IN158361B - - Google Patents

Info

Publication number
IN158361B
IN158361B IN380/CAL/83A IN380CA1983A IN158361B IN 158361 B IN158361 B IN 158361B IN 380CA1983 A IN380CA1983 A IN 380CA1983A IN 158361 B IN158361 B IN 158361B
Authority
IN
India
Prior art keywords
pressure element
recess
walls
lateral surfaces
semiconductor components
Prior art date
Application number
IN380/CAL/83A
Other languages
English (en)
Inventor
Kurt Grossmann
Jurgen Bliesner
Joachim Schikor
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of IN158361B publication Critical patent/IN158361B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Lubricants (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Load-Engaging Elements For Cranes (AREA)
  • Forklifts And Lifting Vehicles (AREA)
IN380/CAL/83A 1982-04-23 1983-03-30 IN158361B (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19823215192 DE3215192A1 (de) 1982-04-23 1982-04-23 Einspannvorrichtung fuer scheibenfoermige halbleiter-bauelemente

Publications (1)

Publication Number Publication Date
IN158361B true IN158361B (xx) 1986-10-25

Family

ID=6161750

Family Applications (1)

Application Number Title Priority Date Filing Date
IN380/CAL/83A IN158361B (xx) 1982-04-23 1983-03-30

Country Status (7)

Country Link
US (1) US4638404A (xx)
EP (1) EP0092720B1 (xx)
JP (1) JPS58192400A (xx)
AT (1) ATE15733T1 (xx)
BR (1) BR8302014A (xx)
DE (2) DE3215192A1 (xx)
IN (1) IN158361B (xx)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3446569C2 (de) * 1984-12-20 1996-05-02 Siemens Ag Einspannvorrichtung für mehrere, scheibenförmige Halbleiterbauelemente
US4792204A (en) * 1987-06-08 1988-12-20 Siemens Aktiengesellschaft Process and apparatus for elimination of tolerance dependent variations of a selectable spacing between components in optical communication equipment
DE3853197T2 (de) * 1987-12-07 1995-06-29 Nippon Electric Co Kühlungssystem für integrierte Schaltungspackung.
DE68925403T2 (de) * 1988-09-20 1996-05-30 Nippon Electric Co Kühlungsstruktur für elektronische Bauelemente
US5060115A (en) * 1990-09-28 1991-10-22 The United States Of America As Represented By The Secretary Of The Navy Heat sink device for electronics modules packaged in cylindrical casings
JP2728105B2 (ja) * 1991-10-21 1998-03-18 日本電気株式会社 集積回路用冷却装置
JPH05327283A (ja) * 1992-02-18 1993-12-10 Samsung Electron Co Ltd 半導体パッケージの垂直実装装置及びその実装方法
US5184281A (en) * 1992-03-03 1993-02-02 Digital Equipment Corporation Heat dissipation apparatus
IT1292590B1 (it) * 1997-05-30 1999-02-08 El Bo Mec S R L Dissipatore di calore, in particolare per componenti elettronici.
US6038156A (en) * 1998-06-09 2000-03-14 Heart Interface Corporation Power inverter with improved heat sink configuration
US6304449B1 (en) * 1999-07-06 2001-10-16 Chaojiong Zhang Heat sink mounting for power semiconductors
TWI303973B (en) * 2006-09-06 2008-12-01 Delta Electronics Inc Heat sink fastening device and manufacturing method thereof
JP5634621B2 (ja) 2011-11-30 2014-12-03 三菱電機株式会社 半導体装置、及び車載用電力変換装置
DE102015206992A1 (de) * 2015-04-17 2016-10-20 Zf Friedrichshafen Ag Anbindung eines Leistungsbauteils an einen Kühlkörper
US11076477B2 (en) * 2017-10-03 2021-07-27 Mks Instruments, Inc. Cooling and compression clamp for short lead power devices

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1439304B2 (de) * 1963-10-31 1972-02-24 Siemens AG, 1000 Berlin u. 8000 München Halbleiterbauelement
CH440464A (de) * 1966-07-14 1967-07-31 Bbc Brown Boveri & Cie Kühlkörper für Halbleiterelemente
US3735206A (en) * 1971-10-28 1973-05-22 Nasa Circuit board package with wedge shaped covers
BE814391A (fr) * 1973-05-14 1974-08-16 Module semi-conducteur
DE2602589C2 (de) * 1976-01-22 1982-02-18 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Vorrichtung zum Einspannen eines Scheibenthyristors zwischen zwei Kühlkörpern
US4246597A (en) * 1979-06-29 1981-01-20 International Business Machines Corporation Air cooled multi-chip module having a heat conductive piston spring loaded against the chips
SU997140A1 (ru) * 1981-06-22 1983-02-15 За витель Полупроводникова выпр мительна установка
US4459639A (en) * 1982-07-12 1984-07-10 Rockwell International Corporation Circuit board heatsink clamping assembly and technique
DE3378871D1 (en) * 1982-09-09 1989-02-09 Siemens Ag Cooling device for a plurality of integrated components assembled as a flat structure

Also Published As

Publication number Publication date
DE3360822D1 (en) 1985-10-24
JPS58192400A (ja) 1983-11-09
JPS6327861B2 (xx) 1988-06-06
ATE15733T1 (de) 1985-10-15
DE3215192A1 (de) 1983-10-27
EP0092720A1 (de) 1983-11-02
EP0092720B1 (de) 1985-09-18
BR8302014A (pt) 1983-12-27
US4638404A (en) 1987-01-20

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