IL309944A - ניטור תהליכים במעלה הזרם עבור תאי שיקוע וחריטה - Google Patents

ניטור תהליכים במעלה הזרם עבור תאי שיקוע וחריטה

Info

Publication number
IL309944A
IL309944A IL309944A IL30994424A IL309944A IL 309944 A IL309944 A IL 309944A IL 309944 A IL309944 A IL 309944A IL 30994424 A IL30994424 A IL 30994424A IL 309944 A IL309944 A IL 309944A
Authority
IL
Israel
Prior art keywords
deposition
process monitoring
upstream process
etch chambers
etch
Prior art date
Application number
IL309944A
Other languages
English (en)
Inventor
Matan Lapidot
Shay Yaari
Original Assignee
Inficon Inc
Matan Lapidot
Shay Yaari
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inficon Inc, Matan Lapidot, Shay Yaari filed Critical Inficon Inc
Publication of IL309944A publication Critical patent/IL309944A/he

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45512—Premixing before introduction in the reaction chamber
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/52—Controlling or regulating the coating process
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/238—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
IL309944A 2021-07-07 2022-07-07 ניטור תהליכים במעלה הזרם עבור תאי שיקוע וחריטה IL309944A (he)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202163219032P 2021-07-07 2021-07-07
PCT/US2022/036277 WO2023283282A1 (en) 2021-07-07 2022-07-07 Upstream process monitoring for deposition and etch chambers

Publications (1)

Publication Number Publication Date
IL309944A true IL309944A (he) 2024-03-01

Family

ID=84802012

Family Applications (1)

Application Number Title Priority Date Filing Date
IL309944A IL309944A (he) 2021-07-07 2022-07-07 ניטור תהליכים במעלה הזרם עבור תאי שיקוע וחריטה

Country Status (7)

Country Link
US (1) US20240312812A1 (he)
EP (1) EP4367713A4 (he)
JP (1) JP2024537559A (he)
CN (1) CN118318290A (he)
IL (1) IL309944A (he)
TW (1) TW202318493A (he)
WO (1) WO2023283282A1 (he)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN121096894A (zh) * 2025-08-11 2025-12-09 北京集成电路装备创新中心有限公司 半导体工艺腔室、水平度和/或对中性的检测方法、半导体加工设备和存储介质

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3905678B2 (ja) * 2000-02-28 2007-04-18 株式会社堀場製作所 薄膜堆積方法とその装置および薄膜堆積方法に用いるｆｔｉｒガス分析計並びに薄膜堆積方法に用いる混合ガス供給装置
US20110265951A1 (en) * 2010-04-30 2011-11-03 Applied Materials, Inc. Twin chamber processing system
US20120058630A1 (en) * 2010-09-08 2012-03-08 Veeco Instruments Inc. Linear Cluster Deposition System
US9182378B2 (en) * 2013-03-15 2015-11-10 Inficon, Inc. High capacity monitor crystal exchanger utilizing an organized 3-D storage structure
US10083883B2 (en) * 2016-06-20 2018-09-25 Applied Materials, Inc. Wafer processing equipment having capacitive micro sensors
US9725302B1 (en) * 2016-08-25 2017-08-08 Applied Materials, Inc. Wafer processing equipment having exposable sensing layers
KR20200045486A (ko) * 2017-08-25 2020-05-04 인피콘, 인크. 제조 공정 모니터링용 수정 마이크로밸런스 센서 및 관련 방법
CN111164743B (zh) * 2017-09-26 2025-06-17 朗姆研究公司 用于脉宽调制的剂量控制的系统及方法
JP7119747B2 (ja) * 2018-08-10 2022-08-17 東京エレクトロン株式会社 ガス処理装置及びガス処理方法
US12266552B2 (en) * 2020-03-03 2025-04-01 Inficon, Inc. System and method for monitoring semiconductor processes

Also Published As

Publication number Publication date
JP2024537559A (ja) 2024-10-11
EP4367713A4 (en) 2026-02-18
US20240312812A1 (en) 2024-09-19
EP4367713A1 (en) 2024-05-15
WO2023283282A1 (en) 2023-01-12
CN118318290A (zh) 2024-07-09
TW202318493A (zh) 2023-05-01

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