IN2015DN02749A - - Google Patents
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- Publication number
- IN2015DN02749A IN2015DN02749A IN2749DEN2015A IN2015DN02749A IN 2015DN02749 A IN2015DN02749 A IN 2015DN02749A IN 2749DEN2015 A IN2749DEN2015 A IN 2749DEN2015A IN 2015DN02749 A IN2015DN02749 A IN 2015DN02749A
- Authority
- IN
- India
- Prior art keywords
- signals
- layers
- distinct
- carrying
- circuit board
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
- H05K7/1439—Back panel mother boards
- H05K7/1444—Complex or three-dimensional-arrangements; Stepped or dual mother boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1424—Card cages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
- H05K7/1459—Circuit configuration, e.g. routing signals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0062—Structures of standardised dimensions, e.g. 19" rack, chassis for servers or telecommunications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Networks & Wireless Communication (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
- Cable Transmission Systems, Equalization Of Radio And Reduction Of Echo (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261697711P | 2012-09-06 | 2012-09-06 | |
US201361798395P | 2013-03-15 | 2013-03-15 | |
US201361798800P | 2013-03-15 | 2013-03-15 | |
PCT/US2013/058645 WO2014039924A1 (en) | 2012-09-06 | 2013-09-06 | Reducing crosstalk in board-to-board electronic communication |
Publications (1)
Publication Number | Publication Date |
---|---|
IN2015DN02749A true IN2015DN02749A (de) | 2015-08-28 |
Family
ID=50237641
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IN2749DEN2015 IN2015DN02749A (de) | 2012-09-06 | 2013-09-06 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20150181774A1 (de) |
EP (1) | EP2893457A4 (de) |
JP (1) | JP2015530717A (de) |
CN (1) | CN104854573A (de) |
IN (1) | IN2015DN02749A (de) |
WO (1) | WO2014039924A1 (de) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9907156B1 (en) | 2015-03-06 | 2018-02-27 | Juniper Networks, Inc. | Cross-talk reduction for high speed signaling at ball grid array region and connector region |
US10283885B2 (en) * | 2015-11-06 | 2019-05-07 | Foxconn Interconnect Technology Limited | Electrical connector assembly and system using the same |
US10390462B2 (en) * | 2017-02-16 | 2019-08-20 | Dell Products, Lp | Server chassis with independent orthogonal airflow layout |
JP7091203B2 (ja) | 2018-09-19 | 2022-06-27 | キオクシア株式会社 | メモリシステムおよび制御方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0548278A (ja) * | 1991-08-09 | 1993-02-26 | Toshiba Corp | スロツト挿入型信号処理ボード |
US6816486B1 (en) * | 1999-03-25 | 2004-11-09 | Inrange Technologies Corporation | Cross-midplane switch topology |
US6325636B1 (en) * | 2000-07-20 | 2001-12-04 | Rlx Technologies, Inc. | Passive midplane for coupling web server processing cards with a network interface(s) |
US6757177B2 (en) * | 2001-07-05 | 2004-06-29 | Tropic Networks Inc. | Stacked backplane assembly |
JP4258168B2 (ja) * | 2002-04-12 | 2009-04-30 | 日本電気株式会社 | マザーボード |
US6968413B2 (en) * | 2002-10-07 | 2005-11-22 | International Business Machines Corporation | Method and system for configuring terminators in a serial communication system |
US7154902B1 (en) * | 2002-10-21 | 2006-12-26 | Force10 Networks, Inc. | Epoch-based packet switching |
US6814582B2 (en) * | 2002-11-08 | 2004-11-09 | Force Computers, Inc. | Rear interconnect blade for rack mounted systems |
JP2005251965A (ja) * | 2004-03-04 | 2005-09-15 | Mitsubishi Electric Corp | 基板の接続構造 |
US7189926B2 (en) * | 2004-08-04 | 2007-03-13 | P-Two Industries Inc. | Low voltage differential signal (LVDS) interface flexible flat cable (FFC) and LVDS signal transmission system using the same |
US8307265B2 (en) * | 2009-03-09 | 2012-11-06 | Intel Corporation | Interconnection techniques |
CN101799973A (zh) * | 2010-01-26 | 2010-08-11 | 华为技术有限公司 | 一种信号传输电路及方法 |
US8724678B2 (en) * | 2010-05-28 | 2014-05-13 | Aquantia Corporation | Electromagnetic interference reduction in wireline applications using differential signal compensation |
-
2013
- 2013-09-06 WO PCT/US2013/058645 patent/WO2014039924A1/en active Application Filing
- 2013-09-06 IN IN2749DEN2015 patent/IN2015DN02749A/en unknown
- 2013-09-06 JP JP2015531272A patent/JP2015530717A/ja active Pending
- 2013-09-06 EP EP13836026.8A patent/EP2893457A4/de not_active Withdrawn
- 2013-09-06 CN CN201380052555.4A patent/CN104854573A/zh active Pending
-
2015
- 2015-03-05 US US14/639,605 patent/US20150181774A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
EP2893457A4 (de) | 2016-05-04 |
US20150181774A1 (en) | 2015-06-25 |
CN104854573A (zh) | 2015-08-19 |
JP2015530717A (ja) | 2015-10-15 |
EP2893457A1 (de) | 2015-07-15 |
WO2014039924A1 (en) | 2014-03-13 |
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