IN2014DN03101A - - Google Patents

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Publication number
IN2014DN03101A
IN2014DN03101A IN3101DEN2014A IN2014DN03101A IN 2014DN03101 A IN2014DN03101 A IN 2014DN03101A IN 3101DEN2014 A IN3101DEN2014 A IN 3101DEN2014A IN 2014DN03101 A IN2014DN03101 A IN 2014DN03101A
Authority
IN
India
Prior art keywords
piece
sacrificial substrate
wafers
mpa
cutting
Prior art date
Application number
Other languages
English (en)
Inventor
Meyer Christy De
Jürg ZANETTI
Original Assignee
Meyer Burger Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meyer Burger Ag filed Critical Meyer Burger Ag
Publication of IN2014DN03101A publication Critical patent/IN2014DN03101A/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
IN3101DEN2014 2011-09-23 2012-09-19 IN2014DN03101A (enrdf_load_stackoverflow)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP11182589 2011-09-23
EP11190570A EP2572850A1 (en) 2011-09-23 2011-11-24 Sacrificial substrate for use in wafer cutting
PCT/IB2012/054972 WO2013042055A1 (en) 2011-09-23 2012-09-19 Wafer cutting sacrificial substrate for use in wafer cutting

Publications (1)

Publication Number Publication Date
IN2014DN03101A true IN2014DN03101A (enrdf_load_stackoverflow) 2015-05-15

Family

ID=45421834

Family Applications (1)

Application Number Title Priority Date Filing Date
IN3101DEN2014 IN2014DN03101A (enrdf_load_stackoverflow) 2011-09-23 2012-09-19

Country Status (4)

Country Link
EP (1) EP2572850A1 (enrdf_load_stackoverflow)
CN (1) CN103958140B (enrdf_load_stackoverflow)
IN (1) IN2014DN03101A (enrdf_load_stackoverflow)
WO (1) WO2013042055A1 (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103522428A (zh) * 2013-10-16 2014-01-22 内蒙古中环光伏材料有限公司 一种太阳能硅片加工方法及装置
EP3532231A1 (en) * 2016-10-26 2019-09-04 Meyer Burger (Switzerland) AG Wire saw
CN108927908B (zh) * 2018-07-12 2021-01-05 阜宁协鑫光伏科技有限公司 线切割机用的切割方法
CN109808271A (zh) * 2018-12-30 2019-05-28 苏州润德新材料有限公司 一种硅片切割用塑料支撑板及其制备方法
CN110076919A (zh) * 2019-05-31 2019-08-02 江苏吉星新材料有限公司 一种蓝宝石晶棒浸没式多线切割装置及方法
CN114932636B (zh) * 2022-04-28 2023-10-24 广东先导微电子科技有限公司 一种自动取片机

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2044482C3 (de) * 1970-09-08 1979-04-12 Cremer, Gottfried, Dr., 5000 Koeln Verfahren zum Schneiden von keramischen Platten, insbesondere solchen großen Formats
JPH1052816A (ja) * 1996-08-13 1998-02-24 M Ii M C Kk ワイヤ式切断方法
DE102007045455A1 (de) * 2007-09-24 2009-04-09 Schott Ag Verfahren zur Herstellung von Wafern aus Ingots
KR20100120685A (ko) * 2008-02-11 2010-11-16 엠이엠씨 일렉트로닉 머티리얼즈, 인크. 잉곳을 웨이퍼로 와이어소우 슬라이싱하는데 사용되는 탄소 나노튜브 강화 와이어소우 빔
ES2363862T3 (es) 2008-04-23 2011-08-18 Applied Materials Switzerland Sa Placa de montaje para un dispositivo de aserrado por hilo, dispositivo de aserrado por hilo que comprende la misma y procedimiento de aserrado por hilo llevado a cabo mediante el dispositivo.
WO2010128011A1 (en) 2009-05-04 2010-11-11 Meyer Burger Ag Wire saw
MY155758A (en) * 2010-01-06 2015-11-30 Shinetsu Chemical Co Rare earth magnet holding jig and cutting machine

Also Published As

Publication number Publication date
EP2572850A1 (en) 2013-03-27
CN103958140A (zh) 2014-07-30
WO2013042055A1 (en) 2013-03-28
CN103958140B (zh) 2020-06-09

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