IL251972B - Analyzing and utilizing landscapes - Google Patents
Analyzing and utilizing landscapesInfo
- Publication number
- IL251972B IL251972B IL251972A IL25197217A IL251972B IL 251972 B IL251972 B IL 251972B IL 251972 A IL251972 A IL 251972A IL 25197217 A IL25197217 A IL 25197217A IL 251972 B IL251972 B IL 251972B
- Authority
- IL
- Israel
- Prior art keywords
- landscapes
- analysis
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
- H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
- H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
- H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Testing Of Optical Devices Or Fibers (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462083891P | 2014-11-25 | 2014-11-25 | |
| US201562100384P | 2015-01-06 | 2015-01-06 | |
| PCT/US2015/062523 WO2016086056A1 (en) | 2014-11-25 | 2015-11-24 | Analyzing and utilizing landscapes |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IL251972A0 IL251972A0 (en) | 2017-06-29 |
| IL251972B true IL251972B (en) | 2022-03-01 |
Family
ID=56075006
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IL251972A IL251972B (en) | 2014-11-25 | 2017-04-27 | Analyzing and utilizing landscapes |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10831108B2 (https=) |
| JP (3) | JP6770958B2 (https=) |
| KR (1) | KR102269514B1 (https=) |
| CN (2) | CN112698551B (https=) |
| IL (1) | IL251972B (https=) |
| SG (1) | SG11201703585RA (https=) |
| TW (2) | TWI719804B (https=) |
| WO (1) | WO2016086056A1 (https=) |
Families Citing this family (74)
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| WO2016083076A1 (en) | 2014-11-26 | 2016-06-02 | Asml Netherlands B.V. | Metrology method, computer product and system |
| CN112859540B (zh) | 2015-05-19 | 2024-10-18 | 科磊股份有限公司 | 成像计量目标及方法 |
| US9995689B2 (en) * | 2015-05-22 | 2018-06-12 | Nanometrics Incorporated | Optical metrology using differential fitting |
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| KR102477933B1 (ko) | 2015-12-17 | 2022-12-15 | 에이에스엠엘 네델란즈 비.브이. | 메트롤로지 장치의 조정 또는 측정 타겟의 특성에 기초한 측정 |
| CN116936393B (zh) | 2016-02-24 | 2024-12-20 | 科磊股份有限公司 | 光学计量的准确度提升 |
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| CN109073992B (zh) | 2016-04-22 | 2021-09-28 | Asml荷兰有限公司 | 堆叠差异的确定和使用堆叠差异的校正 |
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| US9851300B1 (en) * | 2014-04-04 | 2017-12-26 | Kla-Tencor Corporation | Decreasing inaccuracy due to non-periodic effects on scatterometric signals |
| WO2016037003A1 (en) * | 2014-09-03 | 2016-03-10 | Kla-Tencor Corporation | Optimizing the utilization of metrology tools |
| WO2016123552A1 (en) * | 2015-01-30 | 2016-08-04 | Kla-Tencor Corporation | Device metrology targets and methods |
| US9903711B2 (en) * | 2015-04-06 | 2018-02-27 | KLA—Tencor Corporation | Feed forward of metrology data in a metrology system |
| KR102393740B1 (ko) * | 2015-12-08 | 2022-05-02 | 케이엘에이 코포레이션 | 편광 타겟 및 편광 조명을 사용한 회절 차수의 진폭 및 위상의 제어 |
-
2015
- 2015-11-24 CN CN202011580664.1A patent/CN112698551B/zh active Active
- 2015-11-24 WO PCT/US2015/062523 patent/WO2016086056A1/en not_active Ceased
- 2015-11-24 CN CN201580060081.7A patent/CN107078074B/zh active Active
- 2015-11-24 KR KR1020177017380A patent/KR102269514B1/ko not_active Expired - Fee Related
- 2015-11-24 JP JP2017528095A patent/JP6770958B2/ja active Active
- 2015-11-24 SG SG11201703585RA patent/SG11201703585RA/en unknown
- 2015-11-25 TW TW109101242A patent/TWI719804B/zh active
- 2015-11-25 TW TW104139220A patent/TWI711096B/zh active
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2016
- 2016-06-30 US US15/198,902 patent/US10831108B2/en active Active
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2017
- 2017-04-27 IL IL251972A patent/IL251972B/en unknown
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2020
- 2020-09-28 JP JP2020162494A patent/JP7023337B2/ja active Active
-
2022
- 2022-02-08 JP JP2022018205A patent/JP2022065040A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2016086056A1 (en) | 2016-06-02 |
| TW202018836A (zh) | 2020-05-16 |
| JP7023337B2 (ja) | 2022-02-21 |
| JP6770958B2 (ja) | 2020-10-21 |
| JP2022065040A (ja) | 2022-04-26 |
| JP2020201293A (ja) | 2020-12-17 |
| KR102269514B1 (ko) | 2021-06-25 |
| IL251972A0 (en) | 2017-06-29 |
| US20160313658A1 (en) | 2016-10-27 |
| KR20170088403A (ko) | 2017-08-01 |
| TWI719804B (zh) | 2021-02-21 |
| CN112698551A (zh) | 2021-04-23 |
| SG11201703585RA (en) | 2017-06-29 |
| JP2017537317A (ja) | 2017-12-14 |
| US10831108B2 (en) | 2020-11-10 |
| CN107078074A (zh) | 2017-08-18 |
| TW201633419A (zh) | 2016-09-16 |
| CN112698551B (zh) | 2024-04-23 |
| CN107078074B (zh) | 2021-05-25 |
| TWI711096B (zh) | 2020-11-21 |
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