IL76592A - Method for electrodeposition of at least two metals from a single solution - Google Patents

Method for electrodeposition of at least two metals from a single solution

Info

Publication number
IL76592A
IL76592A IL76592A IL7659285A IL76592A IL 76592 A IL76592 A IL 76592A IL 76592 A IL76592 A IL 76592A IL 7659285 A IL7659285 A IL 7659285A IL 76592 A IL76592 A IL 76592A
Authority
IL
Israel
Prior art keywords
metals
nickel
copper
electrodeposition
range
Prior art date
Application number
IL76592A
Other languages
English (en)
Other versions
IL76592A0 (en
Inventor
Joseph Yahalom
Ori Zadok
Original Assignee
Technion Res & Dev Foundation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Technion Res & Dev Foundation filed Critical Technion Res & Dev Foundation
Priority to IL76592A priority Critical patent/IL76592A/xx
Priority to US06/815,860 priority patent/US4652348A/en
Publication of IL76592A0 publication Critical patent/IL76592A0/xx
Priority to DE8686114677T priority patent/DE3687755T2/de
Priority to AT86114677T priority patent/ATE85656T1/de
Priority to EP86114677A priority patent/EP0267972B1/de
Publication of IL76592A publication Critical patent/IL76592A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S204/00—Chemistry: electrical and wave energy
    • Y10S204/09—Wave forms

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Hard Magnetic Materials (AREA)
  • Manufacture And Refinement Of Metals (AREA)
IL76592A 1985-10-06 1985-10-06 Method for electrodeposition of at least two metals from a single solution IL76592A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
IL76592A IL76592A (en) 1985-10-06 1985-10-06 Method for electrodeposition of at least two metals from a single solution
US06/815,860 US4652348A (en) 1985-10-06 1986-01-03 Method for the production of alloys possessing high elastic modulus and improved magnetic properties by electrodeposition
DE8686114677T DE3687755T2 (de) 1985-10-06 1986-10-22 Verfahren zum elektroplattieren einer geordneten legierung.
AT86114677T ATE85656T1 (de) 1985-10-06 1986-10-22 Verfahren zum elektroplattieren einer geordneten legierung.
EP86114677A EP0267972B1 (de) 1985-10-06 1986-10-22 Verfahren zum Elektroplattieren einer geordneten Legierung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IL76592A IL76592A (en) 1985-10-06 1985-10-06 Method for electrodeposition of at least two metals from a single solution

Publications (2)

Publication Number Publication Date
IL76592A0 IL76592A0 (en) 1986-02-28
IL76592A true IL76592A (en) 1989-03-31

Family

ID=11056283

Family Applications (1)

Application Number Title Priority Date Filing Date
IL76592A IL76592A (en) 1985-10-06 1985-10-06 Method for electrodeposition of at least two metals from a single solution

Country Status (5)

Country Link
US (1) US4652348A (de)
EP (1) EP0267972B1 (de)
AT (1) ATE85656T1 (de)
DE (1) DE3687755T2 (de)
IL (1) IL76592A (de)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5158653A (en) * 1988-09-26 1992-10-27 Lashmore David S Method for production of predetermined concentration graded alloys
US5268235A (en) * 1988-09-26 1993-12-07 The United States Of America As Represented By The Secretary Of Commerce Predetermined concentration graded alloys
BR8805772A (pt) * 1988-11-01 1990-06-12 Metal Leve Sa Processo de formacao de camada de deslizamento de mancal
JP2544845B2 (ja) * 1990-08-23 1996-10-16 インターナショナル・ビジネス・マシーンズ・コーポレイション 磁性薄膜、ラミネ―ト、磁気記録ヘッドおよび磁気遮蔽体ならびにラミネ―トの製造方法
CA2033107C (en) * 1990-12-24 2001-06-12 Robert Edward Burrell Actively sterile surfaces
DE4394869C2 (de) * 1992-09-25 1998-07-30 Nippon Piston Ring Co Ltd Verfahren zur Herstellung eines magnetischen Materials in Form eines Mehrschichtfilms, durch Legierungselektroplattieren
US6365220B1 (en) 1997-11-03 2002-04-02 Nucryst Pharmaceuticals Corp. Process for production of actively sterile surfaces
SE9903531D0 (sv) * 1999-09-30 1999-09-30 Res Inst Acreo Ab Förfarande för elektroavsättning av metalliska flerskikt
US6547946B2 (en) * 2000-04-10 2003-04-15 The Regents Of The University Of California Processing a printed wiring board by single bath electrodeposition
US6547944B2 (en) * 2000-12-08 2003-04-15 Delphi Technologies, Inc. Commercial plating of nanolaminates
US6599411B2 (en) 2001-04-20 2003-07-29 Hitachi Global Storage Technologies Netherlands, B.V. Method of electroplating a nickel-iron alloy film with a graduated composition
US7465494B2 (en) * 2002-04-29 2008-12-16 The Trustees Of Boston College Density controlled carbon nanotube array electrodes
US6902827B2 (en) * 2002-08-15 2005-06-07 Sandia National Laboratories Process for the electrodeposition of low stress nickel-manganese alloys
DE10259362A1 (de) * 2002-12-18 2004-07-08 Siemens Ag Verfahren zum Abscheiden einer Legierung auf ein Substrat
JP2005146405A (ja) * 2003-11-14 2005-06-09 Toru Yamazaki 電析積層合金薄板とその製造方法
US7425255B2 (en) * 2005-06-07 2008-09-16 Massachusetts Institute Of Technology Method for producing alloy deposits and controlling the nanostructure thereof using negative current pulsing electro-deposition
JP5301993B2 (ja) 2005-08-12 2013-09-25 モジュメタル エルエルシー 組成変調複合材料及びその形成方法
US20100096850A1 (en) * 2006-10-31 2010-04-22 Massachusetts Institute Of Technology Nanostructured alloy coated threaded metal surfaces and methods of producing same
US20080226976A1 (en) 2006-11-01 2008-09-18 Eveready Battery Company, Inc. Alkaline Electrochemical Cell with Reduced Gassing
KR100848689B1 (ko) * 2006-11-01 2008-07-28 고려대학교 산학협력단 다층 나노선 및 이의 형성방법
KR101265909B1 (ko) 2006-11-01 2013-05-22 에버레디 배터리 컴퍼니, 인크. 가스 발생이 감소되고 변색이 감소된 알칼리 전기화학 전지
US7584533B2 (en) * 2007-10-10 2009-09-08 National Semiconductor Corporation Method of fabricating an inductor structure on an integrated circuit structure
US9758891B2 (en) * 2008-07-07 2017-09-12 Modumetal, Inc. Low stress property modulated materials and methods of their preparation
WO2010144509A2 (en) 2009-06-08 2010-12-16 Modumetal Llc Electrodeposited, nanolaminate coatings and claddings for corrosion protection
US10030312B2 (en) * 2009-10-14 2018-07-24 Massachusetts Institute Of Technology Electrodeposited alloys and methods of making same using power pulses
WO2012012789A1 (en) 2010-07-22 2012-01-26 Modumetal Llc Material and process for electrochemical deposition of nanolaminated brass alloys
US20130186765A1 (en) * 2012-01-23 2013-07-25 Seagate Technology Llc Electrodeposition methods
WO2014145588A1 (en) 2013-03-15 2014-09-18 Modumetal, Inc. Nickel chromium nanolaminate coating having high hardness
CN110273167A (zh) 2013-03-15 2019-09-24 莫杜美拓有限公司 通过添加制造工艺制备的制品的电沉积的组合物和纳米层压合金
CN105143521B (zh) 2013-03-15 2020-07-10 莫杜美拓有限公司 用于连续施加纳米叠层金属涂层的方法和装置
EA032264B1 (ru) 2013-03-15 2019-05-31 Модьюметл, Инк. Способ нанесения покрытия на изделие, изделие, полученное вышеуказанным способом, и труба
BR112017005534A2 (pt) 2014-09-18 2017-12-05 Modumetal Inc métodos de preparação de artigos por processos de eletrodeposição e fabricação aditiva
EA201790643A1 (ru) 2014-09-18 2017-08-31 Модьюметал, Инк. Способ и устройство для непрерывного нанесения нанослоистых металлических покрытий
CN106811778A (zh) * 2015-11-27 2017-06-09 中国科学院大连化学物理研究所 组分和厚度可控的钯铜合金膜的制备及钯铜合金膜和应用
EA201990655A1 (ru) 2016-09-08 2019-09-30 Модьюметал, Инк. Способы получения многослойных покрытий на заготовках и выполненные ими изделия
WO2018075156A1 (en) 2016-09-09 2018-04-26 Modumetal, Inc. Manufacturing of molds by deposition of material layers on a workpiece, molds and articles obtained by said process
AR109648A1 (es) 2016-09-14 2019-01-09 Modumetal Inc Sistema confiable, de alta capacidad, para la generación de campos eléctricos complejos, y método para producir recubrimientos con los mismos
US12076965B2 (en) 2016-11-02 2024-09-03 Modumetal, Inc. Topology optimized high interface packing structures
EP3601641B1 (de) 2017-03-24 2024-11-06 Modumetal, Inc. Hubkolben mit galvanischen beschichtungen und systeme und verfahren zur produktion derselben
EP3612669A1 (de) 2017-04-21 2020-02-26 Modumetal, Inc. Rohrförmige artikel mit galvanischen beschichtungen und systeme und verfahren zur herstellung derselben
EP3784823A1 (de) 2018-04-27 2021-03-03 Modumetal, Inc. Vorrichtungen, systeme und verfahren zur herstellung einer vielzahl von gegenständen mit nanolaminierten beschichtungen mittels rotation

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1438563A (fr) * 1965-04-02 1966-05-13 Bull General Electric Perfectionnements aux lames ou couches ferromagnétiques couplées
US3480522A (en) * 1966-08-18 1969-11-25 Ibm Method of making magnetic thin film device
GB1210270A (en) * 1968-03-28 1970-10-28 Standard Telephones Cables Ltd Method of electroplating two-layer films
US3833481A (en) * 1972-12-18 1974-09-03 Buckbel Mears Co Electroforming nickel copper alloys
JPS5713637B2 (de) * 1973-09-04 1982-03-18

Also Published As

Publication number Publication date
DE3687755T2 (de) 1993-07-01
ATE85656T1 (de) 1993-02-15
DE3687755D1 (de) 1993-03-25
US4652348A (en) 1987-03-24
EP0267972A1 (de) 1988-05-25
EP0267972B1 (de) 1993-02-10
IL76592A0 (en) 1986-02-28

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