IL42775A - Method of improving the bonding capability of polymer surfaces - Google Patents
Method of improving the bonding capability of polymer surfacesInfo
- Publication number
- IL42775A IL42775A IL42775A IL4277573A IL42775A IL 42775 A IL42775 A IL 42775A IL 42775 A IL42775 A IL 42775A IL 4277573 A IL4277573 A IL 4277573A IL 42775 A IL42775 A IL 42775A
- Authority
- IL
- Israel
- Prior art keywords
- substrate
- solution
- aqueous
- improvement
- supplemental
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims 8
- 229920000642 polymer Polymers 0.000 title 1
- 239000000758 substrate Substances 0.000 claims 30
- 239000000243 solution Substances 0.000 claims 16
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims 14
- 239000011888 foil Substances 0.000 claims 12
- 229910052751 metal Inorganic materials 0.000 claims 12
- 239000002184 metal Substances 0.000 claims 12
- 239000004033 plastic Substances 0.000 claims 11
- 230000000153 supplemental effect Effects 0.000 claims 9
- 238000007772 electroless plating Methods 0.000 claims 8
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims 6
- 239000007864 aqueous solution Substances 0.000 claims 6
- 239000000126 substance Substances 0.000 claims 6
- 229910052782 aluminium Inorganic materials 0.000 claims 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 5
- 239000011347 resin Substances 0.000 claims 5
- 229920005989 resin Polymers 0.000 claims 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims 4
- 239000011248 coating agent Substances 0.000 claims 4
- 238000000576 coating method Methods 0.000 claims 4
- 229910019142 PO4 Inorganic materials 0.000 claims 3
- XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical compound [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 claims 3
- 235000011180 diphosphates Nutrition 0.000 claims 3
- 150000004706 metal oxides Chemical class 0.000 claims 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims 3
- 239000010452 phosphate Substances 0.000 claims 3
- 238000007747 plating Methods 0.000 claims 3
- 229940048084 pyrophosphate Drugs 0.000 claims 3
- 238000012876 topography Methods 0.000 claims 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical group C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims 2
- 239000002253 acid Substances 0.000 claims 2
- 150000008044 alkali metal hydroxides Chemical class 0.000 claims 2
- 239000003518 caustics Substances 0.000 claims 2
- 238000007654 immersion Methods 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 229910052700 potassium Inorganic materials 0.000 claims 2
- 239000011591 potassium Substances 0.000 claims 2
- 229910052708 sodium Inorganic materials 0.000 claims 2
- 239000011734 sodium Substances 0.000 claims 2
- VKFFEYLSKIYTSJ-UHFFFAOYSA-N tetraazanium;phosphonato phosphate Chemical class [NH4+].[NH4+].[NH4+].[NH4+].[O-]P([O-])(=O)OP([O-])([O-])=O VKFFEYLSKIYTSJ-UHFFFAOYSA-N 0.000 claims 2
- 229910021654 trace metal Inorganic materials 0.000 claims 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 claims 1
- 230000001464 adherent effect Effects 0.000 claims 1
- 229910052783 alkali metal Inorganic materials 0.000 claims 1
- 150000001340 alkali metals Chemical class 0.000 claims 1
- 239000002585 base Substances 0.000 claims 1
- 238000005530 etching Methods 0.000 claims 1
- 229910044991 metal oxide Inorganic materials 0.000 claims 1
- 238000001000 micrograph Methods 0.000 claims 1
- 230000001502 supplementing effect Effects 0.000 claims 1
- 239000004634 thermosetting polymer Substances 0.000 claims 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/10—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by other chemical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2201/00—Polymeric substrate or laminate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2350/00—Pretreatment of the substrate
- B05D2350/30—Change of the surface
- B05D2350/33—Roughening
- B05D2350/35—Roughening by chemical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/24—Aluminium
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1152—Replicating the surface structure of a sacrificial layer, e.g. for roughening
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemically Coating (AREA)
- Laminated Bodies (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- ing And Chemical Polishing (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US291717A US3864147A (en) | 1972-09-25 | 1972-09-25 | Method of improving the bonding capability of polymer surfaces for subsequently applied coatings, and products thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IL42775A0 IL42775A0 (en) | 1973-10-25 |
| IL42775A true IL42775A (en) | 1976-06-30 |
Family
ID=23121530
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IL42775A IL42775A (en) | 1972-09-25 | 1973-07-18 | Method of improving the bonding capability of polymer surfaces |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US3864147A (enEXAMPLES) |
| JP (2) | JPS5315744B2 (enEXAMPLES) |
| BE (1) | BE804975A (enEXAMPLES) |
| CH (1) | CH603728A5 (enEXAMPLES) |
| DE (1) | DE2347884A1 (enEXAMPLES) |
| ES (1) | ES419056A1 (enEXAMPLES) |
| FR (1) | FR2208769B1 (enEXAMPLES) |
| GB (1) | GB1414097A (enEXAMPLES) |
| IL (1) | IL42775A (enEXAMPLES) |
| IT (1) | IT996188B (enEXAMPLES) |
| NL (1) | NL7313213A (enEXAMPLES) |
| SE (1) | SE404035B (enEXAMPLES) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3864147A (en) * | 1972-09-25 | 1975-02-04 | Macdermid Inc | Method of improving the bonding capability of polymer surfaces for subsequently applied coatings, and products thereof |
| JPS5418875A (en) * | 1977-07-12 | 1979-02-13 | Nippon Denki Kagaku Co Ltd | Pretreatment for nonnelectrolytic copper plating on epoxyresin substrate |
| JPS58200200A (ja) * | 1982-05-18 | 1983-11-21 | 富士写真フイルム株式会社 | 放射線像変換パネルおよびその製造法 |
| DE3371592D1 (en) * | 1983-06-01 | 1987-06-19 | Ibm Deutschland | Production method of printed circuits with one conductive layer |
| JPS63103075A (ja) * | 1986-10-14 | 1988-05-07 | エドワ−ド アドラ− | マイクロ樹枝状体配列を介して結合された金属層で被覆可能とされる表面を有する樹脂製品並びに該金属層被覆樹脂製品 |
| US5268203A (en) * | 1989-10-30 | 1993-12-07 | H. B. Fuller Company | Method of introducing an integral thermo-bonded layer into the surface of a thermoformed substrate |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3035944A (en) * | 1960-08-05 | 1962-05-22 | Ben C Sher | Electrical component preparation utilizing a pre-acid treatment followed by chemical metal deposition |
| US3331710A (en) * | 1963-08-23 | 1967-07-18 | Hooker Chemical Corp | Method for coating aluminum |
| JPS4811459B1 (enEXAMPLES) * | 1967-12-13 | 1973-04-13 | ||
| US3666549A (en) * | 1969-05-09 | 1972-05-30 | Macdermid Inc | Method of making additive printed circuit boards and product thereof |
| US3655467A (en) * | 1969-05-14 | 1972-04-11 | Aluminum Co Of America | Etching of aluminum base alloys |
| GB1357631A (en) * | 1971-01-21 | 1974-06-26 | Ici Ltd | Polyurethane foams |
| US3864147A (en) * | 1972-09-25 | 1975-02-04 | Macdermid Inc | Method of improving the bonding capability of polymer surfaces for subsequently applied coatings, and products thereof |
-
1972
- 1972-09-25 US US291717A patent/US3864147A/en not_active Expired - Lifetime
-
1973
- 1973-07-18 IL IL42775A patent/IL42775A/en unknown
- 1973-08-15 GB GB3861273A patent/GB1414097A/en not_active Expired
- 1973-08-31 CH CH1251773A patent/CH603728A5/xx not_active IP Right Cessation
- 1973-09-14 JP JP10332873A patent/JPS5315744B2/ja not_active Expired
- 1973-09-14 SE SE7312565A patent/SE404035B/xx unknown
- 1973-09-18 BE BE135753A patent/BE804975A/xx unknown
- 1973-09-20 DE DE19732347884 patent/DE2347884A1/de not_active Ceased
- 1973-09-20 IT IT52639/73A patent/IT996188B/it active
- 1973-09-21 FR FR7333935A patent/FR2208769B1/fr not_active Expired
- 1973-09-25 ES ES419056A patent/ES419056A1/es not_active Expired
- 1973-09-25 NL NL7313213A patent/NL7313213A/xx not_active Application Discontinuation
-
1977
- 1977-11-11 JP JP13557077A patent/JPS53121077A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| AU5861673A (en) | 1975-01-30 |
| ES419056A1 (es) | 1976-07-01 |
| BE804975A (fr) | 1974-01-16 |
| IT996188B (it) | 1975-12-10 |
| IL42775A0 (en) | 1973-10-25 |
| JPS4971058A (enEXAMPLES) | 1974-07-09 |
| GB1414097A (en) | 1975-11-19 |
| DE2347884A1 (de) | 1974-04-11 |
| JPS5315744B2 (enEXAMPLES) | 1978-05-26 |
| FR2208769B1 (enEXAMPLES) | 1980-08-08 |
| FR2208769A1 (enEXAMPLES) | 1974-06-28 |
| CH603728A5 (enEXAMPLES) | 1978-08-31 |
| SE404035B (sv) | 1978-09-18 |
| NL7313213A (enEXAMPLES) | 1974-03-27 |
| US3864147A (en) | 1975-02-04 |
| JPS53121077A (en) | 1978-10-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3982045A (en) | Method of manufacture of additive printed circuitboards using permanent resist mask | |
| CA1229266A (en) | Process for preparing a substrate for subsequent electroless deposition of a metal | |
| US3654099A (en) | Cathodic activation of stainless steel | |
| US3666549A (en) | Method of making additive printed circuit boards and product thereof | |
| US3666529A (en) | Method of conditioning aluminous surfaces for the reception of electroless nickel plating | |
| EP0053279B1 (en) | Method of preparing a printed circuit | |
| JPH0713304B2 (ja) | 銅の表面処理法 | |
| US3442683A (en) | Production of metallic coatings upon the surfaces of other materials | |
| US4144118A (en) | Method of providing printed circuits | |
| US5066366A (en) | Method for making foil | |
| US3736170A (en) | Process for improved adhesion of electroless copper to a polyimide surface | |
| US4233344A (en) | Method of improving the adhesion of electroless metal deposits employing colloidal copper activator | |
| IL42775A (en) | Method of improving the bonding capability of polymer surfaces | |
| US3167491A (en) | Polyfluorinated ethylene polymermetal article and method | |
| SE7711108L (sv) | Forfarande for elektrolytisk paforing av metaller pa zirkoniummaterial i | |
| US4035227A (en) | Method for treating plastic substrates prior to plating | |
| US3518168A (en) | Electrolytic process of preparing a copper foil for a plastic coat | |
| JPS63297573A (ja) | プラスチツクの付着堅固なメタライジング法 | |
| USRE28042E (en) | Method of making additive printed circuit boards and product thereof | |
| US4131698A (en) | Pretreatment of polyvinyl chloride plastics for electroless deposition | |
| US4323632A (en) | Metal composites and laminates formed therefrom | |
| US3983267A (en) | Treatment of the surfaces of polyphenylene oxide materials | |
| US3667991A (en) | Processes for nickel plating metals | |
| JP2002030481A (ja) | 銅若しくは銅合金箔及びその製造方法 | |
| US4457951A (en) | Etch solution and method |