IL96010A - Automatic high speed optical inspection system - Google Patents

Automatic high speed optical inspection system

Info

Publication number
IL96010A
IL96010A IL96010A IL9601090A IL96010A IL 96010 A IL96010 A IL 96010A IL 96010 A IL96010 A IL 96010A IL 9601090 A IL9601090 A IL 9601090A IL 96010 A IL96010 A IL 96010A
Authority
IL
Israel
Prior art keywords
high speed
inspection system
optical inspection
speed optical
automatic high
Prior art date
Application number
IL96010A
Other languages
English (en)
Other versions
IL96010A0 (en
Original Assignee
Kla Instr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Instr Corp filed Critical Kla Instr Corp
Publication of IL96010A0 publication Critical patent/IL96010A0/xx
Publication of IL96010A publication Critical patent/IL96010A/xx

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/309—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of printed or hybrid circuits or circuit substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
    • G01N21/8901—Optical details; Scanning details
    • G01N2021/8905—Directional selective optics, e.g. slits, spatial filters
    • G01N2021/8907—Cylindrical optics
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
    • G01N21/8901—Optical details; Scanning details
    • G01N2021/8908—Strip illuminator, e.g. light tube
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G01N2021/95615—Inspecting patterns on the surface of objects using a comparative method with stored comparision signal
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/061—Sources
    • G01N2201/06126—Large diffuse sources

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • General Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)
IL96010A 1989-10-31 1990-10-15 Automatic high speed optical inspection system IL96010A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/429,859 US5131755A (en) 1988-02-19 1989-10-31 Automatic high speed optical inspection system

Publications (2)

Publication Number Publication Date
IL96010A0 IL96010A0 (en) 1991-07-18
IL96010A true IL96010A (en) 1993-06-10

Family

ID=23705015

Family Applications (1)

Application Number Title Priority Date Filing Date
IL96010A IL96010A (en) 1989-10-31 1990-10-15 Automatic high speed optical inspection system

Country Status (5)

Country Link
US (1) US5131755A (xx)
EP (1) EP0426166B1 (xx)
JP (1) JPH03160348A (xx)
DE (1) DE69028274T2 (xx)
IL (1) IL96010A (xx)

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DE4434474C2 (de) * 1994-09-27 2000-06-15 Basler Ag Verfahren und Vorrichtung zur vollständigen optischen Qualitätskontrolle von Gegenständen
DE4434473A1 (de) * 1994-09-27 1996-03-28 Basler Gmbh Verfahren und Vorrichtung zur Qualitätskontrolle von Gegenständen mit polarisiertem Licht
KR960015001A (ko) * 1994-10-07 1996-05-22 가나이 쓰토무 반도체 기판의 제조방법과 피검사체상의 패턴결함을 검사하기 위한 방법 및 장치
JP3570815B2 (ja) * 1996-04-26 2004-09-29 松下電器産業株式会社 部品実装機用画像撮像装置
TW461008B (en) * 1997-01-13 2001-10-21 Schlumberger Technologies Inc Method and apparatus for detecting defects in wafers
EP0930498A3 (en) 1997-12-26 1999-11-17 Nidek Co., Ltd. Inspection apparatus and method for detecting defects
WO1999041621A2 (en) * 1998-02-13 1999-08-19 Scientific Generics Limited Circuit board assembly inspection
US6137570A (en) * 1998-06-30 2000-10-24 Kla-Tencor Corporation System and method for analyzing topological features on a surface
US6324298B1 (en) * 1998-07-15 2001-11-27 August Technology Corp. Automated wafer defect inspection system and a process of performing such inspection
US6476913B1 (en) * 1998-11-30 2002-11-05 Hitachi, Ltd. Inspection method, apparatus and system for circuit pattern
FR2786499B1 (fr) * 1998-11-30 2002-02-08 Intelligence Artificielle Appl Appareil de lecture automatique d'un antibiogramme a contraste ameliore
JP2000249661A (ja) * 1999-03-01 2000-09-14 Topcon Corp 光学測定装置
US6616332B1 (en) 1999-11-18 2003-09-09 Sensarray Corporation Optical techniques for measuring parameters such as temperature across a surface
EP1101438B1 (en) * 1999-11-18 2006-10-18 Fuji Photo Film Co., Ltd. Method and apparatus for acquiring fluorescence images
US6407810B1 (en) * 2000-03-10 2002-06-18 Robotic Vision Systems, Inc. Imaging system
JP2001343336A (ja) * 2000-05-31 2001-12-14 Nidek Co Ltd 欠陥検査方法及び欠陥検査装置
US6760471B1 (en) 2000-06-23 2004-07-06 Teradyne, Inc. Compensation system and related techniques for use in a printed circuit board inspection system
IL149587A (en) * 2001-05-11 2005-11-20 Orbotech Ltd Optical inspection system employing a staring array scanner
CN1287587C (zh) * 2001-05-15 2006-11-29 株式会社荏原制作所 Tdi检测装置、应用该装置的电子束设备以及应用该电子束设备的半导体器件制造方法
US7009163B2 (en) * 2001-06-22 2006-03-07 Orbotech Ltd. High-sensitivity optical scanning using memory integration
JP2003016463A (ja) * 2001-07-05 2003-01-17 Toshiba Corp 図形の輪郭の抽出方法、パターン検査方法、パターン検査装置、プログラムおよびこれを格納したコンピュータ読み取り可能な記録媒体
GB2384852A (en) * 2001-09-03 2003-08-06 Millennium Venture Holdings Lt Workpiece inspection apparatus
DE10146583A1 (de) * 2001-09-21 2003-04-17 Siemens Ag Vorrichtung und Verfahren zum optischen Abtasten einer Substratscheibe
US6834855B2 (en) * 2001-10-09 2004-12-28 Edward J. Mancuso Dice scanner
US7126681B1 (en) * 2002-04-23 2006-10-24 Kla-Tencor Technologies Corporation Closed region defect detection system
US7009695B2 (en) * 2003-04-01 2006-03-07 Applied Materials, Inc. Full frame thermal pump probe technique for detecting subsurface defects
KR100598096B1 (ko) * 2003-12-01 2006-07-07 삼성전자주식회사 패턴 검사 장치 및 검사 방법
DE102005031647A1 (de) * 2005-07-06 2007-01-11 Chromasens Gmbh Beleuchtungsvorrichtung zur Dunkelfeldbeleuchtung für eine optische Testvorrichtung und Verfahren zum optischen Abtasten eines Objektes
DE502005008676D1 (de) 2005-07-13 2010-01-21 Audi Ag Verfahren und Vorrichtung zur optischen Prüfung von Carbon-Keramik-Brems- und Kupplungskomponenten
EP3543357A1 (en) 2007-05-08 2019-09-25 Trustees of Boston University Chemical functionalization of solid-state nanopores and nanopore arrays and applications thereof
US20090153814A1 (en) * 2007-12-12 2009-06-18 Langrel Charles B Self-cleaning scan head assembly
WO2010100644A1 (en) * 2009-03-04 2010-09-10 Elie Meimoun Wavefront analysis inspection apparatus and method
WO2011040996A1 (en) 2009-09-30 2011-04-07 Quantapore, Inc. Ultrafast sequencing of biological polymers using a labeled nanopore
US20110090489A1 (en) * 2009-10-21 2011-04-21 Robert Bishop Method and Apparatus for Detecting Small Reflectivity Variations in Electronic Parts at High Speed
US8964088B2 (en) 2011-09-28 2015-02-24 Semiconductor Components Industries, Llc Time-delay-and-integrate image sensors having variable intergration times
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Also Published As

Publication number Publication date
US5131755A (en) 1992-07-21
EP0426166A3 (en) 1992-01-08
DE69028274D1 (de) 1996-10-02
IL96010A0 (en) 1991-07-18
DE69028274T2 (de) 1997-04-17
EP0426166A2 (en) 1991-05-08
JPH03160348A (ja) 1991-07-10
EP0426166B1 (en) 1996-08-28

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Legal Events

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NP Permission for amending the patent specification granted (section 66, patents law 1967)