IN2015DN02629A - - Google Patents

Info

Publication number
IN2015DN02629A
IN2015DN02629A IN2629DEN2015A IN2015DN02629A IN 2015DN02629 A IN2015DN02629 A IN 2015DN02629A IN 2629DEN2015 A IN2629DEN2015 A IN 2629DEN2015A IN 2015DN02629 A IN2015DN02629 A IN 2015DN02629A
Authority
IN
India
Application number
Other languages
English (en)
Inventor
Andrey Pavlovich Ilin
Original Assignee
Kim No Eul
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kim No Eul filed Critical Kim No Eul
Publication of IN2015DN02629A publication Critical patent/IN2015DN02629A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
IN2629DEN2015 2013-04-24 2015-03-31 IN2015DN02629A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/IB2013/001292 WO2014174336A1 (en) 2013-04-24 2013-04-24 Power thyristor unit cooling system

Publications (1)

Publication Number Publication Date
IN2015DN02629A true IN2015DN02629A (zh) 2015-06-05

Family

ID=51791121

Family Applications (1)

Application Number Title Priority Date Filing Date
IN2629DEN2015 IN2015DN02629A (zh) 2013-04-24 2015-03-31

Country Status (5)

Country Link
KR (1) KR101551874B1 (zh)
CN (1) CN104823279B (zh)
HK (1) HK1213691A1 (zh)
IN (1) IN2015DN02629A (zh)
WO (1) WO2014174336A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6541812B1 (ja) * 2018-01-25 2019-07-10 三菱電機株式会社 ヒートシンクおよび半導体モジュール
KR102473908B1 (ko) * 2021-12-03 2022-12-06 네덱 주식회사 발열체 냉각용 주조품 및 이의 제조방법
DE102022211794A1 (de) 2022-11-08 2024-05-08 Robert Bosch Gesellschaft mit beschränkter Haftung Kühlkörper zur Kühlung einer elektrischen und/oder elektronischen Baugruppe

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3361195A (en) * 1966-09-23 1968-01-02 Westinghouse Electric Corp Heat sink member for a semiconductor device
US5453911A (en) * 1994-02-17 1995-09-26 General Motors Corporation Device for cooling power electronics
JP3391167B2 (ja) * 1995-10-27 2003-03-31 日立電線株式会社 吸熱器用伝熱管及びその製造方法
US5719444A (en) * 1996-04-26 1998-02-17 Tilton; Charles L. Packaging and cooling system for power semi-conductor
US6400012B1 (en) * 1997-09-17 2002-06-04 Advanced Energy Voorhees, Inc. Heat sink for use in cooling an integrated circuit
DE10009073A1 (de) * 1999-11-10 2001-05-17 Sms Demag Ag Kokille zum Stranggießen von Metall mit einem gekühlte Breitseitenwände und Schmalseitenwände aufweisenden, trichterförmig verjüngten Eingießbereich
CN201917256U (zh) * 2010-12-15 2011-08-03 茂名重力石化机械制造有限公司 列管式换热器的换热管及其列管式换热器

Also Published As

Publication number Publication date
CN104823279B (zh) 2017-09-08
KR20150041187A (ko) 2015-04-15
KR101551874B1 (ko) 2015-09-18
CN104823279A (zh) 2015-08-05
WO2014174336A1 (en) 2014-10-30
HK1213691A1 (zh) 2016-07-08

Similar Documents

Publication Publication Date Title
AP2016009275A0 (zh)
BR102016010778A2 (zh)
BR112015007533A2 (zh)
BR112014017733A2 (zh)
BR112014018502A2 (zh)
BR112014017739A2 (zh)
BR112014019326A2 (zh)
BR112014018516A2 (zh)
BR112014017855A2 (zh)
BR112014020341A2 (zh)
BR112014018480A2 (zh)
BR112014017765A2 (zh)
BR112014017669A2 (zh)
BR112014021878A2 (zh)
BR112014017901A2 (zh)
BR112014018468A2 (zh)
BR112014018207A2 (zh)
BR112014019204A2 (zh)
BR112015015948A2 (zh)
BR112014017722A2 (zh)
BR112016004544A2 (zh)
BR112014018578A2 (zh)
BR112014018483A2 (zh)
BR112014017794A2 (zh)
BR112014017653A2 (zh)