HK1213691A1 - 功率晶閘管單元冷卻系統 - Google Patents

功率晶閘管單元冷卻系統

Info

Publication number
HK1213691A1
HK1213691A1 HK16101422.8A HK16101422A HK1213691A1 HK 1213691 A1 HK1213691 A1 HK 1213691A1 HK 16101422 A HK16101422 A HK 16101422A HK 1213691 A1 HK1213691 A1 HK 1213691A1
Authority
HK
Hong Kong
Prior art keywords
cooling system
unit cooling
power thyristor
thyristor unit
power
Prior art date
Application number
HK16101422.8A
Other languages
English (en)
Inventor
．伊林
Original Assignee
No Eul Kim
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by No Eul Kim filed Critical No Eul Kim
Publication of HK1213691A1 publication Critical patent/HK1213691A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
HK16101422.8A 2013-04-24 2016-02-05 功率晶閘管單元冷卻系統 HK1213691A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/IB2013/001292 WO2014174336A1 (en) 2013-04-24 2013-04-24 Power thyristor unit cooling system

Publications (1)

Publication Number Publication Date
HK1213691A1 true HK1213691A1 (zh) 2016-07-08

Family

ID=51791121

Family Applications (1)

Application Number Title Priority Date Filing Date
HK16101422.8A HK1213691A1 (zh) 2013-04-24 2016-02-05 功率晶閘管單元冷卻系統

Country Status (5)

Country Link
KR (1) KR101551874B1 (zh)
CN (1) CN104823279B (zh)
HK (1) HK1213691A1 (zh)
IN (1) IN2015DN02629A (zh)
WO (1) WO2014174336A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6541812B1 (ja) * 2018-01-25 2019-07-10 三菱電機株式会社 ヒートシンクおよび半導体モジュール
KR102473908B1 (ko) * 2021-12-03 2022-12-06 네덱 주식회사 발열체 냉각용 주조품 및 이의 제조방법
DE102022211794A1 (de) 2022-11-08 2024-05-08 Robert Bosch Gesellschaft mit beschränkter Haftung Kühlkörper zur Kühlung einer elektrischen und/oder elektronischen Baugruppe

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3361195A (en) * 1966-09-23 1968-01-02 Westinghouse Electric Corp Heat sink member for a semiconductor device
US5453911A (en) * 1994-02-17 1995-09-26 General Motors Corporation Device for cooling power electronics
JP3391167B2 (ja) * 1995-10-27 2003-03-31 日立電線株式会社 吸熱器用伝熱管及びその製造方法
US5719444A (en) * 1996-04-26 1998-02-17 Tilton; Charles L. Packaging and cooling system for power semi-conductor
US6400012B1 (en) * 1997-09-17 2002-06-04 Advanced Energy Voorhees, Inc. Heat sink for use in cooling an integrated circuit
DE10009073A1 (de) * 1999-11-10 2001-05-17 Sms Demag Ag Kokille zum Stranggießen von Metall mit einem gekühlte Breitseitenwände und Schmalseitenwände aufweisenden, trichterförmig verjüngten Eingießbereich
CN201917256U (zh) * 2010-12-15 2011-08-03 茂名重力石化机械制造有限公司 列管式换热器的换热管及其列管式换热器

Also Published As

Publication number Publication date
IN2015DN02629A (zh) 2015-06-05
CN104823279A (zh) 2015-08-05
WO2014174336A1 (en) 2014-10-30
CN104823279B (zh) 2017-09-08
KR101551874B1 (ko) 2015-09-18
KR20150041187A (ko) 2015-04-15

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20220422

ARF Application filed for restoration

Effective date: 20231017

ARG Restoration of standard patent granted

Effective date: 20240618