IN149708B - - Google Patents
Info
- Publication number
- IN149708B IN149708B IN2846/CAL/74A IN2846CA1974A IN149708B IN 149708 B IN149708 B IN 149708B IN 2846CA1974 A IN2846CA1974 A IN 2846CA1974A IN 149708 B IN149708 B IN 149708B
- Authority
- IN
- India
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Gasket Seals (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB2391/74A GB1489603A (en) | 1974-01-18 | 1974-01-18 | Semi-conductor assemblies |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IN149708B true IN149708B (cs) | 1982-03-20 |
Family
ID=9738724
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IN2846/CAL/74A IN149708B (cs) | 1974-01-18 | 1974-12-24 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US4007477A (cs) |
| AR (1) | AR201530A1 (cs) |
| DE (1) | DE2501337A1 (cs) |
| ES (1) | ES208825Y (cs) |
| FR (1) | FR2258709B1 (cs) |
| GB (1) | GB1489603A (cs) |
| IN (1) | IN149708B (cs) |
| IT (1) | IT1026361B (cs) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4099201A (en) * | 1977-04-11 | 1978-07-04 | General Electric Company | Semiconductor rectifier assembly having an insulating material therein that evolves gases when exposed to an arc |
| DE2734571A1 (de) * | 1977-07-30 | 1979-02-15 | Bosch Gmbh Robert | Gleichrichteranordnung |
| US4167744A (en) * | 1978-03-23 | 1979-09-11 | Rca Corporation | Electroluminescent semiconductor device having optical fiber window |
| FR2421465A1 (fr) * | 1978-03-30 | 1979-10-26 | Sev Marchal | Diode de puissance a element semi-conducteur destinee notamment a equiper un pont redresseur d'alternateur |
| US4403102A (en) * | 1979-11-13 | 1983-09-06 | Thermalloy Incorporated | Heat sink mounting |
| DE3124692A1 (de) * | 1981-06-24 | 1983-01-13 | Robert Bosch Gmbh, 7000 Stuttgart | "halbleitergleichrichter" |
| US4521827A (en) * | 1981-10-23 | 1985-06-04 | Thermalloy, Inc. | Heat sink mounting |
| US4587377A (en) * | 1984-09-21 | 1986-05-06 | Illinois Tool Works Inc. | Electrically insulating fastener for heat sinks of different thicknesses |
| US20040042178A1 (en) * | 2002-09-03 | 2004-03-04 | Vadim Gektin | Heat spreader with surface cavity |
| DE102011056848A1 (de) * | 2011-12-22 | 2013-06-27 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul oder Ansteuermodul hierfür |
| DE102013103116B3 (de) * | 2013-03-27 | 2014-09-18 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul und Verfahren zur Herstellung eines Leistungshalbleitermoduls |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1250005B (cs) * | 1961-02-06 | 1967-09-14 | ||
| DE1514152A1 (de) * | 1964-12-16 | 1969-09-11 | Licentia Gmbh | Halbleiter-Gleichrichterzelle |
| GB1140677A (en) * | 1965-05-07 | 1969-01-22 | Ass Elect Ind | Improvements relating to semi-conductor devices |
| SE333197B (sv) * | 1966-12-27 | 1971-03-08 | Asea Ab | Halvledaranordning foer stora stroemstyrkor |
| US3449506A (en) * | 1967-05-11 | 1969-06-10 | Int Rectifier Corp | Aluminum rectifier base having copper insert |
| DE1944515A1 (de) * | 1969-09-02 | 1971-03-04 | Siemens Ag | Halbleiterbauelement mit Kunststoffuellung |
-
1974
- 1974-01-18 GB GB2391/74A patent/GB1489603A/en not_active Expired
- 1974-12-24 IN IN2846/CAL/74A patent/IN149708B/en unknown
- 1974-12-30 US US05/537,337 patent/US4007477A/en not_active Expired - Lifetime
- 1974-12-31 ES ES1974208825U patent/ES208825Y/es not_active Expired
-
1975
- 1975-01-06 FR FR7501186A patent/FR2258709B1/fr not_active Expired
- 1975-01-15 DE DE19752501337 patent/DE2501337A1/de not_active Ceased
- 1975-01-16 IT IT47704/75A patent/IT1026361B/it active
- 1975-01-17 AR AR257338A patent/AR201530A1/es active
Also Published As
| Publication number | Publication date |
|---|---|
| FR2258709A1 (cs) | 1975-08-18 |
| DE2501337A1 (de) | 1975-07-24 |
| AU7687474A (en) | 1976-06-24 |
| ES208825U (es) | 1976-04-01 |
| US4007477A (en) | 1977-02-08 |
| IT1026361B (it) | 1978-09-20 |
| GB1489603A (en) | 1977-10-26 |
| ES208825Y (es) | 1976-07-16 |
| FR2258709B1 (cs) | 1978-06-23 |
| AR201530A1 (es) | 1975-03-21 |