IL145649A0 - Method and apparatus for real-time dynamic chemical analysis - Google Patents

Method and apparatus for real-time dynamic chemical analysis

Info

Publication number
IL145649A0
IL145649A0 IL14564901A IL14564901A IL145649A0 IL 145649 A0 IL145649 A0 IL 145649A0 IL 14564901 A IL14564901 A IL 14564901A IL 14564901 A IL14564901 A IL 14564901A IL 145649 A0 IL145649 A0 IL 145649A0
Authority
IL
Israel
Prior art keywords
real
chemical analysis
time dynamic
dynamic chemical
time
Prior art date
Application number
IL14564901A
Other languages
English (en)
Original Assignee
Nira Sciences Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nira Sciences Ltd filed Critical Nira Sciences Ltd
Priority to IL14564901A priority Critical patent/IL145649A0/xx
Publication of IL145649A0 publication Critical patent/IL145649A0/xx
Priority to JP2003531150A priority patent/JP2005504290A/ja
Priority to PCT/IL2002/000779 priority patent/WO2003027647A1/en
Priority to EP02772779A priority patent/EP1430288A4/en
Priority to US10/807,537 priority patent/US7351349B2/en
Priority to US12/069,189 priority patent/US20080190557A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
    • G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
    • G01N21/35—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light
    • G01N21/3577—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light for analysing liquids, e.g. polluted water
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
    • G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
    • G01N21/35—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light
    • G01N21/359—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light using near infrared light

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Weting (AREA)
IL14564901A 2001-09-25 2001-09-25 Method and apparatus for real-time dynamic chemical analysis IL145649A0 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
IL14564901A IL145649A0 (en) 2001-09-25 2001-09-25 Method and apparatus for real-time dynamic chemical analysis
JP2003531150A JP2005504290A (ja) 2001-09-25 2002-09-19 リアルタイムで動的に化学分析を行うための方法および装置
PCT/IL2002/000779 WO2003027647A1 (en) 2001-09-25 2002-09-19 Method and apparatus for real-time dynamic chemical analysis
EP02772779A EP1430288A4 (en) 2001-09-25 2002-09-19 METHOD AND DEVICE FOR REAL-TIME DYNAMIC CHEMICAL ANALYSIS
US10/807,537 US7351349B2 (en) 2001-09-25 2004-03-23 Method and apparatus for real-time dynamic chemical analysis
US12/069,189 US20080190557A1 (en) 2001-09-25 2008-02-07 Apparatus for real-time dynamic chemical analysis

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IL14564901A IL145649A0 (en) 2001-09-25 2001-09-25 Method and apparatus for real-time dynamic chemical analysis

Publications (1)

Publication Number Publication Date
IL145649A0 true IL145649A0 (en) 2002-06-30

Family

ID=11075813

Family Applications (1)

Application Number Title Priority Date Filing Date
IL14564901A IL145649A0 (en) 2001-09-25 2001-09-25 Method and apparatus for real-time dynamic chemical analysis

Country Status (5)

Country Link
US (2) US7351349B2 (xx)
EP (1) EP1430288A4 (xx)
JP (1) JP2005504290A (xx)
IL (1) IL145649A0 (xx)
WO (1) WO2003027647A1 (xx)

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TW200632719A (en) 2004-09-17 2006-09-16 Mks Instr Inc Multivariate control of semiconductor processes
US7405165B2 (en) * 2004-11-05 2008-07-29 Taiwan Semiconductor Manufacturing Co, Ltd Dual-tank etch method for oxide thickness control
FR2883602B1 (fr) * 2005-03-22 2010-04-16 Alain Lunati Procede d'optimisation des parametres de fonctionnement d'un moteur a combustion
US7809450B2 (en) * 2005-07-07 2010-10-05 Mks Instruments, Inc. Self-correcting multivariate analysis for use in monitoring dynamic parameters in process environments
US7313454B2 (en) * 2005-12-02 2007-12-25 Mks Instruments, Inc. Method and apparatus for classifying manufacturing outputs
DE102007017229A1 (de) * 2006-12-21 2008-06-26 Abb Ag Verfahren und Einrichtung zur Überwachung des Ätzprozesses in der Halbleiterherstellung
US7630786B2 (en) * 2007-03-07 2009-12-08 Mks Instruments, Inc. Manufacturing process end point detection
WO2008137544A1 (en) 2007-05-02 2008-11-13 Mks Instruments, Inc. Automated model building and model updating
US20090229995A1 (en) * 2008-03-14 2009-09-17 Eci Technology, Inc. Analysis of fluoride at low concentrations in acidic processing solutions
US8494798B2 (en) * 2008-09-02 2013-07-23 Mks Instruments, Inc. Automated model building and batch model building for a manufacturing process, process monitoring, and fault detection
US9069345B2 (en) * 2009-01-23 2015-06-30 Mks Instruments, Inc. Controlling a manufacturing process with a multivariate model
CN102791830A (zh) 2010-02-12 2012-11-21 睿纳有限责任公司 测定硝酸浓度的方法
JP5180263B2 (ja) * 2010-07-23 2013-04-10 倉敷紡績株式会社 基板処理装置
DE102010040869A1 (de) * 2010-09-16 2012-03-22 Robert Bosch Gmbh Vorrichtung zum Ätzen von Halbleiter-Wafern mit einer Inline-Prozesskontrolle
US8855804B2 (en) 2010-11-16 2014-10-07 Mks Instruments, Inc. Controlling a discrete-type manufacturing process with a multivariate model
JP5617065B2 (ja) * 2011-09-09 2014-11-05 東京エレクトロン株式会社 剥離方法、プログラム、コンピュータ記憶媒体及び剥離システム
US9541471B2 (en) 2012-04-06 2017-01-10 Mks Instruments, Inc. Multivariate prediction of a batch manufacturing process
US9429939B2 (en) 2012-04-06 2016-08-30 Mks Instruments, Inc. Multivariate monitoring of a batch manufacturing process
US20160047741A1 (en) * 2014-08-18 2016-02-18 Kyzen Corporation Method and apparatus for monitoring and controlling a cleaning process
US9677998B2 (en) 2014-12-18 2017-06-13 Ecolab Usa Inc. Control over etching molecule levels in etching compositions
US11340205B2 (en) 2019-01-24 2022-05-24 Hong Kong Applied Science And Technology Research Institute Co., Ltd. Systems and methods for determining concentrations of materials in solutions
KR20200133525A (ko) 2019-05-20 2020-11-30 삼성전자주식회사 생체 정보 추정 모델의 유효성 판단 장치 및 방법
CN112763436A (zh) * 2020-12-24 2021-05-07 中国原子能科学研究院 一种光谱测量系统
CN113438042B (zh) * 2021-05-10 2023-03-28 中国科学院新疆天文台 一种实时电磁环境监测系统及方法
DE102021114039A1 (de) * 2021-05-31 2022-12-01 MTU Aero Engines AG Verfahren zum Untersuchen einer Elektrolytlösung zur Bearbeitung eines Bauteilwerkstoffs eines Flugtriebwerks
CN113624704B (zh) * 2021-09-10 2022-02-15 江苏鑫华半导体材料科技有限公司 一种多晶硅清洗液的评估方法
CN117790300B (zh) * 2024-02-23 2024-04-30 深圳市常丰激光刀模有限公司 一种精细线路的动态蚀刻补偿方法

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US4060097A (en) 1975-09-17 1977-11-29 Oxford Keith E Automatic etching system
US4454001A (en) 1982-08-27 1984-06-12 At&T Bell Laboratories Interferometric method and apparatus for measuring etch rate and fabricating devices
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JPS63307334A (ja) * 1987-06-10 1988-12-15 Hitachi Ltd 比測光蛍光光度計
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Also Published As

Publication number Publication date
JP2005504290A (ja) 2005-02-10
US20050028932A1 (en) 2005-02-10
WO2003027647A1 (en) 2003-04-03
US20080190557A1 (en) 2008-08-14
US7351349B2 (en) 2008-04-01
WO2003027647A9 (en) 2004-04-08
EP1430288A4 (en) 2007-02-21
EP1430288A1 (en) 2004-06-23

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