductor substrate, semiconductor device, and manufacturing methods thereof