IL266272B1 - Substrate loading system - Google Patents

Substrate loading system

Info

Publication number
IL266272B1
IL266272B1 IL266272A IL26627219A IL266272B1 IL 266272 B1 IL266272 B1 IL 266272B1 IL 266272 A IL266272 A IL 266272A IL 26627219 A IL26627219 A IL 26627219A IL 266272 B1 IL266272 B1 IL 266272B1
Authority
IL
Israel
Prior art keywords
loading system
substrate loading
substrate
loading
Prior art date
Application number
IL266272A
Other languages
Hebrew (he)
Other versions
IL266272B2 (en
IL266272A (en
Original Assignee
Molecular Imprints Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molecular Imprints Inc filed Critical Molecular Imprints Inc
Publication of IL266272A publication Critical patent/IL266272A/en
Publication of IL266272B1 publication Critical patent/IL266272B1/en
Publication of IL266272B2 publication Critical patent/IL266272B2/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • H01L21/6779—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks the workpieces being stored in a carrier, involving loading and unloading
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
IL266272A 2016-11-03 2019-04-28 Substrate loading system IL266272B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201662416916P 2016-11-03 2016-11-03
PCT/US2017/053706 WO2018084965A1 (en) 2016-11-03 2017-09-27 Substrate loading system

Publications (3)

Publication Number Publication Date
IL266272A IL266272A (en) 2019-06-30
IL266272B1 true IL266272B1 (en) 2023-03-01
IL266272B2 IL266272B2 (en) 2023-07-01

Family

ID=62021820

Family Applications (2)

Application Number Title Priority Date Filing Date
IL300011A IL300011B2 (en) 2016-11-03 2017-09-27 Substrate loading system
IL266272A IL266272B2 (en) 2016-11-03 2019-04-28 Substrate loading system

Family Applications Before (1)

Application Number Title Priority Date Filing Date
IL300011A IL300011B2 (en) 2016-11-03 2017-09-27 Substrate loading system

Country Status (10)

Country Link
US (2) US10475685B2 (en)
EP (2) EP3535781B1 (en)
JP (1) JP6824400B2 (en)
KR (1) KR102263614B1 (en)
CN (2) CN109923658B (en)
AU (1) AU2017353824B2 (en)
CA (1) CA3041069A1 (en)
IL (2) IL300011B2 (en)
TW (1) TWI731182B (en)
WO (1) WO2018084965A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2017353824B2 (en) 2016-11-03 2021-04-22 Molecular Imprints, Inc. Substrate loading system
JP7418241B2 (en) * 2020-02-27 2024-01-19 東京エレクトロン株式会社 Positioning device, processing system and positioning method
US20220035245A1 (en) * 2020-07-31 2022-02-03 Applied Materials, Inc. Nano imprint stamps

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5510723A (en) 1994-03-01 1996-04-23 Micron Custom Manufacturing, Inc. Usa Diced semiconductor device handler
DE19853092B4 (en) * 1998-11-18 2004-10-21 Leica Microsystems Lithography Gmbh Take-over and holding system for a substrate
JP4518712B2 (en) * 2001-08-13 2010-08-04 キヤノンアネルバ株式会社 Tray-type multi-chamber substrate processing equipment
US7179079B2 (en) * 2002-07-08 2007-02-20 Molecular Imprints, Inc. Conforming template for patterning liquids disposed on substrates
US7070405B2 (en) * 2002-08-01 2006-07-04 Molecular Imprints, Inc. Alignment systems for imprint lithography
CN100358117C (en) * 2002-12-02 2007-12-26 松下电器产业株式会社 Parts feeder
JP3890026B2 (en) * 2003-03-10 2007-03-07 東京エレクトロン株式会社 Liquid processing apparatus and liquid processing method
DE10343323A1 (en) * 2003-09-11 2005-04-07 Carl Zeiss Smt Ag Stamp lithography method and device and stamp for the stamp lithograph
US20050155554A1 (en) 2004-01-20 2005-07-21 Saito Toshiyuki M. Imprint embossing system
KR100972249B1 (en) * 2005-08-11 2010-07-26 어드밴스드 마이크로 패브리케이션 이큅먼트 인코퍼레이티드 아시아 Apparatus and method for loading and unloading semiconductor workpieces
US7736528B2 (en) * 2005-10-12 2010-06-15 Panasonic Corporation Plasma processing apparatus and plasma processing method
JP4361045B2 (en) * 2005-10-12 2009-11-11 パナソニック株式会社 Plasma processing apparatus and plasma processing method
US7670530B2 (en) * 2006-01-20 2010-03-02 Molecular Imprints, Inc. Patterning substrates employing multiple chucks
DE602006002955D1 (en) * 2006-03-08 2008-11-13 Erich Thallner Method for producing a component and apparatus for processing a substrate, and substrate carrier
JP2008251754A (en) 2007-03-29 2008-10-16 Nikon Corp Substrate transfer method and apparatus, and exposure method and device
NL1036859A1 (en) * 2008-04-29 2009-10-30 Asml Netherlands Bv Support structure, inspection apparatus, lithographic apparatus and methods for loading and unloading substrates.
JP5142818B2 (en) * 2008-05-20 2013-02-13 株式会社日立ハイテクノロジーズ Proximity exposure apparatus, method for adjusting chuck height of proximity exposure apparatus, and method for manufacturing display panel substrate
JP5088335B2 (en) 2009-02-04 2012-12-05 東京エレクトロン株式会社 Substrate transfer apparatus and substrate processing system
WO2010105967A2 (en) * 2009-03-18 2010-09-23 Oc Oerlikon Balzers Ag Vacuum treatment apparatus
US20120006489A1 (en) * 2009-03-26 2012-01-12 Shogo Okita Plasma processing apparatus and plasma processing method
US20110141448A1 (en) * 2009-11-27 2011-06-16 Nikon Corporation Substrate carrier device, substrate carrying method, substrate supporting member, substrate holding device, exposure apparatus, exposure method and device manufacturing method
JP5485806B2 (en) * 2010-06-16 2014-05-07 パスカルエンジニアリング株式会社 Mold positioning and fixing device
WO2012016744A1 (en) * 2010-08-05 2012-02-09 Asml Netherlands B.V. Imprint lithography
JP5550600B2 (en) * 2011-04-13 2014-07-16 パナソニック株式会社 Plasma processing apparatus and plasma processing method
CN103959453B (en) * 2011-11-25 2017-03-08 信越工程株式会社 Base board delivery device and substrate assembly line
KR101565535B1 (en) * 2013-12-06 2015-11-06 피에스케이 주식회사 Substrate treating apparatus and substrate treating method
JP6303592B2 (en) * 2014-02-25 2018-04-04 東京エレクトロン株式会社 Substrate processing equipment
KR101504880B1 (en) * 2014-11-14 2015-03-20 주식회사 기가레인 Unit for supporting substrate
US10248018B2 (en) * 2015-03-30 2019-04-02 Canon Kabushiki Kaisha Imprint apparatus and method of manufacturing article
CN115453818B (en) * 2016-07-29 2023-11-14 分子印记公司 Substrate loading in microlithography
AU2017353824B2 (en) 2016-11-03 2021-04-22 Molecular Imprints, Inc. Substrate loading system

Also Published As

Publication number Publication date
CA3041069A1 (en) 2018-05-11
US11195739B2 (en) 2021-12-07
IL300011B2 (en) 2024-03-01
EP3989269A1 (en) 2022-04-27
EP3535781B1 (en) 2022-01-05
WO2018084965A1 (en) 2018-05-11
JP2019536263A (en) 2019-12-12
CN115642115A (en) 2023-01-24
KR20190071811A (en) 2019-06-24
IL300011A (en) 2023-03-01
IL266272B2 (en) 2023-07-01
KR102263614B1 (en) 2021-06-09
AU2017353824B2 (en) 2021-04-22
JP6824400B2 (en) 2021-02-03
EP3535781A1 (en) 2019-09-11
CN109923658B (en) 2022-11-04
EP3535781A4 (en) 2020-07-29
TWI731182B (en) 2021-06-21
US20200098596A1 (en) 2020-03-26
US10475685B2 (en) 2019-11-12
CN109923658A (en) 2019-06-21
IL266272A (en) 2019-06-30
AU2017353824A1 (en) 2019-05-02
US20180122657A1 (en) 2018-05-03
TW201820513A (en) 2018-06-01
EP3989269B1 (en) 2023-09-27
IL300011B1 (en) 2023-11-01

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