IN2014DN05679A - - Google Patents

Info

Publication number
IN2014DN05679A
IN2014DN05679A IN5679DEN2014A IN2014DN05679A IN 2014DN05679 A IN2014DN05679 A IN 2014DN05679A IN 5679DEN2014 A IN5679DEN2014 A IN 5679DEN2014A IN 2014DN05679 A IN2014DN05679 A IN 2014DN05679A
Authority
IN
India
Prior art keywords
heat
cooler
electronic circuit
circuit boards
rack
Prior art date
Application number
Other languages
English (en)
Inventor
Wei Ling
Salvatore Messana
Paul Rominski
Original Assignee
Alcatel Lucent
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel Lucent filed Critical Alcatel Lucent
Publication of IN2014DN05679A publication Critical patent/IN2014DN05679A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling
    • Y10T29/49817—Disassembling with other than ancillary treating or assembling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining

Landscapes

  • Engineering & Computer Science (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
IN5679DEN2014 2012-01-30 2013-01-28 IN2014DN05679A (ro)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/360,997 US8913391B2 (en) 2012-01-30 2012-01-30 Board-level heat transfer apparatus for communication platforms
PCT/US2013/023405 WO2013116143A1 (en) 2012-01-30 2013-01-28 A board-level heat transfer apparatus for communication platforms

Publications (1)

Publication Number Publication Date
IN2014DN05679A true IN2014DN05679A (ro) 2015-04-03

Family

ID=48870030

Family Applications (1)

Application Number Title Priority Date Filing Date
IN5679DEN2014 IN2014DN05679A (ro) 2012-01-30 2013-01-28

Country Status (7)

Country Link
US (1) US8913391B2 (ro)
EP (1) EP2810544A1 (ro)
JP (1) JP2015508919A (ro)
KR (1) KR20140117462A (ro)
CN (1) CN104081887A (ro)
IN (1) IN2014DN05679A (ro)
WO (1) WO2013116143A1 (ro)

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US9521782B2 (en) 2014-06-26 2016-12-13 General Electric Company Systems and methods for passive cooling of components within electrical devices
US9433132B2 (en) * 2014-08-08 2016-08-30 Intel Corporation Recirculating dielectric fluid cooling
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US10884203B2 (en) * 2015-11-16 2021-01-05 Accedian Networks Inc. Cooling apparatus for pluggable modules
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DE102021203625A1 (de) * 2021-04-13 2022-10-13 Robert Bosch Gesellschaft mit beschränkter Haftung Elektronikbaugruppe eines Kraftfahrzeugs
CN113347505A (zh) * 2021-04-23 2021-09-03 微网优联科技(成都)有限公司 一种路由器的散热结构
DE102022202015A1 (de) * 2022-02-28 2023-08-31 Robert Bosch Gesellschaft mit beschränkter Haftung Vorrichtung mit austauschbaren Elektronikbaugruppen eines Kraftfahrzeugs

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Also Published As

Publication number Publication date
WO2013116143A1 (en) 2013-08-08
KR20140117462A (ko) 2014-10-07
CN104081887A (zh) 2014-10-01
US8913391B2 (en) 2014-12-16
US20130194755A1 (en) 2013-08-01
EP2810544A1 (en) 2014-12-10
JP2015508919A (ja) 2015-03-23

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