IN2014DN10108A - - Google Patents

Info

Publication number
IN2014DN10108A
IN2014DN10108A IN10108DEN2014A IN2014DN10108A IN 2014DN10108 A IN2014DN10108 A IN 2014DN10108A IN 10108DEN2014 A IN10108DEN2014 A IN 10108DEN2014A IN 2014DN10108 A IN2014DN10108 A IN 2014DN10108A
Authority
IN
India
Prior art keywords
conductive particles
particles
adhesive compound
adhesive
fibrous
Prior art date
Application number
Other languages
English (en)
Inventor
Lesmona Scherf
Thorsten Krawinkel
Alexander Fischer
Original Assignee
Tesa Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tesa Se filed Critical Tesa Se
Publication of IN2014DN10108A publication Critical patent/IN2014DN10108A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L21/00—Compositions of unspecified rubbers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/16—Metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
IN10108DEN2014 2012-05-04 2013-04-05 IN2014DN10108A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012207462A DE102012207462A1 (de) 2012-05-04 2012-05-04 Dreidimensional elektrisch leitfähige Klebstofffolie
PCT/EP2013/057233 WO2013164154A1 (de) 2012-05-04 2013-04-05 Dreidimensional elektrisch leitfähige klebstofffolie

Publications (1)

Publication Number Publication Date
IN2014DN10108A true IN2014DN10108A (ko) 2015-08-21

Family

ID=48095832

Family Applications (1)

Application Number Title Priority Date Filing Date
IN10108DEN2014 IN2014DN10108A (ko) 2012-05-04 2013-04-05

Country Status (11)

Country Link
US (1) US9598614B2 (ko)
EP (1) EP2844690B1 (ko)
JP (1) JP2015521214A (ko)
KR (1) KR102085553B1 (ko)
CN (1) CN104284928B (ko)
DE (1) DE102012207462A1 (ko)
IN (1) IN2014DN10108A (ko)
MX (1) MX358202B (ko)
PL (1) PL2844690T3 (ko)
TW (1) TW201402772A (ko)
WO (1) WO2013164154A1 (ko)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160012931A1 (en) * 2014-07-11 2016-01-14 Tyco Electronics Corporation Conductive Particle
US20160012934A1 (en) * 2014-07-11 2016-01-14 Tyco Electronics Corporation Composite Formulation and Composite Product
JP6938152B2 (ja) * 2014-07-31 2021-09-22 タツタ電線株式会社 導電膜およびそれを備えた導電性シート
KR101836566B1 (ko) 2015-05-15 2018-03-08 현대자동차주식회사 도전성 접착제 및 이를 이용한 복합소재의 접합방법
JP6005312B1 (ja) 2016-02-10 2016-10-12 古河電気工業株式会社 導電性接着フィルムおよびこれを用いたダイシング・ダイボンディングフィルム
JP5972489B1 (ja) * 2016-02-10 2016-08-17 古河電気工業株式会社 導電性接着フィルムおよびこれを用いたダイシング・ダイボンディングフィルム
JP6005313B1 (ja) * 2016-02-10 2016-10-12 古河電気工業株式会社 導電性接着フィルムおよびこれを用いたダイシング・ダイボンディングフィルム
JP5972490B1 (ja) 2016-02-10 2016-08-17 古河電気工業株式会社 導電性接着剤組成物ならびにこれを用いた導電性接着フィルムおよびダイシング・ダイボンディングフィルム
JP5989928B1 (ja) * 2016-02-10 2016-09-07 古河電気工業株式会社 導電性接着フィルムおよびこれを用いたダイシング・ダイボンディングフィルム
WO2018042701A1 (ja) * 2016-08-30 2018-03-08 日立化成株式会社 接着剤組成物
US11168235B2 (en) * 2017-05-09 2021-11-09 3M Innovative Properties Company Electrically conductive adhesive
WO2019131904A1 (ja) 2017-12-28 2019-07-04 日立化成株式会社 接続構造体及びその製造方法
US20210017427A1 (en) * 2017-12-28 2021-01-21 Hitachi Chemical Company, Ltd. Adhesive film
WO2019151188A1 (ja) * 2018-01-30 2019-08-08 タツタ電線株式会社 導電性接着剤組成物
JP6805190B2 (ja) * 2018-01-30 2020-12-23 タツタ電線株式会社 導電性接着剤組成物
CN113825815B (zh) * 2019-05-31 2022-09-30 拓自达电线株式会社 各向同性导电性粘着片
TWI788670B (zh) * 2019-05-31 2023-01-01 日商拓自達電線股份有限公司 各向同性導電性黏著片

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3475213A (en) 1965-09-13 1969-10-28 Minnesota Mining & Mfg Electrically conductive adhesive tape
US3970608A (en) 1974-04-05 1976-07-20 Bridgestone Tire Company Limited Epoxidized acetylene-conjugated diene random copolymer and the curable composition comprising the same
US4113981A (en) 1974-08-14 1978-09-12 Kabushiki Kaisha Seikosha Electrically conductive adhesive connecting arrays of conductors
NL8204288A (nl) * 1982-11-05 1984-06-01 Gen Electric Polymeermengsel, werkwijze voor het bereiden van het polymeermengsel, voorwerpen gevormd uit het polymeermengsel.
US4606962A (en) 1983-06-13 1986-08-19 Minnesota Mining And Manufacturing Company Electrically and thermally conductive adhesive transfer tape
AU612771B2 (en) 1988-02-26 1991-07-18 Minnesota Mining And Manufacturing Company Electrically conductive pressure-sensitive adhesive tape
DE4012061A1 (de) * 1990-04-10 1991-10-17 Mittweida Ing Hochschule Loesungsmittelfreie isotrope leit- und klebepaste mit eingelagerten elektrisch leitfaehigen partikeln
DE19912628A1 (de) 1998-07-04 2000-01-05 Beiersdorf Ag Elektrisch leitfähige, thermoplastische und hitzeaktivierbare Klebstoffolie
US6861138B1 (en) 1998-07-04 2005-03-01 Tesa Ag Electrically conductive, thermoplastic, heat-activated adhesive film
DE19853805B4 (de) * 1998-11-21 2005-05-12 Tesa Ag Elektrisch leitfähige, thermoplastische und hitzeaktivierbare Klebstofffolie und deren Verwendung
JP2004288924A (ja) * 2003-03-24 2004-10-14 Alps Electric Co Ltd 可変抵抗器
JP2006032165A (ja) * 2004-07-16 2006-02-02 Sumitomo Metal Mining Co Ltd 導電性金属粒子とそれを用いた導電性樹脂組成物及び導電性接着剤
GB0710425D0 (en) * 2007-06-01 2007-07-11 Hexcel Composites Ltd Improved structural adhesive materials
CN102471651B (zh) * 2009-07-08 2013-07-17 汉高股份有限及两合公司 导电粘合剂
EP2431438B1 (en) * 2010-09-20 2012-11-28 Henkel AG & Co. KGaA Electrically conductive adhesives
DE102010060904A1 (de) * 2010-11-30 2012-05-31 Benecke-Kaliko Ag Polymermischung
EP4012061A1 (de) * 2020-12-09 2022-06-15 MTU Aero Engines AG Nickelbasislegierung und bauteil aus dieser

Also Published As

Publication number Publication date
CN104284928B (zh) 2016-04-13
KR20150013703A (ko) 2015-02-05
MX358202B (es) 2018-08-09
US9598614B2 (en) 2017-03-21
MX2014013046A (es) 2015-02-04
DE102012207462A1 (de) 2013-11-07
JP2015521214A (ja) 2015-07-27
EP2844690A1 (de) 2015-03-11
EP2844690B1 (de) 2016-07-20
KR102085553B1 (ko) 2020-03-06
PL2844690T3 (pl) 2016-12-30
WO2013164154A1 (de) 2013-11-07
TW201402772A (zh) 2014-01-16
US20150129812A1 (en) 2015-05-14
CN104284928A (zh) 2015-01-14

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