IN2014CN03687A - - Google Patents
Info
- Publication number
- IN2014CN03687A IN2014CN03687A IN3687CHN2014A IN2014CN03687A IN 2014CN03687 A IN2014CN03687 A IN 2014CN03687A IN 3687CHN2014 A IN3687CHN2014 A IN 3687CHN2014A IN 2014CN03687 A IN2014CN03687 A IN 2014CN03687A
- Authority
- IN
- India
- Prior art keywords
- trenches
- recesses
- substrate
- metal structures
- dimensional
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1862—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by radiant energy
- C23C18/1868—Radiation, e.g. UV, laser
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2026—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by radiant energy
- C23C18/204—Radiation, e.g. UV, laser
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0029—Etching of the substrate by chemical or physical means by laser ablation of inorganic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Chemically Coating (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention relates to a method for producing a substrate comprising embedded conductive metal structures or metallizations in particular for use as printed circuit boards. The aim of the invention is to allow the buried metallization of three dimensional i.e. curved or angular substrates in addition to the two dimensional flat and level i.e. plate shaped substrates. According to the invention this is achieved in that trenches and/or recesses are dug into the substrate using laser technology and the metal structures are then produced in the trenches and/or recesses.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102011086464 | 2011-11-16 | ||
PCT/EP2012/072824 WO2013072457A1 (en) | 2011-11-16 | 2012-11-16 | Embedded metal structures in ceramic substrates |
Publications (1)
Publication Number | Publication Date |
---|---|
IN2014CN03687A true IN2014CN03687A (en) | 2015-07-03 |
Family
ID=47178728
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IN3687CHN2014 IN2014CN03687A (en) | 2011-11-16 | 2012-11-16 |
Country Status (12)
Country | Link |
---|---|
US (1) | US20140290985A1 (en) |
EP (1) | EP2781143A1 (en) |
JP (1) | JP2014533775A (en) |
KR (1) | KR20140094006A (en) |
CN (1) | CN103931277A (en) |
BR (1) | BR112014011810A2 (en) |
DE (1) | DE102012220948A1 (en) |
IN (1) | IN2014CN03687A (en) |
PH (1) | PH12014501099A1 (en) |
RU (1) | RU2014124000A (en) |
TW (1) | TWI613177B (en) |
WO (1) | WO2013072457A1 (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103448308B (en) * | 2013-09-18 | 2015-08-05 | 电子科技大学 | A kind of biodegradable flexible conductive base plate and preparation method thereof |
CN104294244B (en) * | 2014-10-24 | 2017-05-31 | 中国科学院上海光学精密机械研究所 | The method that two-dimensional surface metal structure is realized in Laser-assisted chemical mixing plating |
WO2016110531A1 (en) * | 2015-01-08 | 2016-07-14 | Ceramtec Gmbh | Conductive connection of laser-introduced signal conductor tracks to paste-metallized pads on aln substrates |
JP6502204B2 (en) * | 2015-08-04 | 2019-04-17 | 株式会社ダイセル | Circuit board and method of manufacturing the same |
JP2017034150A (en) * | 2015-08-04 | 2017-02-09 | 株式会社ダイセル | Circuit substrate and manufacturing method of the same |
CN108394856A (en) * | 2018-01-31 | 2018-08-14 | 华东师范大学 | The method that transparent material is internally integrated three-dimensional conductive metal micro-nanostructure |
CN108411286B (en) * | 2018-01-31 | 2023-11-24 | 华东师范大学 | Manufacturing method of three-dimensional conductive metal micro-nano structure with arbitrary configuration |
CN110536557B (en) * | 2018-05-24 | 2020-12-11 | 中国科学院理化技术研究所 | Circuit line based on laser burning and carving molding, circuit and antenna manufacturing method |
JP7283038B2 (en) * | 2018-08-03 | 2023-05-30 | 富士電機株式会社 | Laminated substrate manufacturing method, semiconductor module manufacturing method, laminated substrate, and semiconductor module |
CN109195338A (en) * | 2018-10-26 | 2019-01-11 | 恩达电路(深圳)有限公司 | Aluminium oxide ceramics circuit board manufacturing method |
CN110392489A (en) * | 2019-07-09 | 2019-10-29 | 江苏大学 | A kind of preparation method of the deformable wiring board based on shape-memory polymer |
DE102021107711A1 (en) | 2021-03-26 | 2022-09-29 | Gottfried Wilhelm Leibniz Universität Hannover, Körperschaft des öffentlichen Rechts | Electrical component and method for its manufacture |
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US4062829A (en) * | 1976-11-08 | 1977-12-13 | Emery Industries, Inc. | Polyester compositions and methods of stabilizing same |
CH645208A5 (en) * | 1978-10-31 | 1984-09-14 | Bbc Brown Boveri & Cie | PROCESS FOR MAKING ELECTRICAL CONTACTS ON SEMICONDUCTOR COMPONENTS. |
US4425378A (en) * | 1981-07-06 | 1984-01-10 | Sprague Electric Company | Electroless nickel plating activator composition a method for using and a ceramic capacitor made therewith |
US4691091A (en) * | 1985-12-31 | 1987-09-01 | At&T Technologies | Direct writing of conductive patterns |
JPH0712991B2 (en) * | 1986-09-26 | 1995-02-15 | 株式会社東芝 | Selection method of ceramic materials |
DE3826046A1 (en) * | 1987-08-17 | 1989-03-02 | Asea Brown Boveri | METHOD FOR PRODUCING METAL LAYERS |
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US5225251A (en) * | 1989-12-22 | 1993-07-06 | Asea Brown Boveri Aktiengesellschaft | Method for forming layers by UV radiation of aluminum nitride |
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JP3165779B2 (en) * | 1995-07-18 | 2001-05-14 | 株式会社トクヤマ | Submount |
JP2000138313A (en) * | 1998-10-30 | 2000-05-16 | Shinko Electric Ind Co Ltd | Semiconductor device and its manufacture |
US6579818B2 (en) * | 2000-08-28 | 2003-06-17 | Kyocera Corporation | Glass ceramic sintered product |
JP5057620B2 (en) * | 2000-08-28 | 2012-10-24 | 京セラ株式会社 | Low-temperature fired ceramic sintered body and wiring board |
JP3548130B2 (en) * | 2001-03-28 | 2004-07-28 | 株式会社東芝 | Method for producing composite member, photosensitive composition and porous substrate |
US20030108664A1 (en) * | 2001-10-05 | 2003-06-12 | Kodas Toivo T. | Methods and compositions for the formation of recessed electrical features on a substrate |
CN1142710C (en) * | 2002-03-25 | 2004-03-17 | 华中科技大学 | Laser induced liquid-phase deposition method for making electrically conductive lines on PCB |
EP1524331A1 (en) * | 2003-10-17 | 2005-04-20 | Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO | Method for metallizing a component comprising parts of different non-metallic materials |
EP1622435A1 (en) * | 2004-07-28 | 2006-02-01 | ATOTECH Deutschland GmbH | Method of manufacturing an electronic circuit assembly using direct write techniques |
JP2006059942A (en) * | 2004-08-19 | 2006-03-02 | Mamoru Onda | Wiring board, manufacturing method thereof electronic equipment and electronic device using the same |
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JPWO2007111314A1 (en) * | 2006-03-28 | 2009-08-13 | 日本ゼオン株式会社 | Multilayer printed wiring board manufacturing method and composite film |
DE102006017630A1 (en) * | 2006-04-12 | 2007-10-18 | Lpkf Laser & Electronics Ag | Method for producing a printed conductor structure and a printed conductor structure produced in this way |
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JP4914796B2 (en) * | 2007-10-04 | 2012-04-11 | オリンパス株式会社 | Wiring board manufacturing method and wiring board |
JP4822163B2 (en) * | 2007-11-30 | 2011-11-24 | 株式会社吉野工業所 | Decorative synthetic resin molded product and surface treatment method for synthetic resin molded product |
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KR101077380B1 (en) * | 2009-07-31 | 2011-10-26 | 삼성전기주식회사 | A printed circuit board and a fabricating method the same |
JP5432672B2 (en) * | 2009-11-04 | 2014-03-05 | パナソニック株式会社 | Circuit board |
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-
2012
- 2012-11-15 TW TW101142579A patent/TWI613177B/en not_active IP Right Cessation
- 2012-11-16 KR KR1020147016377A patent/KR20140094006A/en not_active Application Discontinuation
- 2012-11-16 BR BR112014011810A patent/BR112014011810A2/en not_active Application Discontinuation
- 2012-11-16 WO PCT/EP2012/072824 patent/WO2013072457A1/en active Application Filing
- 2012-11-16 CN CN201280056559.5A patent/CN103931277A/en active Pending
- 2012-11-16 IN IN3687CHN2014 patent/IN2014CN03687A/en unknown
- 2012-11-16 US US14/358,252 patent/US20140290985A1/en not_active Abandoned
- 2012-11-16 EP EP12787011.1A patent/EP2781143A1/en not_active Withdrawn
- 2012-11-16 DE DE102012220948A patent/DE102012220948A1/en not_active Withdrawn
- 2012-11-16 RU RU2014124000/07A patent/RU2014124000A/en not_active Application Discontinuation
- 2012-11-16 JP JP2014541680A patent/JP2014533775A/en active Pending
-
2014
- 2014-05-15 PH PH12014501099A patent/PH12014501099A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
PH12014501099A1 (en) | 2014-08-04 |
RU2014124000A (en) | 2015-12-27 |
EP2781143A1 (en) | 2014-09-24 |
BR112014011810A2 (en) | 2017-05-02 |
KR20140094006A (en) | 2014-07-29 |
CN103931277A (en) | 2014-07-16 |
DE102012220948A1 (en) | 2013-05-16 |
TWI613177B (en) | 2018-02-01 |
JP2014533775A (en) | 2014-12-15 |
TW201341339A (en) | 2013-10-16 |
WO2013072457A1 (en) | 2013-05-23 |
US20140290985A1 (en) | 2014-10-02 |
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