IN168868B - - Google Patents
Info
- Publication number
- IN168868B IN168868B IN203/CAL/88A IN203CA1988A IN168868B IN 168868 B IN168868 B IN 168868B IN 203CA1988 A IN203CA1988 A IN 203CA1988A IN 168868 B IN168868 B IN 168868B
- Authority
- IN
- India
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B5/00—Presses characterised by the use of pressing means other than those mentioned in the preceding groups
- B30B5/04—Presses characterised by the use of pressing means other than those mentioned in the preceding groups wherein the pressing means is in the form of an endless band
- B30B5/06—Presses characterised by the use of pressing means other than those mentioned in the preceding groups wherein the pressing means is in the form of an endless band co-operating with another endless band
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19873716531 DE3716531A1 (de) | 1987-04-09 | 1987-05-16 | Verfahren zum kontinuierlichen herstellen von bandfoermigem basismaterial |
Publications (1)
Publication Number | Publication Date |
---|---|
IN168868B true IN168868B (no) | 1991-06-29 |
Family
ID=6327754
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IN203/CAL/88A IN168868B (no) | 1987-05-16 | 1988-03-08 |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP0291629A3 (no) |
IN (1) | IN168868B (no) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4009182A1 (de) * | 1990-03-22 | 1991-09-26 | Bayer Ag | Laminierte flaechengebilde |
US5173150A (en) * | 1990-04-23 | 1992-12-22 | Mitsubishi Gas Chemical Co., Ltd. | Process for producing printed circuit board |
SE513341C2 (sv) * | 1998-10-06 | 2000-08-28 | Ericsson Telefon Ab L M | Arrangemang med tryckta kretskort samt metod för tillverkning därav |
JP3972895B2 (ja) * | 2003-12-10 | 2007-09-05 | 松下電器産業株式会社 | 回路基板の製造方法 |
DE102007040098A1 (de) | 2007-08-24 | 2009-02-26 | Elringklinger Ag | Trägerfolie |
GB2498994B (en) * | 2012-02-02 | 2014-03-19 | Trackwise Designs Ltd | Method of making a flexible circuit |
DE102013104785A1 (de) | 2013-05-08 | 2014-11-13 | Alanod Gmbh & Co. Kg | Dekoratives Verbundelement |
DE202017003887U1 (de) | 2017-07-21 | 2017-08-17 | Lanxess Deutschland Gmbh | Sitzstrukturen |
DE202017003888U1 (de) | 2017-07-21 | 2017-08-10 | Lanxess Deutschland Gmbh | Ölbehälter |
DE202017003886U1 (de) | 2017-07-21 | 2017-08-17 | Lanxess Deutschland Gmbh | Türmodul |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3413434A1 (de) * | 1984-04-10 | 1985-10-17 | Dielektra GmbH, 5000 Köln | Verfahren zum kontinuierlichen herstellen von kupferkaschiertem basismaterial fuer leiterplatten |
US4659425A (en) * | 1986-02-03 | 1987-04-21 | Ibm Corporation | Continuous process for the manufacture of printed circuit boards |
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1988
- 1988-01-30 EP EP88101350A patent/EP0291629A3/de not_active Withdrawn
- 1988-03-08 IN IN203/CAL/88A patent/IN168868B/en unknown
Also Published As
Publication number | Publication date |
---|---|
EP0291629A3 (de) | 1990-02-28 |
EP0291629A2 (de) | 1988-11-23 |